KR101277397B1 - 기판처리장치, 스토커장치 및 기판수납용기의 반송방법 - Google Patents

기판처리장치, 스토커장치 및 기판수납용기의 반송방법 Download PDF

Info

Publication number
KR101277397B1
KR101277397B1 KR1020110018412A KR20110018412A KR101277397B1 KR 101277397 B1 KR101277397 B1 KR 101277397B1 KR 1020110018412 A KR1020110018412 A KR 1020110018412A KR 20110018412 A KR20110018412 A KR 20110018412A KR 101277397 B1 KR101277397 B1 KR 101277397B1
Authority
KR
South Korea
Prior art keywords
storage container
substrate
substrate storage
holding
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020110018412A
Other languages
English (en)
Korean (ko)
Other versions
KR20110102177A (ko
Inventor
유키히코 이나가키
켄사쿠 오니시
준 야마모토
Original Assignee
가부시키가이샤 소쿠도
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 소쿠도 filed Critical 가부시키가이샤 소쿠도
Publication of KR20110102177A publication Critical patent/KR20110102177A/ko
Application granted granted Critical
Publication of KR101277397B1 publication Critical patent/KR101277397B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404Storage means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02Storage devices
    • B65G1/04Storage devices mechanical
    • B65G1/0407Storage devices mechanical using stacker cranes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02Storage devices
    • B65G1/04Storage devices mechanical
    • B65G1/0457Storage devices mechanical with suspended load carriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3221Overhead conveying
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02Articles
    • B65G2201/0297Wafer cassette
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020110018412A 2010-03-10 2011-03-02 기판처리장치, 스토커장치 및 기판수납용기의 반송방법 Active KR101277397B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-052900 2010-03-10
JP2010052900A JP5318005B2 (ja) 2010-03-10 2010-03-10 基板処理装置、ストッカー装置および基板収納容器の搬送方法

Publications (2)

Publication Number Publication Date
KR20110102177A KR20110102177A (ko) 2011-09-16
KR101277397B1 true KR101277397B1 (ko) 2013-06-20

Family

ID=44560157

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110018412A Active KR101277397B1 (ko) 2010-03-10 2011-03-02 기판처리장치, 스토커장치 및 기판수납용기의 반송방법

Country Status (3)

Country Link
US (2) US8827621B2 (https=)
JP (1) JP5318005B2 (https=)
KR (1) KR101277397B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210157054A (ko) 2020-06-19 2021-12-28 세메스 주식회사 스토커

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
JP5713202B2 (ja) * 2012-01-27 2015-05-07 株式会社ダイフク 物品搬送設備
US10319621B2 (en) 2012-12-31 2019-06-11 Asm Ip Holding B.V. Semiconductor processing assembly and facility
WO2015046062A1 (ja) * 2013-09-30 2015-04-02 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および記録媒体
JP2015141915A (ja) * 2014-01-27 2015-08-03 東京エレクトロン株式会社 基板熱処理装置、基板熱処理装置の設置方法
JP6314713B2 (ja) * 2014-07-14 2018-04-25 株式会社ダイフク 階間搬送設備
US10332770B2 (en) 2014-09-24 2019-06-25 Sandisk Technologies Llc Wafer transfer system
EP3476772B1 (en) * 2016-06-27 2022-04-27 Murata Machinery, Ltd. Conveyance system
DE102016009000A1 (de) * 2016-07-21 2018-01-25 Liebherr-Verzahntechnik Gmbh Regalbediengerät für ein Palettenspeichersystem
JP6593287B2 (ja) * 2016-09-09 2019-10-23 株式会社ダイフク 物品搬送設備
US10672639B2 (en) * 2016-12-07 2020-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Method for automatic sending cassette pod
WO2018194873A1 (en) 2017-04-20 2018-10-25 Daifuku America Corporation High density stocker
US10406562B2 (en) * 2017-07-21 2019-09-10 Applied Materials, Inc. Automation for rotary sorters
JP6835031B2 (ja) * 2018-04-27 2021-02-24 株式会社ダイフク 物品搬送設備
JP7185461B2 (ja) 2018-09-21 2022-12-07 株式会社Screenホールディングス 基板処理装置および、基板処理装置の制御方法
JP7300817B2 (ja) * 2018-09-21 2023-06-30 株式会社Screenホールディングス 基板処理装置および基板処理装置の制御方法
JP7115947B2 (ja) * 2018-09-21 2022-08-09 株式会社Screenホールディングス 基板処理装置
CN111331156B (zh) * 2018-12-19 2021-06-22 宝成工业股份有限公司 自动上下料装置
JP7181081B2 (ja) 2018-12-28 2022-11-30 株式会社Screenホールディングス 基板処理装置および基板搬送方法
JP7175191B2 (ja) 2018-12-28 2022-11-18 株式会社Screenホールディングス 基板処理装置および基板搬送方法
JP7221048B2 (ja) 2018-12-28 2023-02-13 株式会社Screenホールディングス 基板処理装置および基板搬送方法
JP7190900B2 (ja) 2018-12-28 2022-12-16 株式会社Screenホールディングス 基板処理装置、キャリア搬送方法およびキャリアバッファ装置
JP7114456B2 (ja) 2018-12-28 2022-08-08 株式会社Screenホールディングス 基板処理装置および基板搬送方法
JP7458718B2 (ja) 2019-07-19 2024-04-01 株式会社Screenホールディングス 基板処理装置および基板搬送方法
JP7387316B2 (ja) 2019-07-19 2023-11-28 株式会社Screenホールディングス 基板処理システムおよび基板搬送方法
JP2021046273A (ja) * 2019-09-17 2021-03-25 株式会社ダイフク 物品搬送装置
KR20210134869A (ko) * 2020-05-01 2021-11-11 에이에스엠 아이피 홀딩 비.브이. Foup 핸들러를 이용한 foup의 빠른 교환

