KR100660430B1 - 배선단자 접속용 필름, 배선단자의 접속방법 및 배선구조체 - Google Patents

배선단자 접속용 필름, 배선단자의 접속방법 및 배선구조체 Download PDF

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Publication number
KR100660430B1
KR100660430B1 KR1020027002298A KR20027002298A KR100660430B1 KR 100660430 B1 KR100660430 B1 KR 100660430B1 KR 1020027002298 A KR1020027002298 A KR 1020027002298A KR 20027002298 A KR20027002298 A KR 20027002298A KR 100660430 B1 KR100660430 B1 KR 100660430B1
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South Korea
Prior art keywords
wiring
wiring terminal
film
adhesive
terminal connection
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Expired - Lifetime
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KR1020027002298A
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English (en)
Korean (ko)
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KR20020042649A (ko
Inventor
아리후쿠모토히로
와타나베이츠오
모토무라코우지
코바야시코우지
고토야스시
후지나와토오루
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히다치 가세고교 가부시끼가이샤
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Publication of KR20020042649A publication Critical patent/KR20020042649A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1020027002298A 1999-08-25 2000-08-25 배선단자 접속용 필름, 배선단자의 접속방법 및 배선구조체 Expired - Lifetime KR100660430B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23840899 1999-08-25
JPJP-P-1999-00238408 1999-08-25

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020067015010A Division KR100671312B1 (ko) 1999-08-25 2000-08-25 배선단자 접속용 필름
KR1020050034467A Division KR20050049452A (ko) 1999-08-25 2005-04-26 접착제, 배선단자의 접속방법 및 배선구조체

Publications (2)

Publication Number Publication Date
KR20020042649A KR20020042649A (ko) 2002-06-05
KR100660430B1 true KR100660430B1 (ko) 2006-12-22

Family

ID=17029774

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020027002298A Expired - Lifetime KR100660430B1 (ko) 1999-08-25 2000-08-25 배선단자 접속용 필름, 배선단자의 접속방법 및 배선구조체
KR1020067015010A Expired - Lifetime KR100671312B1 (ko) 1999-08-25 2000-08-25 배선단자 접속용 필름
KR1020050034467A Ceased KR20050049452A (ko) 1999-08-25 2005-04-26 접착제, 배선단자의 접속방법 및 배선구조체

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020067015010A Expired - Lifetime KR100671312B1 (ko) 1999-08-25 2000-08-25 배선단자 접속용 필름
KR1020050034467A Ceased KR20050049452A (ko) 1999-08-25 2005-04-26 접착제, 배선단자의 접속방법 및 배선구조체

Country Status (9)

Country Link
US (6) US6939913B1 (https=)
EP (1) EP1229095B1 (https=)
JP (1) JP4499329B2 (https=)
KR (3) KR100660430B1 (https=)
CN (6) CN101906274B (https=)
AU (1) AU6731700A (https=)
DE (1) DE60031436T2 (https=)
TW (2) TWI291982B (https=)
WO (1) WO2001014484A1 (https=)

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EP1229095B1 (en) 2006-10-18
CN101906274A (zh) 2010-12-08
EP1229095A1 (en) 2002-08-07
DE60031436T2 (de) 2007-08-30
KR20050049452A (ko) 2005-05-25
TWI291982B (https=) 2008-01-01
CN101037573A (zh) 2007-09-19
CN1318530C (zh) 2007-05-30
US7241644B2 (en) 2007-07-10
US7777335B2 (en) 2010-08-17
DE60031436D1 (de) 2006-11-30
CN101033376A (zh) 2007-09-12
US20050178502A1 (en) 2005-08-18
CN101906274B (zh) 2012-05-30
KR100671312B1 (ko) 2007-01-19
TWI278501B (en) 2007-04-11
US6939913B1 (en) 2005-09-06
CN101037573B (zh) 2012-01-11
CN1377393A (zh) 2002-10-30
CN101037572A (zh) 2007-09-19
CN101037581A (zh) 2007-09-19
US8120189B2 (en) 2012-02-21
KR20020042649A (ko) 2002-06-05
EP1229095A4 (en) 2002-10-30
AU6731700A (en) 2001-03-19
KR20060093136A (ko) 2006-08-23
US20100330364A1 (en) 2010-12-30
US20100326596A1 (en) 2010-12-30
US8115322B2 (en) 2012-02-14
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US20050176882A1 (en) 2005-08-11
WO2001014484A1 (en) 2001-03-01

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