KR100324793B1 - 세정장치및세정방법 - Google Patents

세정장치및세정방법 Download PDF

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Publication number
KR100324793B1
KR100324793B1 KR1019950011658A KR19950011658A KR100324793B1 KR 100324793 B1 KR100324793 B1 KR 100324793B1 KR 1019950011658 A KR1019950011658 A KR 1019950011658A KR 19950011658 A KR19950011658 A KR 19950011658A KR 100324793 B1 KR100324793 B1 KR 100324793B1
Authority
KR
South Korea
Prior art keywords
cleaning
cleaned
contact pressure
cleaning member
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950011658A
Other languages
English (en)
Korean (ko)
Other versions
KR950034407A (ko
Inventor
요네미즈아키라
이시자카노부카즈
하마다도모코
Original Assignee
다카시마 히로시
도오교오에레구토론큐우슈우가부시끼가이샤
히가시 데쓰로
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14848743&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100324793(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 다카시마 히로시, 도오교오에레구토론큐우슈우가부시끼가이샤, 히가시 데쓰로, 동경 엘렉트론 주식회사 filed Critical 다카시마 히로시
Publication of KR950034407A publication Critical patent/KR950034407A/ko
Application granted granted Critical
Publication of KR100324793B1 publication Critical patent/KR100324793B1/ko
Assigned to 동경 엘렉트론 주식회사 reassignment 동경 엘렉트론 주식회사 권리지분의 전부이전등록 Assignors: 도오교오 에레구토론 큐우슈우 가부시끼가이샤
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
KR1019950011658A 1994-05-12 1995-05-12 세정장치및세정방법 Expired - Lifetime KR100324793B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12295494A JP3328426B2 (ja) 1994-05-12 1994-05-12 洗浄装置
JP94-122954 1994-05-12

Publications (2)

Publication Number Publication Date
KR950034407A KR950034407A (ko) 1995-12-28
KR100324793B1 true KR100324793B1 (ko) 2002-06-27

Family

ID=14848743

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950011658A Expired - Lifetime KR100324793B1 (ko) 1994-05-12 1995-05-12 세정장치및세정방법

Country Status (4)

Country Link
US (2) US5636401A (https=)
JP (1) JP3328426B2 (https=)
KR (1) KR100324793B1 (https=)
TW (1) TW284899B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101801161B1 (ko) 2011-11-25 2017-12-21 세메스 주식회사 기판 세정 장치의 브러쉬 조절 방법

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0171491B1 (ko) * 1994-09-20 1999-03-30 이시다 아키라 회전식 기판세정장치
JP3341872B2 (ja) * 1995-04-03 2002-11-05 大日本スクリーン製造株式会社 回転式基板洗浄装置
JP3447869B2 (ja) * 1995-09-20 2003-09-16 株式会社荏原製作所 洗浄方法及び装置
JP3393016B2 (ja) * 1996-04-15 2003-04-07 大日本スクリーン製造株式会社 基板洗浄装置および方法
JP3278590B2 (ja) * 1996-08-23 2002-04-30 株式会社東芝 超音波洗浄装置及び超音波洗浄方法
KR19980022571A (ko) * 1996-09-23 1998-07-06 김광호 반도체 스크러버(Scrubber)장비
TW353784B (en) 1996-11-19 1999-03-01 Tokyo Electron Ltd Apparatus and method for washing substrate
JP3330300B2 (ja) * 1997-02-28 2002-09-30 東京エレクトロン株式会社 基板洗浄装置
JP3320640B2 (ja) * 1997-07-23 2002-09-03 東京エレクトロン株式会社 洗浄装置
JP3871785B2 (ja) * 1997-11-13 2007-01-24 株式会社荏原製作所 洗浄具の洗浄装置、被処理体洗浄装置、及び洗浄具の洗浄方法
JP3654779B2 (ja) * 1998-01-06 2005-06-02 東京エレクトロン株式会社 基板洗浄具及び基板洗浄方法
US6292972B1 (en) * 1998-03-30 2001-09-25 Tokyo Electron Limited Scrub washing apparatus and scrub washing method
US6652662B1 (en) * 1998-04-03 2003-11-25 Tokyo Electron Limited Substrate surface processing apparatus and method
JP4040162B2 (ja) * 1998-04-07 2008-01-30 沖電気工業株式会社 半導体ウエハの洗浄装置
JP3314032B2 (ja) * 1998-04-28 2002-08-12 東京エレクトロン株式会社 処理装置
US6242355B1 (en) * 1998-08-27 2001-06-05 Taiwan Semiconductor Manufacturing Company, Ltd Method for insulating metal conductors by spin-on-glass and devices made
US6269510B1 (en) 1999-01-04 2001-08-07 International Business Machines Corporation Post CMP clean brush with torque monitor
US6119294A (en) * 1999-01-14 2000-09-19 United Microelectronics Corp. Cleaning system with automatically controlled brush pressure
TW490756B (en) 1999-08-31 2002-06-11 Hitachi Ltd Method for mass production of semiconductor integrated circuit device and manufacturing method of electronic components
US6446296B1 (en) 2000-03-06 2002-09-10 Rite Track Equipment Services, Inc. Substrate cleaning apparatus with brush force control and method
JP3953716B2 (ja) * 2000-08-01 2007-08-08 株式会社荏原製作所 基板洗浄装置
KR100396829B1 (ko) * 2000-11-10 2003-09-02 (주)케이.씨.텍 브러시 세정 장치의 브러시 세척 기구
TW526527B (en) * 2001-01-04 2003-04-01 Applied Materials Inc Method and apparatus for critical flow particle removal
US6651284B2 (en) * 2001-10-11 2003-11-25 Silicon Integrated Systems Corp. Scrubbing assembly for wafer-cleaning device
US6702202B1 (en) * 2002-06-28 2004-03-09 Lam Research Corporation Method and apparatus for fluid delivery to a backside of a substrate
US7252099B2 (en) * 2003-09-05 2007-08-07 Nan Ya Technology Corporation Wafer cleaning apparatus with multiple wash-heads
JP4511591B2 (ja) 2004-09-28 2010-07-28 株式会社荏原製作所 基板洗浄装置及び洗浄部材の交換時期判定方法
US7685667B2 (en) * 2005-06-14 2010-03-30 Taiwan Semiconductor Manufacturing Co., Ltd. Post-CMP cleaning system
KR100779354B1 (ko) * 2006-12-28 2007-11-23 동부일렉트로닉스 주식회사 반도체 현상설비
JP5937456B2 (ja) 2012-08-07 2016-06-22 東京エレクトロン株式会社 基板洗浄装置および基板洗浄ユニット
JP6169891B2 (ja) * 2013-05-20 2017-07-26 株式会社荏原製作所 基板洗浄装置
WO2014204444A1 (en) * 2013-06-18 2014-12-24 Apple Inc. Pressure-sensing rollers for lamination systems
JP2015220402A (ja) 2014-05-20 2015-12-07 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法
KR20170063691A (ko) * 2014-09-26 2017-06-08 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼를 세정하기 위한 장치 및 방법
JP6767834B2 (ja) * 2016-09-29 2020-10-14 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP7091076B2 (ja) * 2018-01-25 2022-06-27 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄ブラシおよび基板洗浄装置
JP6736713B2 (ja) * 2019-02-27 2020-08-05 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法
JP6895565B2 (ja) * 2019-02-27 2021-06-30 株式会社荏原製作所 基板洗浄装置および基板洗浄装置で実行される方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476601A (en) * 1982-04-17 1984-10-16 Dainippon Screen Manufacturing Co., Ltd. Washing apparatus
US5351360A (en) * 1991-06-06 1994-10-04 Enya Systems, Limited Cleaning device for a wafer mount plate

