KR101623220B1 - 접착성 캡슐화 조성물 및 그로 제조된 전자 소자 - Google Patents

접착성 캡슐화 조성물 및 그로 제조된 전자 소자 Download PDF

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KR101623220B1
KR101623220B1 KR1020107029736A KR20107029736A KR101623220B1 KR 101623220 B1 KR101623220 B1 KR 101623220B1 KR 1020107029736 A KR1020107029736 A KR 1020107029736A KR 20107029736 A KR20107029736 A KR 20107029736A KR 101623220 B1 KR101623220 B1 KR 101623220B1
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adhesive
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adhesive encapsulating
encapsulating composition
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KR20110014692A (ko
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준 후지따
나미 고보리
비벡 바르티
프레드 비 맥코믹
세레나 엘 몰렌하우어
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C08L23/22—Copolymers of isobutene; Butyl rubber; Homopolymers or copolymers of other iso-olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31935—Ester, halide or nitrile of addition polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
  • Photovoltaic Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Position Input By Displaying (AREA)
KR1020107029736A 2008-06-02 2009-04-28 접착성 캡슐화 조성물 및 그로 제조된 전자 소자 Expired - Fee Related KR101623220B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5806608P 2008-06-02 2008-06-02
US61/058,066 2008-06-02

Publications (2)

Publication Number Publication Date
KR20110014692A KR20110014692A (ko) 2011-02-11
KR101623220B1 true KR101623220B1 (ko) 2016-05-20

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KR1020107029736A Expired - Fee Related KR101623220B1 (ko) 2008-06-02 2009-04-28 접착성 캡슐화 조성물 및 그로 제조된 전자 소자

Country Status (7)

Country Link
US (1) US8232350B2 (enExample)
EP (1) EP2291477B1 (enExample)
JP (1) JP5890177B2 (enExample)
KR (1) KR101623220B1 (enExample)
CN (1) CN102083930B (enExample)
TW (1) TWI476258B (enExample)
WO (1) WO2009148722A2 (enExample)

Families Citing this family (137)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9024455B2 (en) 2010-05-26 2015-05-05 Hitachi Chemical Company, Ltd. Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
JP2010072471A (ja) * 2008-09-19 2010-04-02 Three M Innovative Properties Co 透明粘着シート、それを含む画像表示装置及び、その画像表示装置の作製方法
DE102008060113A1 (de) * 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
JP2010278358A (ja) * 2009-05-29 2010-12-09 Nitto Denko Corp フレームレス太陽電池モジュール端部用粘着シール材、フレームレス太陽電池モジュールおよびその端部のシール構造
WO2011062167A1 (ja) 2009-11-18 2011-05-26 味の素株式会社 樹脂組成物
WO2011062851A1 (en) 2009-11-19 2011-05-26 3M Innovative Properties Company Pressure sensitive adhesive comprising blend of synthetic rubber and functionalized synthetic rubber bonded to an acylic polymer
