KR100519404B1 - 신규한 락톤 함유 화합물, 고분자 화합물, 레지스트 재료 및 패턴 형성 방법 - Google Patents
신규한 락톤 함유 화합물, 고분자 화합물, 레지스트 재료 및 패턴 형성 방법 Download PDFInfo
- Publication number
- KR100519404B1 KR100519404B1 KR10-1999-0040854A KR19990040854A KR100519404B1 KR 100519404 B1 KR100519404 B1 KR 100519404B1 KR 19990040854 A KR19990040854 A KR 19990040854A KR 100519404 B1 KR100519404 B1 KR 100519404B1
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- South Korea
- Prior art keywords
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- carbon atoms
- formula
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- linear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D313/00—Heterocyclic compounds containing rings of more than six members having one oxygen atom as the only ring hetero atom
- C07D313/02—Seven-membered rings
- C07D313/04—Seven-membered rings not condensed with other rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Furan Compounds (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27067398 | 1998-09-25 | ||
| JP98-270673 | 1998-09-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000023368A KR20000023368A (ko) | 2000-04-25 |
| KR100519404B1 true KR100519404B1 (ko) | 2005-10-07 |
Family
ID=17489361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-1999-0040854A Expired - Lifetime KR100519404B1 (ko) | 1998-09-25 | 1999-09-22 | 신규한 락톤 함유 화합물, 고분자 화합물, 레지스트 재료 및 패턴 형성 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6280898B1 (enExample) |
| JP (1) | JP4131062B2 (enExample) |
| KR (1) | KR100519404B1 (enExample) |
| TW (1) | TW442706B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101116963B1 (ko) * | 2006-10-04 | 2012-03-14 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 고분자 화합물, 레지스트 재료, 및 패턴 형성 방법 |
| KR101286850B1 (ko) | 2006-07-28 | 2013-07-17 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 락톤 함유 화합물, 고분자 화합물, 레지스트 재료 및 패턴형성 방법 |
Families Citing this family (164)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW457277B (en) * | 1998-05-11 | 2001-10-01 | Shinetsu Chemical Co | Ester compounds, polymers, resist composition and patterning process |
| JP3166848B2 (ja) | 1998-11-18 | 2001-05-14 | 日本電気株式会社 | ネガティブフォトレジスト材料、及びそれを用いたパターン形成方法 |
| KR100382960B1 (ko) * | 1998-07-03 | 2003-05-09 | 닛뽕덴끼 가부시끼가이샤 | 락톤 구조를 갖는 (메트)아크릴레이트 유도체, 중합체,포토레지스트 조성물, 및 이것을 사용한 패턴 형성 방법 |
| US6596458B1 (en) * | 1999-05-07 | 2003-07-22 | Fuji Photo Film Co., Ltd. | Positive-working photoresist composition |
| JP4358940B2 (ja) * | 1999-08-26 | 2009-11-04 | 丸善石油化学株式会社 | シクロヘキサンラクトン構造を有する重合性化合物及び重合体 |
| ATE315245T1 (de) * | 1999-09-17 | 2006-02-15 | Jsr Corp | Strahlungsempfindliche harzzusammensetzung |
| JP3969909B2 (ja) * | 1999-09-27 | 2007-09-05 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
| JP3444821B2 (ja) * | 1999-10-06 | 2003-09-08 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
| JP3734012B2 (ja) * | 1999-10-25 | 2006-01-11 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
| US6524765B1 (en) * | 1999-11-15 | 2003-02-25 | Shin-Etsu Chemical Co., Ltd. | Polymer, resist composition and patterning process |
| KR100576201B1 (ko) | 2000-01-17 | 2006-05-03 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 화학 증폭형 레지스트 재료 |
| TWI294440B (enExample) * | 2000-02-16 | 2008-03-11 | Shinetsu Chemical Co | |
| EP1143299B1 (en) | 2000-04-04 | 2003-07-16 | Sumitomo Chemical Company, Limited | Chemically amplified positive resist composition |
