KR101160704B1 - 현상 장치 및 현상 방법 - Google Patents

현상 장치 및 현상 방법 Download PDF

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Publication number
KR101160704B1
KR101160704B1 KR1020067012793A KR20067012793A KR101160704B1 KR 101160704 B1 KR101160704 B1 KR 101160704B1 KR 1020067012793 A KR1020067012793 A KR 1020067012793A KR 20067012793 A KR20067012793 A KR 20067012793A KR 101160704 B1 KR101160704 B1 KR 101160704B1
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South Korea
Prior art keywords
developer
nozzle
wafer
substrate
developing
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Expired - Fee Related
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KR1020067012793A
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English (en)
Korean (ko)
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KR20070007262A (ko
Inventor
아츠시 오코우치
타로 야마모토
히로후미 타케구찌
히데하루 쿄다
쿄스케 요시하라
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도쿄엘렉트론가부시키가이샤
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Publication of KR20070007262A publication Critical patent/KR20070007262A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
KR1020067012793A 2003-12-26 2004-12-24 현상 장치 및 현상 방법 Expired - Fee Related KR101160704B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003435897 2003-12-26
JPJP-P-2003-00435897 2003-12-26
JP2004233617A JP4369325B2 (ja) 2003-12-26 2004-08-10 現像装置及び現像処理方法
JPJP-P-2004-00233617 2004-08-10
PCT/JP2004/019417 WO2005064656A1 (ja) 2003-12-26 2004-12-24 現像装置及び現像方法

Publications (2)

Publication Number Publication Date
KR20070007262A KR20070007262A (ko) 2007-01-15
KR101160704B1 true KR101160704B1 (ko) 2012-06-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067012793A Expired - Fee Related KR101160704B1 (ko) 2003-12-26 2004-12-24 현상 장치 및 현상 방법

Country Status (7)

Country Link
US (2) US7823534B2 (enExample)
EP (1) EP1708252A4 (enExample)
JP (1) JP4369325B2 (enExample)
KR (1) KR101160704B1 (enExample)
CN (2) CN101697065B (enExample)
TW (1) TWI272670B (enExample)
WO (1) WO2005064656A1 (enExample)

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JP7308048B2 (ja) * 2019-02-15 2023-07-13 株式会社Ｓｃｒｅｅｎホールディングス 液処理装置および液処理方法
CN109821702B (zh) * 2019-03-26 2020-11-10 重庆京东方显示技术有限公司 涂布设备及涂布方法
JP7304737B2 (ja) * 2019-05-14 2023-07-07 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7314634B2 (ja) * 2019-06-11 2023-07-26 東京エレクトロン株式会社 塗布装置及び塗布方法
JP6814847B2 (ja) * 2019-06-19 2021-01-20 株式会社Ｓｃｒｅｅｎホールディングス 現像方法
JP7331568B2 (ja) 2019-09-12 2023-08-23 東京エレクトロン株式会社 液処理装置及び液処理装置の液検出方法
CN113391528A (zh) * 2020-03-11 2021-09-14 长鑫存储技术有限公司 改善光阻显影均匀性的方法
KR102666439B1 (ko) 2020-04-08 2024-05-17 세메스 주식회사 노즐 장치 및 기판 처리 장치
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CN114832957A (zh) * 2022-05-13 2022-08-02 上海芯源微企业发展有限公司 一种显影喷嘴

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US8026048B2 (en) 2011-09-27
CN1918694A (zh) 2007-02-21
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