CN102666764B (zh) 2009-11-19 2015-09-30 3M创新有限公司 包含与丙烯酸类聚合物氢键结合的官能化聚异丁烯的压敏粘合剂
JP5701127B2 (ja) * 2010-04-05 2015-04-15 リンテック株式会社 粘着性組成物および該組成物から得られる粘着性シート
JP5719647B2 (ja) * 2010-04-09 2015-05-20 日東電工株式会社 シーリング組成物、複層ガラスおよび太陽電池パネル
JP5977233B2 (ja) * 2010-07-07 2016-08-24 エルジー ディスプレイ カンパニー リミテッド 封止構造を含む有機発光素子
JP5593175B2 (ja) * 2010-09-09 2014-09-17 リンテック株式会社 封止用粘着シート、電子デバイス、及び有機デバイス
US20130165880A1 (en) 2010-09-17 2013-06-27 David T. Amos Antimicrobial disposable absorbent articles
US8597784B2 (en) 2010-09-30 2013-12-03 3M Innovative Properties Company Radiation curable poly(isobutylene) adhesive copolymers
CN103210035B (zh) * 2010-11-16 2015-08-12 3M创新有限公司 可紫外线固化的酸酐改性聚(异丁烯)
US8663407B2 (en) 2010-11-17 2014-03-04 3M Innovative Properties Company Isobutylene (Co)polymeric adhesive composition
US8629209B2 (en) 2010-12-02 2014-01-14 3M Innovative Properties Company Moisture curable isobutylene adhesive copolymers
JP5772085B2 (ja) * 2011-03-09 2015-09-02 セイコーエプソン株式会社 発光素子、発光装置、表示装置および電子機器
KR101846434B1 (ko) 2011-06-10 2018-04-09 삼성디스플레이 주식회사 유기 발광 표시 장치
CN103703093B (zh) * 2011-06-28 2016-06-15 琳得科株式会社 一种粘着性组合物以及粘着性片
US9246024B2 (en) * 2011-07-14 2016-01-26 International Business Machines Corporation Photovoltaic device with aluminum plated back surface field and method of forming same
KR101614631B1 (ko) 2011-09-29 2016-04-21 미쓰이 가가쿠 가부시키가이샤 접착성 조성물, 및 이것을 이용한 화상 표시 장치
DE102012202377A1 (de) * 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
WO2013094617A1 (ja) * 2011-12-19 2013-06-27 パナソニック株式会社 面状発光素子
KR101974107B1 (ko) * 2012-02-02 2019-05-02 삼성디스플레이 주식회사 표시 장치
WO2013140472A1 (ja) * 2012-03-21 2013-09-26 日本化薬株式会社 光学部材及びその製造に用いる紫外線硬化型接着剤
JP5788124B2 (ja) 2012-03-29 2015-09-30 スリーエム イノベイティブ プロパティズ カンパニー ペンダントフリーラジカル重合性四級アンモニウム置換基を含むポリ（イソブチレン）コポリマーを含む接着剤
KR101919294B1 (ko) * 2012-05-02 2018-11-15 헨켈 아이피 앤드 홀딩 게엠베하 경화성 캡슐화제 및 그의 용도
KR101490553B1 (ko) * 2012-05-02 2015-02-05 (주)엘지하우시스 배리어 특성이 우수한 점착제 조성물
US9422464B2 (en) 2012-05-11 2016-08-23 3M Innovative Properties Company Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines
KR20130134878A (ko) * 2012-05-31 2013-12-10 제일모직주식회사 유기발광장치 및 유기발광장치용 점착 필름
JP6070703B2 (ja) * 2012-06-07 2017-02-01 コニカミノルタ株式会社 客室照明方法
CN103571427B (zh) * 2012-08-07 2016-03-16 中化蓝天集团有限公司 一种用于太阳能电池组件密封的单组分脱肟型硅酮密封胶及其制备方法
EP2885363B1 (en) 2012-08-14 2018-02-07 3M Innovative Properties Company Adhesives comprising grafted isobutylene copolymer
JP2014065781A (ja) * 2012-09-25 2014-04-17 Hitachi Kasei Polymer Co Ltd 積層部材の製造方法及びそれに用いるホットメルト樹脂組成物
KR102128239B1 (ko) * 2012-10-29 2020-06-30 린텍 가부시키가이샤 점착제 조성물 및 점착 시트
KR20140071552A (ko) * 2012-11-23 2014-06-12 삼성디스플레이 주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
TWI639667B (zh) * 2012-11-30 2018-11-01 日商琳得科股份有限公司 Substrate composition, subsequent sheet, electronic device and method of manufacturing same
US20150319875A1 (en) * 2012-12-18 2015-11-05 Lanxess Inc. Electronic devices comprising butyl rubber
JP2014127575A (ja) * 2012-12-26 2014-07-07 Nitto Denko Corp 封止シート
CN110372967A (zh) * 2013-03-27 2019-10-25 古河电气工业株式会社 密封用树脂组合物、密封用树脂片、有机电致发光元件、及图像显示装置
WO2014156593A1 (ja) * 2013-03-29 2014-10-02 古河電気工業株式会社 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置
KR101589372B1 (ko) * 2013-05-21 2016-01-28 주식회사 엘지화학 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법
CN105324420B (zh) * 2013-06-19 2018-09-04 Lg化学株式会社 用于包封膜的组合物、包封膜以及包括该包封膜的电子器件
US10050204B2 (en) * 2013-07-19 2018-08-14 Lg Chem, Ltd. Encapsulation composition (as amended)
WO2015012239A1 (ja) * 2013-07-24 2015-01-29 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子の製造方法、及び、製造装置
KR20150016879A (ko) 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
JP6152319B2 (ja) * 2013-08-09 2017-06-21 日東電工株式会社 粘着剤組成物、粘着テープ又はシート
KR101758418B1 (ko) * 2013-08-27 2017-07-14 주식회사 엘지화학 내구성이 우수한 고무계 점착제 조성물
JP6460344B2 (ja) * 2013-09-24 2019-01-30 エルジー・ケム・リミテッド 粘着性組成物
CN103490019B (zh) * 2013-09-29 2016-02-17 京东方科技集团股份有限公司 有机电致发光器件的封装结构及封装方法、显示装置
CN103606635B (zh) * 2013-11-26 2016-05-04 上海和辉光电有限公司 电激发光组件的封装方法
CN103730603A (zh) * 2013-12-26 2014-04-16 京东方科技集团股份有限公司 有机电致发光器件的封装方法以及有机电致发光体
JP5667282B1 (ja) * 2013-12-27 2015-02-12 古河電気工業株式会社 有機電界発光素子用充填材料及び有機電界発光素子の封止方法
KR20150097359A (ko) * 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치
WO2015129624A1 (ja) * 2014-02-25 2015-09-03 リンテック株式会社 接着剤組成物、接着シート及び電子デバイス
KR20160125353A (ko) * 2014-02-25 2016-10-31 린텍 가부시키가이샤 접착제 조성물, 접착 시트 및 전자 디바이스
KR102052359B1 (ko) 2014-06-30 2019-12-05 코오롱인더스트리 주식회사 발광 다이오드 소자용 봉지재 조성물
TWI679259B (zh) 2014-08-11 2019-12-11 德商漢高智慧財產控股公司 光學透明的熱熔黏著劑及其用途
US20160064299A1 (en) * 2014-08-29 2016-03-03 Nishant Lakhera Structure and method to minimize warpage of packaged semiconductor devices
GB201417985D0 (en) * 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
CN104282728B (zh) * 2014-10-10 2017-03-15 深圳市华星光电技术有限公司 一种白光oled显示器及其封装方法
US9698374B2 (en) 2014-11-12 2017-07-04 Lg Chem, Ltd. Pressure sensitive adhesive film
KR20160082310A (ko) 2014-12-30 2016-07-08 코오롱인더스트리 주식회사 발광 다이오드 소자용 봉지재 조성물
KR101822254B1 (ko) 2015-02-04 2018-01-25 주식회사 엘지화학 점착제 조성물
CA2973424A1 (en) * 2015-02-06 2016-08-11 Tesa Se Adhesive compound with reduced yellowness index
US11267995B2 (en) * 2015-03-24 2022-03-08 Lg Chem, Ltd. Adhesive composition
JP6636040B2 (ja) 2015-03-24 2020-01-29 エルジー・ケム・リミテッド 接着剤組成物
