KR101398342B1 - 수지 조성물, 프리프레그, 적층판 및 배선판 - Google Patents

수지 조성물, 프리프레그, 적층판 및 배선판 Download PDF

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Publication number
KR101398342B1
KR101398342B1 KR1020087028671A KR20087028671A KR101398342B1 KR 101398342 B1 KR101398342 B1 KR 101398342B1 KR 1020087028671 A KR1020087028671 A KR 1020087028671A KR 20087028671 A KR20087028671 A KR 20087028671A KR 101398342 B1 KR101398342 B1 KR 101398342B1
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KR
South Korea
Prior art keywords
resin
epoxy resin
resin composition
thermal expansion
integer
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Expired - Fee Related
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KR1020087028671A
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English (en)
Korean (ko)
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KR20090014173A (ko
Inventor
고지 모리타
신 다카네자와
가즈나가 사카이
유우스케 곤도우
Original Assignee
히타치가세이가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020087028671A 2006-04-28 2007-04-26 수지 조성물, 프리프레그, 적층판 및 배선판 Expired - Fee Related KR101398342B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006125603 2006-04-28
JPJP-P-2006-125603 2006-04-28
PCT/JP2007/059022 WO2007125979A1 (ja) 2006-04-28 2007-04-26 樹脂組成物、プリプレグ、積層板及び配線板

Publications (2)

Publication Number Publication Date
KR20090014173A KR20090014173A (ko) 2009-02-06
KR101398342B1 true KR101398342B1 (ko) 2014-05-22

Family

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Family Applications (1)

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KR1020087028671A Expired - Fee Related KR101398342B1 (ko) 2006-04-28 2007-04-26 수지 조성물, 프리프레그, 적층판 및 배선판

Country Status (10)

Country Link
US (1) US9078365B2 (enExample)
JP (6) JP4950141B2 (enExample)
KR (1) KR101398342B1 (enExample)
CN (5) CN101432330B (enExample)
CA (1) CA2649841C (enExample)
DE (1) DE112007001047B4 (enExample)
MY (2) MY169438A (enExample)
SG (1) SG173402A1 (enExample)
TW (1) TWI417337B (enExample)
WO (1) WO2007125979A1 (enExample)

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JP5588646B2 (ja) * 2009-09-15 2014-09-10 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びドライフィルム
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SG183365A1 (en) * 2010-02-24 2012-09-27 Hitachi Chemical Co Ltd Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
JP5558885B2 (ja) * 2010-03-30 2014-07-23 電気化学工業株式会社 樹脂複合組成物及びその用途
KR101473556B1 (ko) * 2012-03-27 2014-12-16 다이요 잉키 세이조 가부시키가이샤 난연성 경화성 수지 조성물, 드라이 필름, 난연성 피막 및 인쇄 배선판
KR101388750B1 (ko) * 2012-07-31 2014-04-25 삼성전기주식회사 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판
KR20160029900A (ko) * 2014-09-05 2016-03-16 삼성전자주식회사 반도체 소자의 제조 방법
TWI694110B (zh) * 2014-12-16 2020-05-21 美商塞特工業公司 用於複合材料之環氧基樹脂組合物及其應用
JPWO2016143524A1 (ja) * 2015-03-09 2017-12-28 小松精練株式会社 繊維強化樹脂材料、繊維強化樹脂成形体および繊維強化樹脂成形体の製造方法
JP6735505B2 (ja) * 2016-09-06 2020-08-05 パナソニックＩｐマネジメント株式会社 プリント配線板、プリント回路板、プリプレグ
MX2019015684A (es) 2017-06-30 2020-02-26 Procter & Gamble Composiciones para el cuidado del cabello que comprenden un material de 2-piridinol-n-oxido y un quelante de hierro.
CA3066177C (en) 2017-06-30 2023-06-06 The Procter & Gamble Company Deodorant and antiperspirant compositions
US10543164B2 (en) 2017-06-30 2020-01-28 The Procter & Gamble Company Deodorant compositions
KR102372638B1 (ko) * 2017-07-10 2022-03-10 디아이씨 가부시끼가이샤 적층체, 그것을 사용한 프린트 배선판, 플렉서블 프린트 배선판 및 성형품
JP7163605B2 (ja) * 2018-03-26 2022-11-01 味の素株式会社 樹脂組成物
CN112513180A (zh) * 2018-08-09 2021-03-16 三菱瓦斯化学株式会社 印刷电路板用树脂组合物、预浸料、层叠板、覆金属箔层叠板、印刷电路板和多层印刷电路板
JPWO2022138666A1 (enExample) * 2020-12-21 2022-06-30

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Publication number Priority date Publication date Assignee Title
JP2001049080A (ja) * 1999-08-09 2001-02-20 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物、プリプレグ及び積層板
JP2005082624A (ja) * 2003-09-04 2005-03-31 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JP2005097473A (ja) * 2003-09-26 2005-04-14 Japan Epoxy Resin Kk 新規エポキシ化合物、その製造方法、硬化性エポキシ樹脂組成物およびその硬化体
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JP2009007576A (ja) 2009-01-15
CN103342877B (zh) 2016-05-04
JP2008303397A (ja) 2008-12-18
CN103333459B (zh) 2016-06-01
MY154552A (en) 2015-06-30
CN103333459A (zh) 2013-10-02
CN103342876A (zh) 2013-10-09
US9078365B2 (en) 2015-07-07
TWI417337B (zh) 2013-12-01
CN103342877A (zh) 2013-10-09
JP5505486B2 (ja) 2014-05-28
TW200801111A (en) 2008-01-01
CN101432330A (zh) 2009-05-13
DE112007001047B4 (de) 2020-06-04
JP4950142B2 (ja) 2012-06-13
JP2013080931A (ja) 2013-05-02
JP4950141B2 (ja) 2012-06-13
JP2009024177A (ja) 2009-02-05
CA2649841A1 (en) 2007-11-08
JP5338187B2 (ja) 2013-11-13
US20090200071A1 (en) 2009-08-13
JP2013080930A (ja) 2013-05-02
SG173402A1 (en) 2011-08-29
CA2649841C (en) 2013-11-26
CN102134303A (zh) 2011-07-27
DE112007001047T5 (de) 2009-04-16
JP2009280823A (ja) 2009-12-03
JP5316267B2 (ja) 2013-10-16
WO2007125979A1 (ja) 2007-11-08
JP5505485B2 (ja) 2014-05-28
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MY169438A (en) 2019-04-10
KR20090014173A (ko) 2009-02-06

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