| US6808860B2 (en) | 2000-04-17 | 2004-10-26 | Fuji Photo Film Co., Ltd. | Positive photoresist composition |
| JP3444844B2 (ja) * | 2000-07-17 | 2003-09-08 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
| US6306554B1 (en) * | 2000-05-09 | 2001-10-23 | Shipley Company, L.L.C. | Polymers containing oxygen and sulfur alicyclic units and photoresist compositions comprising same |
| JP3928690B2 (ja) * | 2000-07-06 | 2007-06-13 | 信越化学工業株式会社 | 脂環構造を有する新規ラクトン化合物及びその製造方法 |
| WO2002004532A1 (en) * | 2000-07-12 | 2002-01-17 | Mitsubishi Rayon Co., Ltd. | Resins for resists and chemically amplifiable resist compositions |
| US6391521B1 (en) * | 2000-08-16 | 2002-05-21 | International Business Machines Corporation | Resist compositions containing bulky anhydride additives |
| US6482567B1 (en) * | 2000-08-25 | 2002-11-19 | Shipley Company, L.L.C. | Oxime sulfonate and N-oxyimidosulfonate photoacid generators and photoresists comprising same |
| JP2002156750A (ja) * | 2000-11-20 | 2002-05-31 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
| JP4441104B2 (ja) * | 2000-11-27 | 2010-03-31 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
| JP4688282B2 (ja) * | 2000-12-04 | 2011-05-25 | ダイセル化学工業株式会社 | フォトレジスト用高分子及びフォトレジスト用樹脂組成物 |
| KR100531535B1 (ko) * | 2000-12-06 | 2005-11-28 | 미츠비시 레이온 가부시키가이샤 | (메트)아크릴산 에스테르, 그 원료 알콜, 이들의 제조방법, 이 (메트)아크릴산 에스테르를 중합하여 수득되는중합체, 화학 증폭형 레지스트 조성물, 및 패턴 형성 방법 |
| US7105268B2 (en) | 2000-12-13 | 2006-09-12 | Daicel Chemical Industries, Ltd. | Polymer for photoresist and resin compositions therefor |
| JP4748848B2 (ja) * | 2000-12-21 | 2011-08-17 | ダイセル化学工業株式会社 | 5−ヒドロキシ−2,6−ノルボルナンカルボラクトン及びその(メタ)アクリル酸エステルの製造法 |
| JP4748860B2 (ja) * | 2001-01-17 | 2011-08-17 | ダイセル化学工業株式会社 | 2−オキサトリシクロ[4.2.1.04,8]ノナン−3−オン誘導体及びその製造法 |
| US6838225B2 (en) * | 2001-01-18 | 2005-01-04 | Jsr Corporation | Radiation-sensitive resin composition |
| JP2002251009A (ja) * | 2001-02-23 | 2002-09-06 | Daicel Chem Ind Ltd | フォトレジスト用重合性不飽和化合物 |
| JP4517524B2 (ja) * | 2001-03-09 | 2010-08-04 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物 |
| JP2002357905A (ja) | 2001-03-28 | 2002-12-13 | Sumitomo Chem Co Ltd | レジスト組成物 |
| JP3853168B2 (ja) * | 2001-03-28 | 2006-12-06 | 松下電器産業株式会社 | パターン形成方法 |
| JP4117112B2 (ja) * | 2001-03-30 | 2008-07-16 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
| US6517994B2 (en) * | 2001-04-10 | 2003-02-11 | Shin-Etsu Chemical Co., Ltd. | Lactone ring-containing (meth)acrylate and polymer thereof for photoresist composition |
| US6852468B2 (en) * | 2001-06-12 | 2005-02-08 | Fuji Photo Film Co., Ltd. | Positive resist composition |
| JP3991191B2 (ja) * | 2001-06-14 | 2007-10-17 | 信越化学工業株式会社 | ラクトン構造を有する新規(メタ)アクリレート化合物、重合体、フォトレジスト材料、及びパターン形成法 |
| KR100636068B1 (ko) | 2001-06-15 | 2006-10-19 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 레지스트 재료 및 패턴 형성 방법 |
| JP4953521B2 (ja) * | 2001-06-19 | 2012-06-13 | 株式会社ダイセル | ラクトン骨格を有する(メタ)アクリル酸エステル |
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Also Published As
| Publication number | Publication date |
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| TW442706B (en) | 2001-06-23 |
| JP4131062B2 (ja) | 2008-08-13 |
| JP2000159758A (ja) | 2000-06-13 |
| US6280898B1 (en) | 2001-08-28 |
| KR20000023368A (ko) | 2000-04-25 |
| USRE41580E1 (en) | 2010-08-24 |
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