CN107636104B (zh) * 2015-03-24 2020-09-15 株式会社Lg化学 粘合剂组合物
EP3275944B1 (en) * 2015-03-24 2023-09-27 LG Chem, Ltd. Adhesive composition, organic electronic device and method of manufacturing organic electronic device
US10336919B2 (en) 2015-03-24 2019-07-02 Lg Chem, Ltd. Adhesive composition
CN113234289A (zh) * 2015-03-31 2021-08-10 康宁研究与开发公司 密封组合物及其应用
JP6704388B2 (ja) * 2015-04-02 2020-06-03 綜研化学株式会社 透明導電シート、タッチパネルモジュールおよびタッチパネル装置
CN104934550A (zh) * 2015-05-07 2015-09-23 京东方科技集团股份有限公司 Oled器件的封装结构、封装方法以及电子设备
CN107709418B (zh) 2015-05-08 2021-04-27 汉高知识产权控股有限责任公司 可烧结的膜和膏及其使用方法
KR102567206B1 (ko) 2015-06-03 2023-08-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 아크릴-기반 가요성 조립체 층
KR102024481B1 (ko) 2015-06-03 2019-09-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 디스플레이용 조립체 층
KR20180025901A (ko) 2015-06-29 2018-03-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 초박형 배리어 라미네이트 및 장치
WO2017031031A1 (en) * 2015-08-17 2017-02-23 3M Innovative Properties Company Barrier film constructions
JP2018529803A (ja) 2015-08-17 2018-10-11 スリーエム イノベイティブ プロパティズ カンパニー ナノ粘土充填バリア接着剤組成物
CN105070847B (zh) * 2015-09-10 2017-10-17 京东方科技集团股份有限公司 一种复合层、其制备方法及oled器件
TWI730984B (zh) 2015-09-18 2021-06-21 德商漢高智慧財產控股公司 可固化且光學透明之壓敏黏著劑及其用途
US10270033B2 (en) 2015-10-26 2019-04-23 Oti Lumionics Inc. Method for patterning a coating on a surface and device including a patterned coating
CN105552247B (zh) * 2015-12-08 2018-10-26 上海天马微电子有限公司 复合基板、柔性显示装置及其制备方法
JP6873682B2 (ja) * 2015-12-25 2021-05-19 日東電工株式会社 ゴム系粘着剤組成物、ゴム系粘着剤層、ゴム系粘着剤層付光学フィルム、光学部材、画像表示装置、及びゴム系粘着剤層の製造方法
EP3417360B1 (en) * 2016-02-16 2019-09-18 SABIC Global Technologies B.V. Barrier film laminate, method of manufacture, and displays comprising the barrier film laminate
US10784451B2 (en) 2016-02-18 2020-09-22 Dow Toray Co., Ltd. Flexible laminate having viscoelasticity and flexible display using same
US10647894B2 (en) 2016-04-22 2020-05-12 Lg Chem, Ltd. Adhesive composition for optical use and adhesive layer for optical use comprising cured product thereof
CN109415607B (zh) 2016-06-16 2022-08-09 3M创新有限公司 纳米粒子填充的阻隔性粘合剂组合物
US10894903B2 (en) 2016-06-16 2021-01-19 3M Innovative Properties Company Nanoparticle filled barrier adhesive compositions
DE102016213911A1 (de) 2016-07-28 2018-02-01 Tesa Se OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern
JP6792382B2 (ja) * 2016-09-05 2020-11-25 日東電工株式会社 ゴム系粘着剤組成物、ゴム系粘着剤層、粘着フィルム、ゴム系粘着剤層付光学フィルム、光学部材、及び画像表示装置
US11577492B2 (en) 2016-09-21 2023-02-14 3M Innovative Properties Company Protective display film with glass
JP6746777B2 (ja) * 2016-09-23 2020-08-26 エルジー・ケム・リミテッド 接着剤組成物
WO2018100559A1 (en) 2016-12-02 2018-06-07 Oti Lumionics Inc. Device including a conductive coating disposed over emissive regions and method therefor
