KR100717479B1 - 시험 장치를 위한 접속 유닛 - Google Patents
시험 장치를 위한 접속 유닛 Download PDFInfo
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- KR100717479B1 KR100717479B1 KR1020047003739A KR20047003739A KR100717479B1 KR 100717479 B1 KR100717479 B1 KR 100717479B1 KR 1020047003739 A KR1020047003739 A KR 1020047003739A KR 20047003739 A KR20047003739 A KR 20047003739A KR 100717479 B1 KR100717479 B1 KR 100717479B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
Claims (25)
- IC 소켓이 탑재된 피측정 디바이스 탑재보드와, 상기 IC 소켓에 지지되는 전자 디바이스를 시험하는 시험장치를 전기적으로 접속하는 접속 유닛에 있어서,상기 피측정 디바이스 탑재 보드와 대향하여 설치되는 지지 기판; 및상기 지지 기판상에 있어서의 위치가 변경 가능하도록 상기 지지 기판상에 설치되며, 상기 피측정 디바이스 탑재보드가 구비하는 퍼포먼스 보드측 커넥터와 접속되는 접속 유닛측 커넥터를 포함하는 접속 유닛.
- 제1항에 있어서,상기 지지 기판은, 상기 피측정 디바이스 탑재보드의 종류에 따라 상기 퍼포먼스 보드측 커넥터가 다른 배치 위치로 되는 경우, 상기 다른 배치 위치에 대응하는 위치로 상기 접속 유닛측 커넥터를 이동하여 지지 가능한 구조를 갖는 접속 유닛.
- 제1항 또는 제2항에 있어서,상기 지지 기판은, 상기 접속 유닛측 커넥터를 착탈하는 것이 가능하며,상기 접속 유닛측 커넥터를 상기 지지 기판에서 분리하여, 상기 퍼포먼스 보드측 커넥터의 배치 위치가 다른 타 피측정 디바이스 탑재보드에 대응한 배치 위치 관계가 되는 다른 지지 기판으로 교환 가능한 구조를 갖는 접속 유닛.
- 제1항에 있어서,상기 접속 유닛은 상기 접속 유닛측 커넥터를 복수개 포함하며,상기 지지 기판상에 있어서, 상기 복수의 접속 유닛측 커넥터 사이의 거리가 변경 가능한 접속 유닛.
- 제1항 또는 제2항에 있어서,상기 접속 유닛측 커넥터는, 상기 접속 유닛과 상기 피측정 디바이스 탑재 보드가 접속했을 경우의 상기 IC 소켓의 탑재 위치에 대한 거리가 변경 가능하도록 설치되는 접속 유닛.
- 제1항 또는 제2항에 있어서,일단이 상기 접속 유닛측 커넥터에 고정되며, 상기 접속 유닛측 커넥터와 상기 시험장치를 전기적으로 접속하는 접속 케이블을 더욱 포함하며,상기 지지 기판은, 상기 접속 유닛측 커넥터를 지지해야 할 위치에 상기 접속 유닛측 커넥터가 통과 가능한 크기의 관통공을 갖는 접속 유닛.
- 제1항 또는 제2항에 있어서,일단이 상기 접속 유닛측 커넥터에 고정되며, 상기 접속 유닛측 커넥터와 상기 시험장치를 전기적으로 접속하는 접속 케이블을 더욱 포함하며,상기 지지 기판은, 상기 접속 유닛측 커넥터가 변경 가능한 복수의 위치 사이에 걸쳐서 형성되며, 상기 접속 케이블이 통과하는 관통공을 갖는 접속 유닛.
- 제1항 또는 제2항에 있어서,상기 지지 기판은, 상기 접속 유닛과 상기 피측정 디바이스 탑재보드가 접속된 경우의 상기 IC 소켓의 탑재 위치를 중심으로 해서, 직경 방향 및 둘레 방향 중 적어도 어느 하나의 방향으로 위치가 변경 가능하도록 상기 접속 유닛측 커넥터를 지지하는 접속 유닛.
- 제8항에 있어서,상기 지지 기판과 실질적으로 평행한 면에 있어서의 상기 IC 소켓 및 상기 접속 유닛측 커넥터의 단면은 각각 직사각형이며,상기 지지 기판은, 상기 직경 방향에서 상기 접속 유닛측 커넥터를 상기 IC 소켓의 탑재 위치에 가장 가까운 위치에 지지하는 경우, 상기 접속 유닛측 커넥터의 상기 단면의 장변이 상기 IC 소켓의 상기 단면의 가장 가까운 변과 대향하도록 상기 접속 유닛측 커넥터를 지지하는 접속 유닛.