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423102Y2 (https=) * 1975-04-23 1979-08-09
JPH072309A (ja) * 1993-06-17 1995-01-06 Kokusai Electric Co Ltd ウェーハ搬送装置
KR20080055382A (ko) * 2006-12-15 2008-06-19 엘지디스플레이 주식회사 랙 마스터

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124781A (https=) * 1973-03-28 1974-11-29
JPS5936428B2 (ja) 1975-05-19 1984-09-04 日本電気株式会社 半導体集積回路
JPH0755548B2 (ja) 1987-09-02 1995-06-14 株式会社アイジー技術研究所 耐火、断熱パネル
JPH0163137U (https=) * 1987-10-16 1989-04-24
US5174708A (en) * 1988-12-06 1992-12-29 Yellow Freight System, Inc. Boom mounted multiple stage freight lift apparatus
JPH07101193B2 (ja) 1990-12-25 1995-11-01 株式会社コスモ計器 自己診断機能付差圧式リークテスタ
JP2969034B2 (ja) 1993-06-18 1999-11-02 東京エレクトロン株式会社 搬送方法および搬送装置
JP3324233B2 (ja) * 1993-11-04 2002-09-17 石川島播磨重工業株式会社 入出庫装置
US5849602A (en) * 1995-01-13 1998-12-15 Tokyo Electron Limited Resist processing process
KR100244041B1 (ko) * 1995-08-05 2000-02-01 엔도 마코토 기판처리장치
TW318258B (https=) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
JPH1098087A (ja) 1996-09-25 1998-04-14 Shimadzu Corp ウエハ搬送装置
US6540466B2 (en) * 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
JP3579228B2 (ja) * 1997-01-24 2004-10-20 大日本スクリーン製造株式会社 基板処理装置
US6390754B2 (en) * 1997-05-21 2002-05-21 Tokyo Electron Limited Wafer processing apparatus, method of operating the same and wafer detecting system
JP3625617B2 (ja) 1997-06-10 2005-03-02 東京エレクトロン株式会社 基板処理装置、カセット内の基板検出装置
JPH11219912A (ja) * 1998-02-02 1999-08-10 Tokyo Electron Ltd 縦型熱処理装置
JP3928902B2 (ja) 1998-02-20 2007-06-13 平田機工株式会社 基板製造ラインおよび基板製造方法
US6283692B1 (en) * 1998-12-01 2001-09-04 Applied Materials, Inc. Apparatus for storing and moving a cassette
TW412097U (en) * 1999-01-28 2000-11-11 Ind Tech Res Inst Select-type battery-charging station for managing and switching the batteries of electric vehicles
JP2000306978A (ja) * 1999-02-15 2000-11-02 Kokusai Electric Co Ltd 基板処理装置、基板搬送装置、および基板処理方法
US6506009B1 (en) * 2000-03-16 2003-01-14 Applied Materials, Inc. Apparatus for storing and moving a cassette
TW501194B (en) * 2000-08-23 2002-09-01 Tokyo Electron Ltd Processing system for object to be processed
JP2003007800A (ja) * 2001-06-21 2003-01-10 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
US20030031538A1 (en) * 2001-06-30 2003-02-13 Applied Materials, Inc. Datum plate for use in installations of substrate handling systems
JP2003051527A (ja) 2001-08-02 2003-02-21 Takehide Hayashi 半導体自動搬送対応efem(密閉容器からウエハーを出し入れし、製造装置に供給、回収する装置)用foup(密閉容器)移載ロボット
JP3902027B2 (ja) 2002-03-01 2007-04-04 大日本スクリーン製造株式会社 基板処理装置
US20040081546A1 (en) * 2002-08-31 2004-04-29 Applied Materials, Inc. Method and apparatus for supplying substrates to a processing tool
KR100935291B1 (ko) * 2002-11-28 2010-01-06 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 도포 현상 장치
JP3962705B2 (ja) * 2003-06-05 2007-08-22 東京エレクトロン株式会社 処理装置
JP2005150575A (ja) 2003-11-19 2005-06-09 Nachi Fujikoshi Corp ダブルアーム型ロボット
AT500229B1 (de) * 2004-03-15 2008-12-15 Tgw Mechanics Gmbh Rechnergesteuerte transportvorrichtung
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
JP4666213B2 (ja) * 2005-07-05 2011-04-06 株式会社ダイフク 物品収納設備
JP2007251088A (ja) * 2006-03-20 2007-09-27 Tokyo Electron Ltd 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法
JP4221733B2 (ja) 2006-08-21 2009-02-12 株式会社安川電機 ダブルアーム型ロボット
JP4904995B2 (ja) * 2006-08-28 2012-03-28 シンフォニアテクノロジー株式会社 ロードポート装置
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
US8128333B2 (en) * 2006-11-27 2012-03-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and manufacturing method for semiconductor devices
JP4327206B2 (ja) * 2007-01-30 2009-09-09 東京エレクトロン株式会社 縦型熱処理装置及び縦型熱処理方法
TW200911654A (en) * 2007-09-06 2009-03-16 Asyst Technologies Japan Inc Storage, transporting system and storage set
US8043039B2 (en) * 2007-09-20 2011-10-25 Tokyo Electron Limited Substrate treatment apparatus
JP4828503B2 (ja) * 2007-10-16 2011-11-30 東京エレクトロン株式会社 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体
KR101015225B1 (ko) * 2008-07-07 2011-02-18 세메스 주식회사 기판 처리장치 및 이의 기판 이송 방법
JP5284808B2 (ja) 2009-01-26 2013-09-11 株式会社Sokudo ストッカー装置及び基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423102Y2 (https=) * 1975-04-23 1979-08-09
JPH072309A (ja) * 1993-06-17 1995-01-06 Kokusai Electric Co Ltd ウェーハ搬送装置
KR20080055382A (ko) * 2006-12-15 2008-06-19 엘지디스플레이 주식회사 랙 마스터