JP6294522B1 (ja) 2017-02-14 2018-03-14 積水化学工業株式会社 有機ｅｌ表示素子用封止剤、及び、有機ｅｌ表示素子
KR20190113951A (ko) * 2017-02-16 2019-10-08 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리아이소부틸렌계 부동태화 접착제
WO2018152164A1 (en) * 2017-02-16 2018-08-23 3M Innovative Properties Company Low water vapor transmission rate (wvtr) adhesive
CN106893510A (zh) * 2017-03-01 2017-06-27 苏州赛伍应用技术有限公司 一种光伏组件背板用高性能修补胶带的制备方法
CN110536945B (zh) 2017-04-21 2022-04-29 3M创新有限公司 阻隔性粘合剂组合物和制品
JP2020518107A (ja) 2017-04-26 2020-06-18 オーティーアイ ルミオニクス インコーポレーテッドＯｔｉ Ｌｕｍｉｏｎｉｃｓ Ｉｎｃ． 表面上のコーティングをパターン化する方法およびパターン化されたコーティングを含むデバイス
TW201900798A (zh) 2017-05-05 2019-01-01 美商3M新設資產公司 聚合膜及含有此膜之顯示裝置
KR102685809B1 (ko) 2017-05-17 2024-07-18 오티아이 루미오닉스 인크. 패턴화 코팅 위에 전도성 코팅을 선택적으로 증착시키는 방법 및 전도성 코팅을 포함하는 디바이스
CN110678513A (zh) * 2017-06-14 2020-01-10 汉高知识产权控股有限责任公司 具有超低湿气渗透性的层压膜粘合剂
US10724139B2 (en) * 2017-06-19 2020-07-28 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Encapsulation method for OLED Panel
DE102017219310A1 (de) 2017-10-27 2019-05-02 Tesa Se Plasmarandverkapselung von Klebebändern
WO2019111182A1 (en) 2017-12-06 2019-06-13 3M Innovative Properties Company Barrier adhesive compositions and articles
KR102271843B1 (ko) * 2017-12-18 2021-07-01 주식회사 엘지화학 봉지 필름
CN108258151B (zh) * 2018-01-19 2019-09-17 云谷（固安）科技有限公司 封装薄膜、柔性显示装置及封装薄膜形成方法
US11751415B2 (en) 2018-02-02 2023-09-05 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
US11349103B2 (en) * 2018-03-15 2022-05-31 Dell Products L.P. Display assembly apparatus and methods for information handling systems
KR20200141050A (ko) * 2018-04-16 2020-12-17 체에스에엠 센트레 스위쎄 데 엘렉트로니크 에트 데 미크로테크니크 에스아-르쉐르슈 에트 데블로프망 광기전력 모듈 제조 방법
KR20250150689A (ko) 2018-05-07 2025-10-20 오티아이 루미오닉스 인크. 보조 전극을 제공하는 방법 및 보조 전극을 포함하는 장치
DE102018208168A1 (de) 2018-05-24 2019-11-28 Tesa Se Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
TWI777082B (zh) 2018-08-16 2022-09-11 南韓商Ｌｇ化學股份有限公司 封裝膜、包含彼之有機電子裝置、及使用彼製造有機電子裝置之方法
TWI826589B (zh) 2018-11-14 2023-12-21 日商電化股份有限公司 暫時固定組成物、暫時固定接著劑、硬化體、黏著片、接著體、及薄型晶圓的製造方法
CN112889162A (zh) 2018-11-23 2021-06-01 Oti照明公司 包括光透射区域的光电装置
CN113423792B (zh) * 2019-02-11 2023-09-05 汉高股份有限及两合公司 用于热塑性弹性体粘合的光固化性(甲基)丙烯酸酯树脂组合物
JP7135939B2 (ja) * 2019-02-28 2022-09-13 大日本印刷株式会社 太陽電池モジュール用の封止材一体型裏面保護シート及びその製造方法
WO2020178804A1 (en) 2019-03-07 2020-09-10 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
KR20250110358A (ko) 2019-04-18 2025-07-18 오티아이 루미오닉스 인크. 핵 생성 억제 코팅 형성용 물질 및 이를 포함하는 디바이스
US12069938B2 (en) 2019-05-08 2024-08-20 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
JP7346907B2 (ja) * 2019-05-21 2023-09-20 王子ホールディングス株式会社 粘着シート、剥離シート付き粘着シート及び積層体の製造方法
