JP5498170B2 - 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物 - Google Patents

耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物 Download PDF

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JP5498170B2
JP5498170B2 JP2009547116A JP2009547116A JP5498170B2 JP 5498170 B2 JP5498170 B2 JP 5498170B2 JP 2009547116 A JP2009547116 A JP 2009547116A JP 2009547116 A JP2009547116 A JP 2009547116A JP 5498170 B2 JP5498170 B2 JP 5498170B2
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group
compound
acid
resin
resin composition
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JPWO2009081950A1 (ja
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隆行 金田
由香 佐々木
智史 渋井
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Asahi Kasei E Materials Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2009547116A 2007-12-26 2008-12-24 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物 Expired - Fee Related JP5498170B2 (ja)

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JP2009547116A JP5498170B2 (ja) 2007-12-26 2008-12-24 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007335077 2007-12-26
JP2007335077 2007-12-26
JP2009547116A JP5498170B2 (ja) 2007-12-26 2008-12-24 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物
PCT/JP2008/073472 WO2009081950A1 (ja) 2007-12-26 2008-12-24 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物

Publications (2)

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JPWO2009081950A1 JPWO2009081950A1 (ja) 2011-05-06
JP5498170B2 true JP5498170B2 (ja) 2014-05-21

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JP2009547116A Expired - Fee Related JP5498170B2 (ja) 2007-12-26 2008-12-24 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物

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JP (1) JP5498170B2 (zh)
KR (1) KR101175080B1 (zh)
CN (1) CN101827880B (zh)
TW (1) TWI386436B (zh)
WO (1) WO2009081950A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021039843A1 (ja) * 2019-08-27 2021-03-04 三菱瓦斯化学株式会社 リソグラフィー用膜形成組成物、レジストパターン形成方法、回路パターン形成方法及び精製方法