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210157054A (ko) 2020-06-19 2021-12-28 세메스 주식회사 스토커

Also Published As

Publication number Publication date
US8827621B2 (en) 2014-09-09
KR20110102177A (ko) 2011-09-16
US9728434B2 (en) 2017-08-08
JP2011187796A (ja) 2011-09-22
JP5318005B2 (ja) 2013-10-16
US20140341681A1 (en) 2014-11-20
US20110222994A1 (en) 2011-09-15

Similar Documents

Publication Publication Date Title
KR101277397B1 (ko) 기판처리장치, 스토커장치 및 기판수납용기의 반송방법
JP5284808B2 (ja) ストッカー装置及び基板処理装置
CN101261935B (zh) 基板处理装置
TWI508217B (zh) 基板處理裝置
KR101705932B1 (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
KR102320637B1 (ko) 기판 처리 장치, 캐리어 반송 방법 및 캐리어 버퍼 장치
CN103377966B (zh) 基板交接装置和基板交接方法
KR102296014B1 (ko) 기판 처리 장치 및 기판 반송 방법
KR102323713B1 (ko) 기판 처리 장치 및 기판 처리 장치의 제어 방법
KR102303630B1 (ko) 인덱서 장치, 기판 처리 장치, 인덱서 장치의 제어 방법 및 기판 처리 장치의 제어 방법
JP5586739B2 (ja) 基板処理装置、ストッカー装置および基板収納容器の搬送方法
CN101920834B (zh) 自动仓库
CN111081598B (zh) 基板处理装置和基板处理方法
JP2013157644A (ja) ロットサイズ減少のためのバッファ付きローダ
TW201320230A (zh) 自動載入埠、設備前端模組
KR102279006B1 (ko) 기판 처리 장치 및 기판 반송 방법
JP5610009B2 (ja) 基板処理装置
CN112242320B (zh) 衬底处理装置及衬底搬送方法
KR102396204B1 (ko) 기판 처리 장치 및 기판 반송 방법
KR101019212B1 (ko) 기판 처리 설비 및 방법
KR101343690B1 (ko) 기판처리장치
CN102386053A (zh) 衬底处理装置和制造半导体器件的方法
KR20230150877A (ko) 기판 처리 장치 및 기판 처리 방법
KR20240118678A (ko) 기판 처리 시스템
KR102953330B1 (ko) 타워 리프트 장치

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20160517

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20170522

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20180517

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20190515

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20200519

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20210524

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20220518

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000