EP3973029A1 (en) 2019-05-22 2022-03-30 3M Innovative Properties Company Polyisobutylene adhesive comprising multifunctional component with (meth)acryl or vinyl ether groups
KR20240134240A (ko) 2019-06-26 2024-09-06 오티아이 루미오닉스 인크. 광 회절 특성을 갖는 광 투과 영역을 포함하는 광전자 디바이스
US11832473B2 (en) 2019-06-26 2023-11-28 Oti Lumionics Inc. Optoelectronic device including light transmissive regions, with light diffraction characteristics
US12302691B2 (en) 2019-08-09 2025-05-13 Oti Lumionics Inc. Opto-electronic device including an auxiliary electrode and a partition
KR102189312B1 (ko) * 2019-11-01 2020-12-10 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102338360B1 (ko) * 2019-11-01 2021-12-10 삼성디스플레이 주식회사 유기 발광 표시 장치
US11737298B2 (en) 2019-12-24 2023-08-22 Oti Lumionics Inc. Light emitting device including capping layers on respective emissive regions
KR102806056B1 (ko) 2020-05-21 2025-05-12 덴카 주식회사 조성물
KR102495985B1 (ko) * 2020-12-03 2023-02-07 삼성디스플레이 주식회사 유기 발광 표시 장치
CA3240373A1 (en) 2020-12-07 2022-06-16 Michael HELANDER Patterning a conductive deposited layer using a nucleation inhibiting coating and an underlying metallic coating
US20240218215A1 (en) 2021-04-26 2024-07-04 Denka Company Limited Composition
JP2024528985A (ja) * 2021-08-02 2024-08-01 アドヒーシブズ・リサーチ・インコーポレイテッド 充填ポリイソブテン系感圧接着剤、並びにそれらの製造方法及びそれらの使用
KR102729451B1 (ko) * 2021-12-17 2024-11-13 (주)이녹스첨단소재 봉지재용 경화성 조성물 및 이를 포함하는 유기발광소자용 봉지재
WO2025046387A1 (en) 2023-08-31 2025-03-06 3M Innovative Properties Company Dichroic polarizer film
WO2025133762A1 (en) 2023-12-21 2025-06-26 3M Innovative Properties Company Retroreflective article comprising a retroreflective layer and an antireflective layer, kits, and methods thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2927104A (en) 1957-12-18 1960-03-01 Exxon Research Engineering Co Preparation of high molecular weight polyisobutylene
US3050497A (en) 1961-03-15 1962-08-21 Sinclair Research Inc Improved high molecular weight polyisobutylene compositions and method of making
US3657159A (en) 1968-10-14 1972-04-18 Hercules Inc Epoxide polymerization catalysts comprising complex organoaluminate compounds of silicon tin or phosphorus
US3657149A (en) 1968-10-14 1972-04-18 Hercules Inc Catalyst compositions
US4397570A (en) * 1981-06-02 1983-08-09 Pymah Corporation Pressure sensitive adhesive containing a nucleating agent for use in a disposable thermometer
DE3669996D1 (de) 1985-01-30 1990-05-10 Kao Corp Absorptionsartikel.
JPH0329291A (ja) 1989-06-27 1991-02-07 Sumitomo Bakelite Co Ltd 有機分散型ｅｌランプ用捕水フィルム
ATE124561T1 (de) 1989-08-25 1995-07-15 Mitsui Petrochemical Ind Medium für informationsaufzeichnung und dazu verwendbares klebemittel.