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009145158A1 (ja) * 2008-05-29 2009-12-03 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法及び半導体装置
WO2010001780A1 (ja) * 2008-07-03 2010-01-07 旭化成イーマテリアルズ株式会社 耐熱性樹脂前駆体及びそれを用いた感光性樹脂組成物
JP5649118B2 (ja) * 2008-10-20 2015-01-07 日本化薬株式会社 ポリイミド樹脂及びその組成物
JP5562585B2 (ja) * 2009-07-06 2014-07-30 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
CN102439520B (zh) * 2010-04-28 2014-08-27 旭化成电子材料株式会社 感光性树脂组合物
JP6094271B2 (ja) * 2012-03-05 2017-03-15 味の素株式会社 感光性樹脂組成物
CN103342878B (zh) * 2013-06-21 2015-12-09 华东理工大学 基于聚苯并唑和热固性树脂的分子复合材料及制备方法
JP6240471B2 (ja) * 2013-11-01 2017-11-29 東京応化工業株式会社 反応現像画像形成法
JP6459191B2 (ja) * 2014-03-19 2019-01-30 東レ株式会社 感光性樹脂組成物
CN107430334B (zh) * 2015-01-23 2021-07-30 艾曲迪微系统股份有限公司 正型感光性树脂组合物、图案固化膜的制造方法、图案固化膜和电子部件
KR102117237B1 (ko) * 2015-10-21 2020-06-01 쇼와 덴코 가부시키가이샤 포지티브형 감광성 수지 조성물
WO2017073481A1 (ja) * 2015-10-28 2017-05-04 東レ株式会社 ポジ型感光性樹脂組成物、感光性シート、硬化膜、層間絶縁膜、半導体保護膜、半導体装置の製造方法、半導体電子部品および半導体装置
WO2017086360A1 (ja) * 2015-11-16 2017-05-26 三井化学株式会社 半導体用膜組成物、半導体用膜組成物の製造方法、半導体用部材の製造方法、半導体用工程材の製造方法及び半導体装置
KR20180101440A (ko) * 2016-02-05 2018-09-12 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 포지티브형 감광성 수지 조성물
US11592744B2 (en) 2016-02-05 2023-02-28 Hd Microsystems, Ltd. Positive-type photosensitive resin composition
WO2018056013A1 (ja) * 2016-09-20 2018-03-29 太陽ホールディングス株式会社 ポジ型感光性樹脂組成物、ドライフィルム、硬化物、プリント配線板および半導体素子
JP7255972B2 (ja) * 2017-04-20 2023-04-11 三星電子株式会社 ポリ（アミド－イミド）コポリマー、ポリ（アミド－イミド）コポリマーを含む成形品、および表示装置
JP6800105B2 (ja) * 2017-07-21 2020-12-16 信越化学工業株式会社 有機膜形成用組成物、パターン形成方法、及び有機膜形成用樹脂
JP7264688B2 (ja) * 2019-03-27 2023-04-25 太陽ホールディングス株式会社 感光性樹脂組成物、ドライフィルム、硬化物、及び、電子部品
WO2021075450A1 (ja) * 2019-10-16 2021-04-22 住友ベークライト株式会社 ポリマーおよび樹脂組成物
CN116041201A (zh) * 2022-12-30 2023-05-02 黑龙江迪诺医药有限公司 碘佛醇中间体的制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5865720A (ja) * 1981-10-14 1983-04-19 Japan Synthetic Rubber Co Ltd ポリアミド系熱可塑性樹脂
JP2001125267A (ja) * 1999-10-29 2001-05-11 Hitachi Chemical Dupont Microsystems Ltd ネガ型感光性樹脂組成物、パターンの製造法及び電子部品
JP2002258485A (ja) * 2001-02-28 2002-09-11 Asahi Kasei Corp 感光性樹脂組成物
JP2004294553A (ja) * 2003-03-25 2004-10-21 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2006349700A (ja) * 2005-05-18 2006-12-28 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造方法及び電子部品
WO2007029614A1 (ja) * 2005-09-05 2007-03-15 Asahi Kasei Emd Corporation ポジ型感光性樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101273303B (zh) * 2005-10-26 2011-07-06 旭化成电子材料株式会社 正型感光性树脂组合物
JP2007199685A (ja) * 2005-12-28 2007-08-09 Fujifilm Electronic Materials Co Ltd 光硬化性着色組成物及びカラーフィルタ、並びに液晶表示装置
JP4625769B2 (ja) * 2006-01-24 2011-02-02 富士フイルム株式会社 感光性樹脂組成物及びそれを用いた半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5865720A (ja) * 1981-10-14 1983-04-19 Japan Synthetic Rubber Co Ltd ポリアミド系熱可塑性樹脂
JP2001125267A (ja) * 1999-10-29 2001-05-11 Hitachi Chemical Dupont Microsystems Ltd ネガ型感光性樹脂組成物、パターンの製造法及び電子部品
JP2002258485A (ja) * 2001-02-28 2002-09-11 Asahi Kasei Corp 感光性樹脂組成物
JP2004294553A (ja) * 2003-03-25 2004-10-21 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2006349700A (ja) * 2005-05-18 2006-12-28 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造方法及び電子部品
WO2007029614A1 (ja) * 2005-09-05 2007-03-15 Asahi Kasei Emd Corporation ポジ型感光性樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021039843A1 (ja) * 2019-08-27 2021-03-04 三菱瓦斯化学株式会社 リソグラフィー用膜形成組成物、レジストパターン形成方法、回路パターン形成方法及び精製方法

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CN101827880A (zh) 2010-09-08
TWI386436B (zh) 2013-02-21
KR101175080B1 (ko) 2012-10-26
WO2009081950A1 (ja) 2009-07-02
TW200940601A (en) 2009-10-01
JPWO2009081950A1 (ja) 2011-05-06
CN101827880B (zh) 2013-08-21
KR20100054163A (ko) 2010-05-24

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