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102024A (en) * 1980-12-17 1982-06-24 Nec Kyushu Ltd Brush scrubber
US4382308A (en) * 1981-02-18 1983-05-10 Chemcut Corporation Scrubbing torque monitoring and control system
JPS59112625A (ja) * 1982-12-18 1984-06-29 Mitsubishi Electric Corp 表面異物除去装置
JPS59193029A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd 洗浄方法およびその装置
JPS62259447A (ja) * 1986-05-02 1987-11-11 Nec Kyushu Ltd ブラシスクラバ−装置
JPS6316626A (ja) * 1986-07-09 1988-01-23 Nec Kansai Ltd 半導体装置の製造方法
JPS63239953A (ja) * 1987-03-27 1988-10-05 Nec Corp 半導体ウエハ−の洗浄装置
JPH079897B2 (ja) * 1988-05-17 1995-02-01 信越半導体株式会社 ウェーハ自動洗浄装置
JP2746670B2 (ja) * 1989-07-20 1998-05-06 東京エレクトロン株式会社 洗浄装置
US5144711A (en) * 1991-03-25 1992-09-08 Westech Systems, Inc. Cleaning brush for semiconductor wafer
JP2571487B2 (ja) * 1991-12-27 1997-01-16 信越半導体株式会社 薄円板状ワークのスクラバー洗浄装置
KR100230694B1 (ko) * 1992-05-18 1999-11-15 다카시마 히로시 기판세정처리장치
JP3052105B2 (ja) * 1992-11-20 2000-06-12 東京エレクトロン株式会社 洗浄処理装置
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
JP2862754B2 (ja) * 1993-04-19 1999-03-03 東京エレクトロン株式会社 処理装置及び回転部材
US5475889A (en) * 1994-07-15 1995-12-19 Ontrak Systems, Inc. Automatically adjustable brush assembly for cleaning semiconductor wafers
US5551986A (en) * 1995-02-15 1996-09-03 Taxas Instruments Incorporated Mechanical scrubbing for particle removal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476601A (en) * 1982-04-17 1984-10-16 Dainippon Screen Manufacturing Co., Ltd. Washing apparatus
US5351360A (en) * 1991-06-06 1994-10-04 Enya Systems, Limited Cleaning device for a wafer mount plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101801161B1 (ko) 2011-11-25 2017-12-21 세메스 주식회사 기판 세정 장치의 브러쉬 조절 방법

Also Published As

Publication number Publication date
US5636401A (en) 1997-06-10
JPH07307321A (ja) 1995-11-21
KR950034407A (ko) 1995-12-28
JP3328426B2 (ja) 2002-09-24
US5882426A (en) 1999-03-16
TW284899B (https=) 1996-09-01

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