KR100386995B1 - 반도체 장치 및 그 배선 방법 - Google Patents

반도체 장치 및 그 배선 방법 Download PDF

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Publication number
KR100386995B1
KR100386995B1 KR10-2000-0059073A KR20000059073A KR100386995B1 KR 100386995 B1 KR100386995 B1 KR 100386995B1 KR 20000059073 A KR20000059073 A KR 20000059073A KR 100386995 B1 KR100386995 B1 KR 100386995B1
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KR
South Korea
Prior art keywords
semiconductor chip
pad
circuit board
pad electrode
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2000-0059073A
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English (en)
Korean (ko)
Other versions
KR20010076213A (ko
Inventor
노지리이사오
마카베류
Original Assignee
미쓰비시덴키 가부시키가이샤
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Publication of KR20010076213A publication Critical patent/KR20010076213A/ko
Application granted granted Critical
Publication of KR100386995B1 publication Critical patent/KR100386995B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01223—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/936—Multiple bond pads having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
KR10-2000-0059073A 2000-01-17 2000-10-07 반도체 장치 및 그 배선 방법 Expired - Fee Related KR100386995B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000007923A JP2001196529A (ja) 2000-01-17 2000-01-17 半導体装置及びその配線方法
JP2000-007923 2000-01-17

Publications (2)

Publication Number Publication Date
KR20010076213A KR20010076213A (ko) 2001-08-11
KR100386995B1 true KR100386995B1 (ko) 2003-06-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-0059073A Expired - Fee Related KR100386995B1 (ko) 2000-01-17 2000-10-07 반도체 장치 및 그 배선 방법

Country Status (4)

Country Link
US (4) US7071574B1 (https=)
JP (1) JP2001196529A (https=)
KR (1) KR100386995B1 (https=)
TW (1) TW462097B (https=)

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JP2001196529A (ja) * 2000-01-17 2001-07-19 Mitsubishi Electric Corp 半導体装置及びその配線方法
JP3631120B2 (ja) 2000-09-28 2005-03-23 沖電気工業株式会社 半導体装置
JP4189154B2 (ja) 2001-04-02 2008-12-03 本田技研工業株式会社 自動二輪車の盗難対策装置設置構造
US6979894B1 (en) * 2001-09-27 2005-12-27 Marvell International Ltd. Integrated chip package having intermediate substrate
DE10251527B4 (de) * 2002-11-04 2007-01-25 Infineon Technologies Ag Verfahren zur Herstellung einer Stapelanordnung eines Speichermoduls
EP1434264A3 (en) * 2002-12-27 2017-01-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using the transfer technique
JP2005123542A (ja) 2003-10-20 2005-05-12 Genusion:Kk 半導体装置のパッケージ構造およびパッケージ化方法
JP3880572B2 (ja) 2003-10-31 2007-02-14 沖電気工業株式会社 半導体チップ及び半導体装置
JP4103796B2 (ja) 2003-12-25 2008-06-18 沖電気工業株式会社 半導体チップパッケージ及びマルチチップパッケージ
JP2006032871A (ja) * 2004-07-22 2006-02-02 Toshiba Corp 半導体装置
US20060202317A1 (en) * 2005-03-14 2006-09-14 Farid Barakat Method for MCP packaging for balanced performance
US7535110B2 (en) 2006-06-15 2009-05-19 Marvell World Trade Ltd. Stack die packages
US7420206B2 (en) 2006-07-12 2008-09-02 Genusion Inc. Interposer, semiconductor chip mounted sub-board, and semiconductor package
TWI352416B (en) * 2006-09-12 2011-11-11 Chipmos Technologies Inc Stacked chip package structure with unbalanced lea
US7750450B2 (en) * 2006-12-20 2010-07-06 Intel Corporation Stacked die package with stud spacers
JP5191688B2 (ja) * 2007-05-18 2013-05-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN101467251A (zh) * 2007-06-01 2009-06-24 松下电器产业株式会社 半导体器件
JP5126002B2 (ja) 2008-11-11 2013-01-23 セイコーエプソン株式会社 半導体装置及び半導体装置の製造方法
KR20100117977A (ko) 2009-04-27 2010-11-04 삼성전자주식회사 반도체 패키지
US20110084374A1 (en) * 2009-10-08 2011-04-14 Jen-Chung Chen Semiconductor package with sectioned bonding wire scheme
US8536716B1 (en) * 2009-12-31 2013-09-17 Micron Technology, Inc. Supply voltage or ground connections for integrated circuit device
US8531849B1 (en) 2010-03-31 2013-09-10 Micron Technology, Inc. Supply voltage or ground connections including bond pad interconnects for integrated circuit device
KR20120024099A (ko) * 2010-09-06 2012-03-14 삼성전자주식회사 멀티-칩 패키지 및 그의 제조 방법
US20120133381A1 (en) * 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Stackable semiconductor chip with edge features and methods of fabricating and processing same
KR20130019290A (ko) * 2011-08-16 2013-02-26 삼성전자주식회사 유니버설 인쇄 회로 기판 및 그것을 포함하는 메모리 카드
WO2014017514A1 (ja) * 2012-07-26 2014-01-30 株式会社村田製作所 複合電子部品及びそれを備える電子装置
KR102037866B1 (ko) * 2013-02-05 2019-10-29 삼성전자주식회사 전자장치
JP2015002308A (ja) * 2013-06-18 2015-01-05 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置及びその製造方法
KR102108325B1 (ko) * 2013-10-14 2020-05-08 삼성전자주식회사 반도체 패키지
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Also Published As

Publication number Publication date
TW462097B (en) 2001-11-01
US20080023848A1 (en) 2008-01-31
US7547963B2 (en) 2009-06-16
US7071574B1 (en) 2006-07-04
KR20010076213A (ko) 2001-08-11
US20080023847A1 (en) 2008-01-31
US7288837B2 (en) 2007-10-30
US20060186526A1 (en) 2006-08-24
JP2001196529A (ja) 2001-07-19

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