CN101432330B - 树脂组合物、预渍体、层叠板及布线板 - Google Patents

树脂组合物、预渍体、层叠板及布线板 Download PDF

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Publication number
CN101432330B
CN101432330B CN2007800151940A CN200780015194A CN101432330B CN 101432330 B CN101432330 B CN 101432330B CN 2007800151940 A CN2007800151940 A CN 2007800151940A CN 200780015194 A CN200780015194 A CN 200780015194A CN 101432330 B CN101432330 B CN 101432330B
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CN
China
Prior art keywords
resin
thermal expansion
integer
manufactured
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2007800151940A
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English (en)
Chinese (zh)
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CN101432330A (zh
Inventor
森田高示
高根泽伸
坂井和永
近藤裕介
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Resonac Corp
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Hitachi Chemical Co Ltd
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Publication date
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Priority to CN201310204066.8A priority Critical patent/CN103333459B/zh
Priority to CN201310204048.XA priority patent/CN103342877B/zh
Publication of CN101432330A publication Critical patent/CN101432330A/zh
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Publication of CN101432330B publication Critical patent/CN101432330B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/12—Polymers characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2007800151940A 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板 Expired - Fee Related CN101432330B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201310204066.8A CN103333459B (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN201310204048.XA CN103342877B (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP125603/2006 2006-04-28
JP2006125603 2006-04-28
PCT/JP2007/059022 WO2007125979A1 (ja) 2006-04-28 2007-04-26 樹脂組成物、プリプレグ、積層板及び配線板

Related Child Applications (4)

Application Number Title Priority Date Filing Date
CN2013102039196A Division CN103342876A (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN2010106221014A Division CN102134303A (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN201310204066.8A Division CN103333459B (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN201310204048.XA Division CN103342877B (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板

Publications (2)

Publication Number Publication Date
CN101432330A CN101432330A (zh) 2009-05-13
CN101432330B true CN101432330B (zh) 2011-08-03

Family

ID=38655504

Family Applications (5)

Application Number Title Priority Date Filing Date
CN2007800151940A Expired - Fee Related CN101432330B (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN2010106221014A Pending CN102134303A (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN201310204048.XA Expired - Fee Related CN103342877B (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN2013102039196A Pending CN103342876A (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN201310204066.8A Expired - Fee Related CN103333459B (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板

Family Applications After (4)

Application Number Title Priority Date Filing Date
CN2010106221014A Pending CN102134303A (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN201310204048.XA Expired - Fee Related CN103342877B (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN2013102039196A Pending CN103342876A (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板
CN201310204066.8A Expired - Fee Related CN103333459B (zh) 2006-04-28 2007-04-26 树脂组合物、预渍体、层叠板及布线板

Country Status (10)

Country Link
US (1) US9078365B2 (enExample)
JP (6) JP4950141B2 (enExample)
KR (1) KR101398342B1 (enExample)
CN (5) CN101432330B (enExample)
CA (1) CA2649841C (enExample)
DE (1) DE112007001047B4 (enExample)
MY (2) MY169438A (enExample)
SG (1) SG173402A1 (enExample)
TW (1) TWI417337B (enExample)
WO (1) WO2007125979A1 (enExample)

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JP5712488B2 (ja) * 2009-02-27 2015-05-07 日立化成株式会社 絶縁性樹脂フィルム及びそれを用いた積層板、配線板
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JP5588646B2 (ja) * 2009-09-15 2014-09-10 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びドライフィルム
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JP5558885B2 (ja) * 2010-03-30 2014-07-23 電気化学工業株式会社 樹脂複合組成物及びその用途
KR101473556B1 (ko) * 2012-03-27 2014-12-16 다이요 잉키 세이조 가부시키가이샤 난연성 경화성 수지 조성물, 드라이 필름, 난연성 피막 및 인쇄 배선판
KR101388750B1 (ko) * 2012-07-31 2014-04-25 삼성전기주식회사 인쇄회로기판용 에폭시 수지 조성물, 절연필름, 프리프레그 및 다층 인쇄회로기판
KR20160029900A (ko) * 2014-09-05 2016-03-16 삼성전자주식회사 반도체 소자의 제조 방법
TWI694110B (zh) * 2014-12-16 2020-05-21 美商塞特工業公司 用於複合材料之環氧基樹脂組合物及其應用
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JP6735505B2 (ja) * 2016-09-06 2020-08-05 パナソニックＩｐマネジメント株式会社 プリント配線板、プリント回路板、プリプレグ
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US10543164B2 (en) 2017-06-30 2020-01-28 The Procter & Gamble Company Deodorant compositions
KR102372638B1 (ko) * 2017-07-10 2022-03-10 디아이씨 가부시끼가이샤 적층체, 그것을 사용한 프린트 배선판, 플렉서블 프린트 배선판 및 성형품
JP7163605B2 (ja) * 2018-03-26 2022-11-01 味の素株式会社 樹脂組成物
CN112513180A (zh) * 2018-08-09 2021-03-16 三菱瓦斯化学株式会社 印刷电路板用树脂组合物、预浸料、层叠板、覆金属箔层叠板、印刷电路板和多层印刷电路板
JPWO2022138666A1 (enExample) * 2020-12-21 2022-06-30

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