KR970053214A - 다중 레벨 스택 집적된 회러칩 어셈블리 - Google Patents
다중 레벨 스택 집적된 회러칩 어셈블리 Download PDFInfo
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- KR970053214A KR970053214A KR1019960082426A KR19960082426A KR970053214A KR 970053214 A KR970053214 A KR 970053214A KR 1019960082426 A KR1019960082426 A KR 1019960082426A KR 19960082426 A KR19960082426 A KR 19960082426A KR 970053214 A KR970053214 A KR 970053214A
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Abstract
집적된 회로의 다중 레벨 스택은 스택의 다른 레벨상에 위치된 칩의 와이어링 패드(I/O)를 상호접속하는 와이어본드와 함께 교호하는 칩 및 플립 칩을 갖는다. 부가하여, 수직으로 인접한 레벨에 위치된 플립 칩과 칩사이에 위치된 솔더 범프는 이들 칩의 와이어링 패드를 이들 플립 칩이 와이어링 패드에 상호 접속한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1는 본 발명의 특정 실시예에 따른 다중 레벨 스택 집적된 회로칩 어셈블리의 부분적 단면의 정면도.
Claims (15)
- 다중 레벨 스택 집적된 회로칩 어셈블리에 있어서 : (a) 배선 기판 또는 제1집적된 회로칩을 구비하는 제1장치로서, 그 상단의 주 표면은 적어도 제1배선 패드를 갖는, 상기 제1장치; (b) 집적 회로칩 또는 배선 기판을 각각 구비하는 제2 및 제3장치로서, 상기 제3장치는 상기 제2장치를 덮도록 위치되고, 상기 제2장치는 상기 제1장치르 덮도록 위치되며, 상기 제2장치의 하단 주 표면은 집적회로 및 적어도 제3배선 패드를 갖게 되는, 상기 제2 및 제3장치; 및 (3) 제3배선 패드를 제1배선 패드에 직접적으로 전기적 접속하는 와이어본드를 구비하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제1항에 있어서, 제3장치의 상단 주 표면과 제2장치의 하단 주 표면은 실질적으로 동일한 측면 치수를 갖는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제2항에 있어서, 제3장치의 하단 주 표면을 제2장치의 상단 주 표면에 결합하는 접착물 본딩층을 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제1항에 있어서, 제3장치의 하단 주 표면을 제2장치의 상단 주 표면에 결합하는 접착물 본딩층을 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제4항에 있어서, 제2배선패드를 제1장치의 상단 표면상에 위치된 제3배선 패들에 직접 접속하는 제1솔더 범프를 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제1항에 있어서, 제2배선패드를 제1장치의 상단 표면상에 위치된 제3배선 패들에 직접 접속하는 제1솔더 범프를 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제6항에 있어서, 집적 회로칩 및 배선 기판을 각각 구비하는 제4 및 제5장치로서, 상기 제5장치는 상기 제4장치를 덮고 있고, 상기 제4장치는 상기 제3장치를 덮고 있으며, 상기 제4장치는 그 하단 주 표면에 위치된 적어도 제4배선 패드를 갖고, 상기 제5장치는 그 상단 주 표면에 위치된 적어도 제5배선 패드를 가지는, 상기 제4및 제5장치; 및 제5배선 패드를 제1장치의 상단 표면상에 위치된 제6배선 패드에 직접 접속하는 제2와이어본드를 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제1항에 있어서, 집적 회로칩 및 배선 기판을 각각 구비하는 제4 및 제5장치로서, 상기 제5장치는 상기 제4장치를 덮고 있고, 상기 제4장치는 상기 제3장치를 덮고 있으며, 상기 제4장치는 그 상단 주 표면에 위치된 적어도 제4배선 패드를 가지는, 상기 제4 및 제5장치; 및 제5배선 패드를 제1장치의 상단 표면상에 위치된 제6배선 패드에 직접 접속하는 제2와이어본드를 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제8항에 있어서, 제2배선 패드를 제1장치의 상단 표면상에 위치된 제3배선 패드에 직접 접속하는 제1솔더 범프, 및 제4배선 패드를 제3장치의 상단 표면상에 위치된 제7배선 패드에 직접 접속하는 제2솔더 범프를 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제9항에 있어서, 제5장치의 하단 주 표면을 제4장치의 상단 주 표면에 결합하는 접착물 본딩층을 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제10항에 있어서, 제3장치의 상단 주 표면을 제2장치의 하단 주 표면은 실질적으로 동일한 측면 치수를 갖는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제10항에 있어서, 제4배선 패드를 제3장치의 상단 표면상에 위치된 제7배선 패드에 직접 접속하는 제2솔더 범프를 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제9항에 있어서, 제5장치의 상단 표면상에 위치된 제8배선 패드를 제3장치의 상단 표면상에 위치한 제9배선 패드에 직접 접속하는 제3와이어본드를 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제11항에 있어서, 제5장치의 하단 주 표면을 제4장치의 상단 주 표면에 결합하는 제2접착물 본딩층을 더 구비하는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.
- 제9항에 있어서, 제4장치의 상단 주 표면 및 제5장치의 하단 주 표면은 실질적으로 동일한 측면 치수를 가지는 것을 특징으로 하는 다중 레벨 스택 집적된 회로칩 어셈블리.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US58022095A | 1995-12-28 | 1995-12-28 | |
US580,220 | 1995-12-28 |
Publications (1)
Publication Number | Publication Date |
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KR970053214A true KR970053214A (ko) | 1997-07-29 |
Family
ID=24320199
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Application Number | Title | Priority Date | Filing Date |
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KR1019960082426A KR970053214A (ko) | 1995-12-28 | 1996-12-28 | 다중 레벨 스택 집적된 회러칩 어셈블리 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0782191A2 (ko) |
JP (1) | JPH09186289A (ko) |
KR (1) | KR970053214A (ko) |
TW (1) | TW315515B (ko) |
Cited By (4)
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KR100379608B1 (ko) * | 1999-02-17 | 2003-04-10 | 샤프 가부시키가이샤 | 반도체장치 및 그의 제조방법 |
KR100386995B1 (ko) * | 2000-01-17 | 2003-06-12 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 및 그 배선 방법 |
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-
1996
- 1996-12-09 JP JP8328260A patent/JPH09186289A/ja active Pending
- 1996-12-10 EP EP96308958A patent/EP0782191A2/en not_active Withdrawn
- 1996-12-11 TW TW085115320A patent/TW315515B/zh active
- 1996-12-28 KR KR1019960082426A patent/KR970053214A/ko not_active Application Discontinuation
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US8907383B2 (en) | 2012-12-20 | 2014-12-09 | SK Hynix Inc. | Stack packages having token ring loops |
Also Published As
Publication number | Publication date |
---|---|
JPH09186289A (ja) | 1997-07-15 |
TW315515B (ko) | 1997-09-11 |
EP0782191A2 (en) | 1997-07-02 |
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