KR101175080B1 - 내열성 수지 전구체 및 그것을 사용한 감광성 수지 조성물 - Google Patents

내열성 수지 전구체 및 그것을 사용한 감광성 수지 조성물 Download PDF

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KR101175080B1
KR101175080B1 KR1020107008436A KR20107008436A KR101175080B1 KR 101175080 B1 KR101175080 B1 KR 101175080B1 KR 1020107008436 A KR1020107008436 A KR 1020107008436A KR 20107008436 A KR20107008436 A KR 20107008436A KR 101175080 B1 KR101175080 B1 KR 101175080B1
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formula
group
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KR1020107008436A
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KR20100054163A (ko
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다카유키 가나다
유카 사사키
사토시 시부이
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아사히 가세이 이-매터리얼즈 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020107008436A 2007-12-26 2008-12-24 내열성 수지 전구체 및 그것을 사용한 감광성 수지 조성물 KR101175080B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2007-335077 2007-12-26
JP2007335077 2007-12-26
PCT/JP2008/073472 WO2009081950A1 (ja) 2007-12-26 2008-12-24 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20100054163A KR20100054163A (ko) 2010-05-24
KR101175080B1 true KR101175080B1 (ko) 2012-10-26

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KR1020107008436A KR101175080B1 (ko) 2007-12-26 2008-12-24 내열성 수지 전구체 및 그것을 사용한 감광성 수지 조성물

Country Status (5)

Country Link
JP (1) JP5498170B2 (zh)
KR (1) KR101175080B1 (zh)
CN (1) CN101827880B (zh)
TW (1) TWI386436B (zh)
WO (1) WO2009081950A1 (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009145158A1 (ja) * 2008-05-29 2009-12-03 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置
WO2010001780A1 (ja) * 2008-07-03 2010-01-07 旭化成イーマテリアルズ株式会社 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物
JP5649118B2 (ja) * 2008-10-20 2015-01-07 日本化薬株式会社 ポリイミド樹脂及びその組成物
JP5562585B2 (ja) * 2009-07-06 2014-07-30 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
CN102439520B (zh) * 2010-04-28 2014-08-27 旭化成电子材料株式会社 感光性树脂组合物
JP6094271B2 (ja) * 2012-03-05 2017-03-15 味の素株式会社 感光性樹脂組成物
CN103342878B (zh) * 2013-06-21 2015-12-09 华东理工大学 基于聚苯并唑和热固性树脂的分子复合材料及制备方法
JP6240471B2 (ja) * 2013-11-01 2017-11-29 東京応化工業株式会社 反応現像画像形成法
JP6459191B2 (ja) * 2014-03-19 2019-01-30 東レ株式会社 感光性樹脂組成物
CN107430334B (zh) * 2015-01-23 2021-07-30 艾曲迪微系统股份有限公司 正型感光性树脂组合物、图案固化膜的制造方法、图案固化膜和电子部件
KR102117237B1 (ko) * 2015-10-21 2020-06-01 쇼와 덴코 가부시키가이샤 포지티브형 감광성 수지 조성물
WO2017073481A1 (ja) * 2015-10-28 2017-05-04 東レ株式会社 ポジ型感光性樹脂組成物、感光性シート、硬化膜、層間絶縁膜、半導体保護膜、半導体装置の製造方法、半導体電子部品および半導体装置
WO2017086360A1 (ja) * 2015-11-16 2017-05-26 三井化学株式会社 半導体用膜組成物、半導体用膜組成物の製造方法、半導体用部材の製造方法、半導体用工程材の製造方法及び半導体装置
KR20180101440A (ko) * 2016-02-05 2018-09-12 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 포지티브형 감광성 수지 조성물
US11592744B2 (en) 2016-02-05 2023-02-28 Hd Microsystems, Ltd. Positive-type photosensitive resin composition
WO2018056013A1 (ja) * 2016-09-20 2018-03-29 太陽ホールディングス株式会社 ポジ型感光性樹脂組成物、ドライフィルム、硬化物、プリント配線板および半導体素子
JP7255972B2 (ja) * 2017-04-20 2023-04-11 三星電子株式会社 ポリ（アミド－イミド）コポリマー、ポリ（アミド－イミド）コポリマーを含む成形品、および表示装置
JP6800105B2 (ja) * 2017-07-21 2020-12-16 信越化学工業株式会社 有機膜形成用組成物、パターン形成方法、及び有機膜形成用樹脂
JP7264688B2 (ja) * 2019-03-27 2023-04-25 太陽ホールディングス株式会社 感光性樹脂組成物、ドライフィルム、硬化物、及び、電子部品
CN114303096A (zh) * 2019-08-27 2022-04-08 三菱瓦斯化学株式会社 光刻用膜形成组合物、抗蚀图案形成方法、电路图案形成方法及纯化方法
WO2021075450A1 (ja) * 2019-10-16 2021-04-22 住友ベークライト株式会社 ポリマーおよび樹脂組成物
CN116041201A (zh) * 2022-12-30 2023-05-02 黑龙江迪诺医药有限公司 碘佛醇中间体的制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002258485A (ja) 2001-02-28 2002-09-11 Asahi Kasei Corp 感光性樹脂組成物
JP2006349700A (ja) 2005-05-18 2006-12-28 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造方法及び電子部品
WO2007029614A1 (ja) 2005-09-05 2007-03-15 Asahi Kasei Emd Corporation ポジ型感光性樹脂組成物

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JPS5865720A (ja) * 1981-10-14 1983-04-19 Japan Synthetic Rubber Co Ltd ポリアミド系熱可塑性樹脂
JP4288796B2 (ja) * 1999-10-29 2009-07-01 日立化成デュポンマイクロシステムズ株式会社 ネガ型感光性樹脂組成物、パターンの製造法及び電子部品
JP2004294553A (ja) * 2003-03-25 2004-10-21 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN101273303B (zh) * 2005-10-26 2011-07-06 旭化成电子材料株式会社 正型感光性树脂组合物
JP2007199685A (ja) * 2005-12-28 2007-08-09 Fujifilm Electronic Materials Co Ltd 光硬化性着色組成物及びカラーフィルタ、並びに液晶表示装置
JP4625769B2 (ja) * 2006-01-24 2011-02-02 富士フイルム株式会社 感光性樹脂組成物及びそれを用いた半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002258485A (ja) 2001-02-28 2002-09-11 Asahi Kasei Corp 感光性樹脂組成物
JP2006349700A (ja) 2005-05-18 2006-12-28 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造方法及び電子部品
WO2007029614A1 (ja) 2005-09-05 2007-03-15 Asahi Kasei Emd Corporation ポジ型感光性樹脂組成物

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Publication number Publication date
CN101827880A (zh) 2010-09-08
TWI386436B (zh) 2013-02-21
WO2009081950A1 (ja) 2009-07-02
TW200940601A (en) 2009-10-01
JPWO2009081950A1 (ja) 2011-05-06
CN101827880B (zh) 2013-08-21
KR20100054163A (ko) 2010-05-24
JP5498170B2 (ja) 2014-05-21

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