US5238519A (en) 1990-10-17 1993-08-24 United Solar Systems Corporation Solar cell lamination apparatus
JP3222361B2 (ja) 1995-08-15 2001-10-29 キヤノン株式会社 太陽電池モジュールの製造方法及び太陽電池モジュール
ID17196A (id) * 1996-03-14 1997-12-11 Dow Chemical Co Bahan-bahan perekat yang mengandung polimer-polimer olefin
AU731869B2 (en) * 1998-11-12 2001-04-05 Kaneka Corporation Solar cell module
WO2000035671A1 (en) 1998-12-14 2000-06-22 Sartomer Company, Inc. Packaging material having improved barrier properties
US6210517B1 (en) 1999-04-13 2001-04-03 Diversified Chemical Technologies, Inc. Radiation-cured, non-blocking heat activated label adhesive and coatings and method for using same
US6226890B1 (en) 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices
DE10142285A1 (de) * 2001-08-29 2003-03-20 Basf Ag Polymerzusammensetzung, enthaltend wenigstens ein mittelmolekulares reaktives Polyisobuten
US6946676B2 (en) 2001-11-05 2005-09-20 3M Innovative Properties Company Organic thin film transistor with polymeric interface
JP2003165841A (ja) 2001-11-29 2003-06-10 Dow Corning Toray Silicone Co Ltd ポリオルガノメタロシロキサンおよびその製造方法
WO2003106582A1 (ja) 2002-01-10 2003-12-24 積水化学工業株式会社 有機エレクトロルミネッセンス素子封止用接着剤及びその応用
US6835950B2 (en) 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
US7449629B2 (en) * 2002-08-21 2008-11-11 Truseal Technologies, Inc. Solar panel including a low moisture vapor transmission rate adhesive composition
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7279777B2 (en) 2003-05-08 2007-10-09 3M Innovative Properties Company Organic polymers, laminates, and capacitors
JP2005057523A (ja) 2003-08-05 2005-03-03 Mitsubishi Electric Corp 番組付加情報抽出装置、番組表示装置および番組記録装置
JP4206899B2 (ja) 2003-10-27 2009-01-14 Ｊｓｒ株式会社 面実装型ｌｅｄ素子
DE10357321A1 (de) 2003-12-05 2005-07-21 Tesa Ag Hochtackige Klebmasse, Verfahren zu deren Herstellung und deren Verwendung
JP4410055B2 (ja) * 2004-08-02 2010-02-03 日東電工株式会社 位相差粘着剤層、その製造方法、粘着型光学フィルム、その製造方法および画像表示装置
JP2005239359A (ja) 2004-02-26 2005-09-08 Mitsubishi Heavy Ind Ltd 冷却装置付きコンテナの段積方法およびコンテナヤード
US7316756B2 (en) 2004-07-27 2008-01-08 Eastman Kodak Company Desiccant for top-emitting OLED
US7875686B2 (en) 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications
US20060063015A1 (en) 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
JPWO2006057218A1 (ja) 2004-11-24 2008-06-05 株式会社カネカ 硬化性組成物およびその硬化性組成物により封止、被覆された半導体装置
JP2006186175A (ja) 2004-12-28 2006-07-13 Nippon Zeon Co Ltd 電子部品用樹脂膜形成材料及びそれを用いた積層体
DE602005015766D1 (de) 2005-01-04 2009-09-10 Dow Corning Organosiliciumfunktionelle bor-amin-katalysatorkomplexe und daraus hergestellte härtbare zusammensetzungen
JP5288150B2 (ja) 2005-10-24 2013-09-11 株式会社スリーボンド 有機ｅｌ素子封止用熱硬化型組成物
JP5213303B2 (ja) 2006-01-17 2013-06-19 スリーエム イノベイティブ プロパティズ カンパニー 光硬化性吸湿性組成物及び有機ｅｌ素子
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP2009531516A (ja) * 2006-03-29 2009-09-03 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 放射線−硬化性ゴム系接着剤／シーラント
JP5023751B2 (ja) 2007-03-19 2012-09-12 株式会社Ｌｉｘｉｌ 外壁構造及び外壁工法
JP2009012586A (ja) 2007-07-04 2009-01-22 Toyota Auto Body Co Ltd 自動車のサッシレスドア構造
CN102076803B (zh) 2008-06-02 2014-11-12 3M创新有限公司 粘合剂封装组合物以及用其制备的电子器件
JP2009296115A (ja) 2008-06-03 2009-12-17 Daishinku Corp 音叉型圧電振動片、音叉型圧電振動デバイス、および音叉型圧電振動片の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier

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