KR100730037B1 - 기판 반송 장치 - Google Patents
기판 반송 장치 Download PDFInfo
- Publication number
- KR100730037B1 KR100730037B1 KR1020050110974A KR20050110974A KR100730037B1 KR 100730037 B1 KR100730037 B1 KR 100730037B1 KR 1020050110974 A KR1020050110974 A KR 1020050110974A KR 20050110974 A KR20050110974 A KR 20050110974A KR 100730037 B1 KR100730037 B1 KR 100730037B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- board
- horizontal direction
- air
- air stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
- B65G49/069—Means for avoiding damage to stacked plate glass, e.g. by interposing paper or powder spacers in the stack
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
- B65G2207/40—Safety features of loads, equipment or persons
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Registering Or Overturning Sheets (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2004-00346075 | 2004-11-30 | ||
| JP2004346075 | 2004-11-30 | ||
| JP2005174727A JP4754885B2 (ja) | 2004-11-30 | 2005-06-15 | 基板搬送装置 |
| JPJP-P-2005-00174727 | 2005-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060060569A KR20060060569A (ko) | 2006-06-05 |
| KR100730037B1 true KR100730037B1 (ko) | 2007-06-20 |
Family
ID=36735954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050110974A Expired - Fee Related KR100730037B1 (ko) | 2004-11-30 | 2005-11-18 | 기판 반송 장치 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4754885B2 (enExample) |
| KR (1) | KR100730037B1 (enExample) |
| TW (1) | TWI272235B (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100788876B1 (ko) * | 2006-08-25 | 2007-12-27 | 주식회사 태성기연 | 판유리 방향전환장치 |
| KR101303053B1 (ko) * | 2006-12-27 | 2013-09-03 | 엘지디스플레이 주식회사 | 액정표시장치 제조 장치 |
| JP4344755B2 (ja) * | 2007-04-09 | 2009-10-14 | 株式会社日本設計工業 | 薄板状材料搬送用ローラユニット及び薄板状材料搬送装置 |
| JP4900115B2 (ja) * | 2007-07-27 | 2012-03-21 | 株式会社Ihi | 搬送方向転換装置及び浮上搬送システム |
| JP5125290B2 (ja) * | 2007-07-27 | 2013-01-23 | 株式会社Ihi | 浮上搬送装置及び処理搬送システム |
| KR100959286B1 (ko) | 2008-01-18 | 2010-05-26 | 주식회사 에스에프에이 | 기판 이송장치 |
| KR100924266B1 (ko) * | 2008-01-18 | 2009-10-30 | 주식회사 에스에프에이 | 기판 이송장치 |
| JP5355056B2 (ja) * | 2008-12-01 | 2013-11-27 | 株式会社妙徳 | 浮上装置および流体噴出体ユニット |
| KR200470005Y1 (ko) | 2008-12-29 | 2013-11-21 | 주식회사 탑 엔지니어링 | 디스펜서 스테이지 |
| JP5446403B2 (ja) * | 2009-04-07 | 2014-03-19 | 株式会社Ihi | 搬送方向転換装置及び浮上搬送システム |
| JP2011031143A (ja) * | 2009-07-30 | 2011-02-17 | Ulvac Japan Ltd | 回転機能付きステージ |
| JP5445863B2 (ja) * | 2010-08-04 | 2014-03-19 | 株式会社ダイフク | 板状体搬送装置 |
| JP5645709B2 (ja) * | 2011-02-25 | 2014-12-24 | オイレス工業株式会社 | 非接触搬送装置 |
| CN103508187A (zh) * | 2012-06-29 | 2014-01-15 | 江苏瑞新科技股份有限公司 | 一种自动翻转上料装置 |
| KR101533370B1 (ko) * | 2013-10-10 | 2015-07-02 | 이노이엔지주식회사 | 기판이송장치 |
| KR102463088B1 (ko) * | 2019-01-11 | 2022-11-02 | 동우 화인켐 주식회사 | 광학 필름 접합 방법 및 접합 장치 |
| KR102870040B1 (ko) * | 2020-07-07 | 2025-10-13 | 세메스 주식회사 | 약액 토출 장치 |
| CN120002742B (zh) * | 2025-04-17 | 2025-07-11 | 常州市南挂车辆部件有限公司 | 一种具有多重固定功能的组合灯具壳体加工用切割装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000340635A (ja) * | 1999-05-28 | 2000-12-08 | Orc Mfg Co Ltd | 基板の搬送手段および搬送機構ならびに露光装置 |
| JP2003051529A (ja) * | 2001-05-30 | 2003-02-21 | Tokyo Electron Ltd | 搬送装置 |
| JP2003226424A (ja) * | 2002-02-06 | 2003-08-12 | Orc Mfg Co Ltd | 予備位置決め機構およびその方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63178229A (ja) * | 1987-01-20 | 1988-07-22 | Fuji Photo Film Co Ltd | ポジ型フオトレジスト組成物 |
| JPH08282842A (ja) * | 1995-04-18 | 1996-10-29 | Hitachi Kiden Kogyo Ltd | 空気浮上式リニアモータ駆動搬送路における分岐装置 |
| JP2000072251A (ja) * | 1998-08-31 | 2000-03-07 | Watanabe Shoko:Kk | 浮上搬送装置および浮上搬送システム |
| JP2001085496A (ja) * | 1999-09-10 | 2001-03-30 | Daiichi Shisetsu Kogyo Kk | 板状部材の搬送装置 |
| JP4312475B2 (ja) * | 2003-03-05 | 2009-08-12 | 株式会社渡辺商行 | 基板搬送ガイドおよび同ユニット並びに基板搬送装置 |
| JP4418428B2 (ja) * | 2003-04-30 | 2010-02-17 | オリンパス株式会社 | 基板浮上装置 |
| JP4244000B2 (ja) * | 2003-08-29 | 2009-03-25 | 株式会社ダイフク | 搬送装置 |
| JP4244007B2 (ja) * | 2003-11-14 | 2009-03-25 | 株式会社ダイフク | 搬送装置 |
-
2005
- 2005-06-15 JP JP2005174727A patent/JP4754885B2/ja not_active Expired - Lifetime
- 2005-11-14 TW TW094139893A patent/TWI272235B/zh not_active IP Right Cessation
- 2005-11-18 KR KR1020050110974A patent/KR100730037B1/ko not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000340635A (ja) * | 1999-05-28 | 2000-12-08 | Orc Mfg Co Ltd | 基板の搬送手段および搬送機構ならびに露光装置 |
| JP2003051529A (ja) * | 2001-05-30 | 2003-02-21 | Tokyo Electron Ltd | 搬送装置 |
| JP2003226424A (ja) * | 2002-02-06 | 2003-08-12 | Orc Mfg Co Ltd | 予備位置決め機構およびその方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI272235B (en) | 2007-02-01 |
| JP2006182560A (ja) | 2006-07-13 |
| KR20060060569A (ko) | 2006-06-05 |
| JP4754885B2 (ja) | 2011-08-24 |
| TW200621608A (en) | 2006-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20100614 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20100614 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |