KR100574497B1 - 비대칭 리세스된 게이트를 갖는 ｍｏｓｆｅｔ 및 그 제조방법 - Google Patents

비대칭 리세스된 게이트를 갖는 ｍｏｓｆｅｔ 및 그 제조방법 Download PDF

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Publication number
KR100574497B1
KR100574497B1 KR1020040112365A KR20040112365A KR100574497B1 KR 100574497 B1 KR100574497 B1 KR 100574497B1 KR 1020040112365 A KR1020040112365 A KR 1020040112365A KR 20040112365 A KR20040112365 A KR 20040112365A KR 100574497 B1 KR100574497 B1 KR 100574497B1
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region
recessed gate
source
gate electrode
semiconductor substrate
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Expired - Fee Related
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KR1020040112365A
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English (en)
Korean (ko)
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서문식
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주식회사 하이닉스반도체
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Priority to KR1020040112365A priority Critical patent/KR100574497B1/ko
Priority to TW094114907A priority patent/TWI293777B/zh
Priority to US11/130,642 priority patent/US7723768B2/en
Priority to JP2005189131A priority patent/JP4999289B2/ja
Priority to CNB2005100821574A priority patent/CN100505311C/zh
Application granted granted Critical
Publication of KR100574497B1 publication Critical patent/KR100574497B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/025—Manufacture or treatment forming recessed gates, e.g. by using local oxidation
    • H10D64/027—Manufacture or treatment forming recessed gates, e.g. by using local oxidation by etching at gate locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/05—Making the transistor
    • H10B12/053—Making the transistor the transistor being at least partially in a trench in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0221—Manufacture or treatment of FETs having insulated gates [IGFET] having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended-drain MOSFETs [EDMOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/608—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having non-planar bodies, e.g. having recessed gate electrodes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Memories (AREA)
KR1020040112365A 2004-12-24 2004-12-24 비대칭 리세스된 게이트를 갖는 ｍｏｓｆｅｔ 및 그 제조방법 Expired - Fee Related KR100574497B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020040112365A KR100574497B1 (ko) 2004-12-24 2004-12-24 비대칭 리세스된 게이트를 갖는 ｍｏｓｆｅｔ 및 그 제조방법
TW094114907A TWI293777B (en) 2004-12-24 2005-05-09 Asymmetric recessed gate mosfet and method for manufacturing the same
US11/130,642 US7723768B2 (en) 2004-12-24 2005-05-16 Asymmetric recessed gate MOSFET and method for manufacturing the same
JP2005189131A JP4999289B2 (ja) 2004-12-24 2005-06-29 非対称リセスされたゲートを有する金属酸化膜半導体電界効果トランジスタ及びその製造方法
CNB2005100821574A CN100505311C (zh) 2004-12-24 2005-07-04 非对称凹陷栅极金属氧化物半导体场效应晶体管及其制法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040112365A KR100574497B1 (ko) 2004-12-24 2004-12-24 비대칭 리세스된 게이트를 갖는 ｍｏｓｆｅｔ 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR100574497B1 true KR100574497B1 (ko) 2006-04-27

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KR1020040112365A Expired - Fee Related KR100574497B1 (ko) 2004-12-24 2004-12-24 비대칭 리세스된 게이트를 갖는 ｍｏｓｆｅｔ 및 그 제조방법

Country Status (5)

Country Link
US (1) US7723768B2 (enExample)
JP (1) JP4999289B2 (enExample)
KR (1) KR100574497B1 (enExample)
CN (1) CN100505311C (enExample)
TW (1) TWI293777B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100842908B1 (ko) 2006-09-30 2008-07-02 주식회사 하이닉스반도체 리세스 게이트를 갖는 반도체 소자 및 그의 제조방법
KR101083644B1 (ko) * 2008-07-04 2011-11-16 주식회사 하이닉스반도체 반도체 장치 및 그 제조방법
KR101204663B1 (ko) * 2006-05-09 2012-11-26 에스케이하이닉스 주식회사 반도체소자의 리세스 게이트 전극 구조 및 그 형성방법
KR101570178B1 (ko) 2008-11-07 2015-11-18 삼성전자주식회사 커패시터 없는 디램 소자