- 제1항 또는 제2항에 있어서,상기 지지 기판은, 상기 지지 기판상에 있어서 복수의 소정 위치에 각각 설치되며, 상기 접속 유닛측 커넥터가 변경 가능한 위치를 지정하는, 복수의 커넥터 위치결정부재를 포함하는 접속 유닛.
- 제9항에 있어서,상기 접속 유닛측 커넥터는, 서로 결합하는 홈 또는 돌기를 가지며,상기 복수의 커넥터 위치결정부재는 돌기 또는 홈을 갖고,상기 지지 기판은, 상기 접속 유닛측 커넥터의 상기 홈 또는 돌기와, 상기 커넥터 위치결정부재의 상기 돌기 또는 홈을 결합시키는 것에 의해, 상기 접속 유닛측 커넥터를 지지하는 접속 유닛.
- 제1항에 있어서,상기 접속 유닛은, 상기 피측정 디바이스 탑재 보드에 탑재된 복수의 상기 IC 소켓에 대응하여 설치되는 복수의 상기 접속 유닛측 커넥터를 포함하며,상기 지지 기판은 상기 복수의 접속 유닛측 커넥터의 각각을 상기 지지 기판상에 있어서의 위치가 변경 가능하도록 지지하는 접속 유닛.
- 제1항 또는 제2항에 있어서,상기 지지 기판상에 설치되며, 직경이 소정 크기 이하인 상기 피측정 디바이스 탑재 보드를 지지하는 위치를 결정하는 소구경 퍼포먼스 보드 위치결정부재; 및직경이 상기 소정 크기보다 큰 상기 피측정 디바이스 탑재 보드를 지지하는 위치를 결정하는 대구경 퍼포먼스 보드 위치결정부재를 더욱 포함하되,상기 지지 기판상에 있어서, 상기 IC 소켓의 탑재 위치로부터 상기 대구경 퍼포먼스 보드 위치결정부재까지의 거리가, 상기 IC 소켓의 탑재 위치로부터 상기 소구경 퍼포먼스 보드 위치결정부재까지의 거리보다 긴, 접속 유닛.
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Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2002317287 | 2002-10-31 | ||
JPJP-P-2002-00317287 | 2002-10-31 | ||
JPJP-P-2002-00338560 | 2002-11-21 | ||
JP2002338560 | 2002-11-21 |
Related Child Applications (1)
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KR1020077000927A Division KR100774035B1 (ko) | 2002-10-31 | 2003-10-24 | 피측정 디바이스 탑재보드 및 프로브 카드 |
Publications (2)
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KR20050055619A KR20050055619A (ko) | 2005-06-13 |
KR100717479B1 true KR100717479B1 (ko) | 2007-05-14 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020047003739A KR100717479B1 (ko) | 2002-10-31 | 2003-10-24 | 시험 장치를 위한 접속 유닛 |
KR1020077009289A KR100905133B1 (ko) | 2002-10-31 | 2003-10-24 | 피측정 디바이스 탑재보드 및 디바이스 인터페이스부 |
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KR1020077009289A KR100905133B1 (ko) | 2002-10-31 | 2003-10-24 | 피측정 디바이스 탑재보드 및 디바이스 인터페이스부 |
Country Status (8)
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US (3) | US7098680B2 (ko) |
JP (2) | JP4188917B2 (ko) |
KR (2) | KR100717479B1 (ko) |
CN (1) | CN100344976C (ko) |
AU (1) | AU2003275636A1 (ko) |
DE (1) | DE10392309T5 (ko) |
TW (1) | TWI235238B (ko) |
WO (1) | WO2004040325A1 (ko) |
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Also Published As
Publication number | Publication date |
---|---|
KR100905133B1 (ko) | 2009-06-29 |
CN100344976C (zh) | 2007-10-24 |
CN1556928A (zh) | 2004-12-22 |
JPWO2004040325A1 (ja) | 2006-03-02 |
JP5143921B2 (ja) | 2013-02-13 |
US20070024307A1 (en) | 2007-02-01 |
KR20070056158A (ko) | 2007-05-31 |
TWI235238B (en) | 2005-07-01 |
KR20050055619A (ko) | 2005-06-13 |
US20090160467A1 (en) | 2009-06-25 |
US7518379B2 (en) | 2009-04-14 |
US20040174180A1 (en) | 2004-09-09 |
US7791360B2 (en) | 2010-09-07 |
DE10392309T5 (de) | 2005-01-05 |
TW200416396A (en) | 2004-09-01 |
US7098680B2 (en) | 2006-08-29 |
JP4188917B2 (ja) | 2008-12-03 |
WO2004040325A1 (ja) | 2004-05-13 |
JP2011154033A (ja) | 2011-08-11 |
AU2003275636A1 (en) | 2004-05-25 |
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