KR100748821B1 - 반도체집적회로장치및그의제조방법 - Google Patents

반도체집적회로장치및그의제조방법 Download PDF

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Publication number
KR100748821B1
KR100748821B1 KR1019980055718A KR19980055718A KR100748821B1 KR 100748821 B1 KR100748821 B1 KR 100748821B1 KR 1019980055718 A KR1019980055718 A KR 1019980055718A KR 19980055718 A KR19980055718 A KR 19980055718A KR 100748821 B1 KR100748821 B1 KR 100748821B1
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KR
South Korea
Prior art keywords
insulating film
film
wiring
forming
memory cell
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Expired - Lifetime
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KR1019980055718A
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English (en)
Korean (ko)
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KR19990063156A (ko
Inventor
요시따까 나까무라
이사무 아사노
게이조 가와끼따
사또루 야마다
Original Assignee
엘피다 메모리, 아이엔씨.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/315—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/48—Data lines or contacts therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1019980055718A 1997-12-18 1998-12-17 반도체집적회로장치및그의제조방법 Expired - Lifetime KR100748821B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34882397A JP3599548B2 (ja) 1997-12-18 1997-12-18 半導体集積回路装置の製造方法
JP97-348823 1997-12-18

Publications (2)

Publication Number Publication Date
KR19990063156A KR19990063156A (ko) 1999-07-26
KR100748821B1 true KR100748821B1 (ko) 2007-10-16

Family

ID=18399621

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980055718A Expired - Lifetime KR100748821B1 (ko) 1997-12-18 1998-12-17 반도체집적회로장치및그의제조방법

Country Status (4)

Country Link
US (2) US6734060B2 (enExample)
JP (1) JP3599548B2 (enExample)
KR (1) KR100748821B1 (enExample)
TW (1) TW445633B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3599548B2 (ja) * 1997-12-18 2004-12-08 株式会社日立製作所 半導体集積回路装置の製造方法
JP5775018B2 (ja) * 1999-10-13 2015-09-09 ソニー株式会社 半導体装置
JP4441974B2 (ja) * 2000-03-24 2010-03-31 ソニー株式会社 半導体装置の製造方法
JP2001291844A (ja) * 2000-04-06 2001-10-19 Fujitsu Ltd 半導体装置及びその製造方法
WO2001080318A1 (fr) * 2000-04-14 2001-10-25 Fujitsu Limited Dispositif semi-conducteur et procede de fabrication
KR100402943B1 (ko) * 2000-06-19 2003-10-30 주식회사 하이닉스반도체 고유전체 캐패시터 및 그 제조 방법
US6232168B1 (en) * 2000-08-25 2001-05-15 Micron Technology, Inc. Memory circuitry and method of forming memory circuitry
JP4056392B2 (ja) * 2001-01-30 2008-03-05 株式会社ルネサステクノロジ 半導体集積回路装置
JP2002313757A (ja) 2001-04-17 2002-10-25 Hitachi Ltd 半導体集積回路装置の製造方法
KR100459707B1 (ko) * 2002-03-21 2004-12-04 삼성전자주식회사 실린더형 커패시터를 포함하는 반도체 소자 및 그 제조 방법
JP4536314B2 (ja) * 2002-06-18 2010-09-01 ルネサスエレクトロニクス株式会社 半導体記憶装置及び半導体記憶装置の製造方法
KR100502410B1 (ko) * 2002-07-08 2005-07-19 삼성전자주식회사 디램 셀들
KR100538098B1 (ko) * 2003-08-18 2005-12-21 삼성전자주식회사 개선된 구조적 안정성 및 향상된 캐패시턴스를 갖는캐패시터를 포함하는 반도체 장치 및 그 제조 방법
JP2005093714A (ja) * 2003-09-17 2005-04-07 Nec Electronics Corp 半導体装置およびその製造方法
WO2005083781A1 (en) * 2004-01-30 2005-09-09 International Business Machines Corporation Folded node trench capacitor
US7605033B2 (en) * 2004-09-01 2009-10-20 Micron Technology, Inc. Low resistance peripheral local interconnect contacts with selective wet strip of titanium
JP2006245113A (ja) * 2005-03-01 2006-09-14 Elpida Memory Inc 半導体記憶装置の製造方法
US8405216B2 (en) * 2005-06-29 2013-03-26 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect structure for integrated circuits
KR100766233B1 (ko) 2006-05-15 2007-10-10 주식회사 하이닉스반도체 플래쉬 메모리 소자 및 그의 제조 방법
US8148223B2 (en) 2006-05-22 2012-04-03 Taiwan Semiconductor Manufacturing Co., Ltd. 1T MIM memory for embedded ram application in soc
JP4966116B2 (ja) * 2007-07-09 2012-07-04 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2012084738A (ja) * 2010-10-13 2012-04-26 Elpida Memory Inc 半導体装置及びその製造方法、並びにデータ処理システム
US20120223413A1 (en) 2011-03-04 2012-09-06 Nick Lindert Semiconductor structure having a capacitor and metal wiring integrated in a same dielectric layer
DE102012023023B4 (de) 2012-11-26 2023-02-16 Ottobock Se & Co. Kgaa Orthopädietechnische Vorrichtung
DE102017216937A1 (de) * 2017-09-25 2019-03-28 Robert Bosch Gmbh Verfahren zum Herstellen zumindest einer Durchkontaktierung in einem Wafer
US11158571B2 (en) * 2018-12-20 2021-10-26 Micron Technology, Inc. Devices including conductive interconnect structures, related electronic systems, and related methods
KR20220034973A (ko) * 2020-09-11 2022-03-21 삼성전자주식회사 이미지 센서

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940016735A (ko) * 1992-12-31 1994-07-25 김주용 반도체 소자의 금속 배선 제조 방법
KR950021225A (ko) * 1993-12-23 1995-07-26 김주용 산화막을 이용한 금속배선 형성방법
JPH08204012A (ja) * 1994-07-29 1996-08-09 Nec Corp 半導体装置及びその製造方法
JPH0992794A (ja) * 1995-09-22 1997-04-04 Toshiba Corp 半導体記憶装置の製造方法
JPH09321242A (ja) * 1996-05-30 1997-12-12 Hitachi Ltd 半導体集積回路装置およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
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KR100307602B1 (ko) * 1993-08-30 2001-12-15 가나이 쓰도무 반도체집적회로장치및그제조방법
JPH09107082A (ja) * 1995-08-09 1997-04-22 Hitachi Ltd 半導体集積回路装置の製造方法
KR100375428B1 (ko) * 1995-11-20 2003-05-17 가부시끼가이샤 히다치 세이사꾸쇼 반도체기억장치 및 그 제조방법
CN1150624C (zh) * 1995-12-08 2004-05-19 株式会社日立制作所 半导体集成电路器件及其制造方法
SG54456A1 (en) * 1996-01-12 1998-11-16 Hitachi Ltd Semconductor integrated circuit device and method for manufacturing the same
JPH09321239A (ja) * 1996-05-30 1997-12-12 Hitachi Ltd 半導体集積回路装置の製造方法
JP3563530B2 (ja) * 1996-05-31 2004-09-08 株式会社日立製作所 半導体集積回路装置
US6815762B2 (en) * 1997-05-30 2004-11-09 Hitachi, Ltd. Semiconductor integrated circuit device and process for manufacturing the same including spacers on bit lines
KR100213209B1 (ko) * 1996-07-29 1999-08-02 윤종용 반도체장치의 제조방법
TW377495B (en) * 1996-10-04 1999-12-21 Hitachi Ltd Method of manufacturing semiconductor memory cells and the same apparatus
JP3599548B2 (ja) * 1997-12-18 2004-12-08 株式会社日立製作所 半導体集積回路装置の製造方法
JP3697044B2 (ja) * 1997-12-19 2005-09-21 株式会社ルネサステクノロジ 半導体集積回路装置およびその製造方法
JPH11243180A (ja) * 1998-02-25 1999-09-07 Sony Corp 半導体装置の製造方法
US5956594A (en) * 1998-11-02 1999-09-21 Vanguard International Semiconductor Corporation Method for simultaneously forming capacitor plate and metal contact structures for a high density DRAM device
US6143601A (en) * 1998-12-09 2000-11-07 United Microelectronics Corp. Method of fabricating DRAM

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940016735A (ko) * 1992-12-31 1994-07-25 김주용 반도체 소자의 금속 배선 제조 방법
KR950021225A (ko) * 1993-12-23 1995-07-26 김주용 산화막을 이용한 금속배선 형성방법
JPH08204012A (ja) * 1994-07-29 1996-08-09 Nec Corp 半導体装置及びその製造方法
JPH0992794A (ja) * 1995-09-22 1997-04-04 Toshiba Corp 半導体記憶装置の製造方法
JPH09321242A (ja) * 1996-05-30 1997-12-12 Hitachi Ltd 半導体集積回路装置およびその製造方法

Also Published As

Publication number Publication date
US6734060B2 (en) 2004-05-11
JPH11204753A (ja) 1999-07-30
US20030006441A1 (en) 2003-01-09
KR19990063156A (ko) 1999-07-26
JP3599548B2 (ja) 2004-12-08
US7145193B2 (en) 2006-12-05
US20040046195A1 (en) 2004-03-11
TW445633B (en) 2001-07-11

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