KR100708237B1 - 진공 프로세서내의 유전 가공품의 정전 디척킹 방법 및 장치 - Google Patents

진공 프로세서내의 유전 가공품의 정전 디척킹 방법 및 장치 Download PDF

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Publication number
KR100708237B1
KR100708237B1 KR1020017004017A KR20017004017A KR100708237B1 KR 100708237 B1 KR100708237 B1 KR 100708237B1 KR 1020017004017 A KR1020017004017 A KR 1020017004017A KR 20017004017 A KR20017004017 A KR 20017004017A KR 100708237 B1 KR100708237 B1 KR 100708237B1
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workpiece
chuck
plasma
voltage
processing
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KR20010083878A (ko
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아써 엠. 하월드
존 피. 홀랜드
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020017004017A 1998-09-30 1999-09-10 진공 프로세서내의 유전 가공품의 정전 디척킹 방법 및 장치 Expired - Lifetime KR100708237B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/163,370 1998-09-30
US09/163,370 US6125025A (en) 1998-09-30 1998-09-30 Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors

Publications (2)

Publication Number Publication Date
KR20010083878A KR20010083878A (ko) 2001-09-03
KR100708237B1 true KR100708237B1 (ko) 2007-04-16

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US (1) US6125025A (https=)
JP (4) JP4698025B2 (https=)
KR (1) KR100708237B1 (https=)
AU (1) AU5913699A (https=)
TW (1) TW426930B (https=)
WO (1) WO2000019519A1 (https=)

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JP5135306B2 (ja) 2013-02-06
JP4698025B2 (ja) 2011-06-08
WO2000019519B1 (en) 2000-05-25
WO2000019519A1 (en) 2000-04-06
JP2010050464A (ja) 2010-03-04
US6125025A (en) 2000-09-26
KR20010083878A (ko) 2001-09-03
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JP2002526923A (ja) 2002-08-20
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AU5913699A (en) 2000-04-17

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