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KR100780620B1 (ko) * 2006-06-30 2007-11-30 주식회사 하이닉스반도체 리세스 게이트를 갖는 반도체소자 및 그 제조 방법
US20080001215A1 (en) 2006-06-30 2008-01-03 Hynix Semiconductor Inc. Semiconductor device having recess gate and method of fabricating the same
KR100781874B1 (ko) * 2006-12-26 2007-12-05 주식회사 하이닉스반도체 반도체 소자의 제조방법
JP2008199027A (ja) * 2007-02-13 2008-08-28 Qimonda Ag ３次元チャネル電界効果トランジスタを備えた集積回路およびその製造方法
KR100908522B1 (ko) 2007-06-28 2009-07-20 주식회사 하이닉스반도체 반도체 소자 및 그 제조 방법
KR101397598B1 (ko) * 2007-07-16 2014-05-23 삼성전자 주식회사 반도체 집적 회로 장치 및 그 제조 방법
KR100875170B1 (ko) * 2007-08-09 2008-12-22 주식회사 동부하이텍 반도체 소자의 리세스 게이트 및 그의 형성 방법
JP5628471B2 (ja) * 2007-12-10 2014-11-19 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置及び半導体装置の製造方法
US20090309139A1 (en) * 2008-06-13 2009-12-17 International Business Machines Corporation Asymmetric gate electrode and method of manufacture
KR101061178B1 (ko) * 2008-12-30 2011-09-01 주식회사 하이닉스반도체 반도체 소자 및 그의 제조방법
KR101077301B1 (ko) * 2009-04-09 2011-10-26 주식회사 하이닉스반도체 낮은 콘택 저항을 가지는 반도체 장치의 제조 방법
KR101078731B1 (ko) 2009-06-09 2011-11-01 주식회사 하이닉스반도체 반도체 소자의 제조방법
CN102446962A (zh) * 2010-10-14 2012-05-09 上海华虹Nec电子有限公司 兼容自对准孔的mosfet闸极膜结构及图形制作方法
JP2012134439A (ja) * 2010-11-30 2012-07-12 Elpida Memory Inc 半導体装置及びその製造方法
US8748989B2 (en) * 2012-02-28 2014-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Fin field effect transistors
KR101853316B1 (ko) 2012-03-29 2018-04-30 삼성전자주식회사 반도체 소자
WO2014158198A1 (en) * 2013-03-29 2014-10-02 Intel Corporation Transistor architecture having extended recessed spacer and source/drain regions and method of making same
US9240482B2 (en) 2014-05-30 2016-01-19 Globalfoundries Inc. Asymmetric stressor DRAM
US10014391B2 (en) 2016-06-28 2018-07-03 International Business Machines Corporation Vertical transport field effect transistor with precise gate length definition
CN113544547B (zh) 2019-03-29 2023-11-10 深圳帧观德芯科技有限公司 辐射检测装置及其制备方法
WO2020198929A1 (en) 2019-03-29 2020-10-08 Shenzhen Xpectvision Technology Co., Ltd. Apparatuses for detecting radiation and their methods of making
US11424360B1 (en) * 2021-02-04 2022-08-23 Nanya Technology Corporation Semiconductor device and method for manufacturing the same
KR20220158340A (ko) * 2021-05-24 2022-12-01 삼성전자주식회사 게이트 구조체를 갖는 반도체 소자들 및 그 형성 방법
EP4123694A1 (en) * 2021-07-22 2023-01-25 Imec VZW A semiconductor structure with an epitaxial layer stack for fabricating back-side contacts
CN115004377B (zh) * 2022-05-06 2025-03-07 长江先进存储产业创新中心有限责任公司 具有带有升高源极/漏极的凹槽式沟道晶体管的存储器外围电路及其形成方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101204663B1 (ko) * 2006-05-09 2012-11-26 에스케이하이닉스 주식회사 반도체소자의 리세스 게이트 전극 구조 및 그 형성방법
KR100842908B1 (ko) 2006-09-30 2008-07-02 주식회사 하이닉스반도체 리세스 게이트를 갖는 반도체 소자 및 그의 제조방법
KR101083644B1 (ko) * 2008-07-04 2011-11-16 주식회사 하이닉스반도체 반도체 장치 및 그 제조방법
US8227859B2 (en) 2008-07-04 2012-07-24 Hynix Semiconductor Inc. Semiconductor device and method for fabricating the same
KR101570178B1 (ko) 2008-11-07 2015-11-18 삼성전자주식회사 커패시터 없는 디램 소자

Also Published As

Publication number Publication date
TW200623230A (en) 2006-07-01
JP4999289B2 (ja) 2012-08-15
JP2006186303A (ja) 2006-07-13
TWI293777B (en) 2008-02-21
US7723768B2 (en) 2010-05-25
US20060138477A1 (en) 2006-06-29
CN100505311C (zh) 2009-06-24
CN1794467A (zh) 2006-06-28

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