KR100193592B1 - 릴리스필름을 이용한 수지몰드장치와 수지몰드방법 및 거기에 이용되는 릴리스필름 - Google Patents

릴리스필름을 이용한 수지몰드장치와 수지몰드방법 및 거기에 이용되는 릴리스필름 Download PDF

Info

Publication number
KR100193592B1
KR100193592B1 KR1019950043691A KR19950043691A KR100193592B1 KR 100193592 B1 KR100193592 B1 KR 100193592B1 KR 1019950043691 A KR1019950043691 A KR 1019950043691A KR 19950043691 A KR19950043691 A KR 19950043691A KR 100193592 B1 KR100193592 B1 KR 100193592B1
Authority
KR
South Korea
Prior art keywords
mold
resin
release film
cavity
resin molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950043691A
Other languages
English (en)
Korean (ko)
Other versions
KR960017105A (ko
Inventor
후미오 미야지마
Original Assignee
나까자와 모또요시
아피쿠 야마다 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28694494A external-priority patent/JP3278309B2/ja
Priority claimed from JP28693494A external-priority patent/JP3241553B2/ja
Priority claimed from JP28693794A external-priority patent/JP3214788B2/ja
Priority claimed from JP29476294A external-priority patent/JP3214790B2/ja
Priority claimed from JP3035395A external-priority patent/JP3246847B2/ja
Application filed by 나까자와 모또요시, 아피쿠 야마다 가부시키가이샤 filed Critical 나까자와 모또요시
Publication of KR960017105A publication Critical patent/KR960017105A/ko
Application granted granted Critical
Publication of KR100193592B1 publication Critical patent/KR100193592B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1019950043691A 1994-11-21 1995-11-21 릴리스필름을 이용한 수지몰드장치와 수지몰드방법 및 거기에 이용되는 릴리스필름 Expired - Lifetime KR100193592B1 (ko)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP28694494A JP3278309B2 (ja) 1994-11-21 1994-11-21 樹脂モールド装置及び樹脂モールド方法並びに樹脂モールド用リリースフィルム
JP94-286937 1994-11-21
JP28693494A JP3241553B2 (ja) 1994-11-21 1994-11-21 リリースフィルムを用いる樹脂モールド装置
JP94-286944 1994-11-21
JP94-286934 1994-11-21
JP28693794A JP3214788B2 (ja) 1994-11-21 1994-11-21 樹脂モールド装置および樹脂モールド方法
JP94-294762 1994-11-29
JP29476294A JP3214790B2 (ja) 1994-11-29 1994-11-29 樹脂モールド装置及び樹脂モールド方法
JP3035395A JP3246847B2 (ja) 1995-02-20 1995-02-20 ラッピング樹脂を用いる樹脂モールド装置
JP95-30353 1995-02-20

Publications (2)

Publication Number Publication Date
KR960017105A KR960017105A (ko) 1996-06-17
KR100193592B1 true KR100193592B1 (ko) 1999-06-15

Family

ID=27521215

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950043691A Expired - Lifetime KR100193592B1 (ko) 1994-11-21 1995-11-21 릴리스필름을 이용한 수지몰드장치와 수지몰드방법 및 거기에 이용되는 릴리스필름

Country Status (7)

Country Link
US (1) US5891384A (enExample)
EP (1) EP0730937B1 (enExample)
KR (1) KR100193592B1 (enExample)
CN (1) CN1061929C (enExample)
DE (1) DE69501632T2 (enExample)
MY (1) MY114403A (enExample)
TW (1) TW291569B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100457932B1 (ko) * 1996-08-09 2005-01-17 린텍 가부시키가이샤 접착제시트접착장치
KR101417577B1 (ko) 2012-02-14 2014-07-08 스미도모쥬기가이고교 가부시키가이샤 수지밀봉장치 및 수지밀봉방법
KR20220104125A (ko) * 2020-12-21 2022-07-26 현태섭 연질 성형물의 성형 캐비티

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4432333A1 (de) * 1994-09-10 1996-03-14 Iloma Automatisierungstechnik Verfahren und Vorrichtung zur Herstellung von Formkörpern aus Polymerbeton
US6048483A (en) 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JP3017470B2 (ja) * 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
DE19731780A1 (de) * 1997-07-24 1999-01-28 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung empfindlicher Formteile unter Einsatz einer Folie
JP3017485B2 (ja) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
NL1008488C2 (nl) * 1998-03-05 1999-09-07 Fico Bv Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.
NL1008924C2 (nl) * 1998-04-17 1999-10-19 3P Licensing Bv Eenheidsdosering voor omhullingsmateriaal, een daarvoor bestemde verpakking en een werkwijze voor het vervaardigen daarvan.
EP1073552B1 (en) * 1998-04-17 2003-01-08 "3P" Licensing B.V. Packaging for encapsulating material
NL1009563C2 (nl) * 1998-07-06 2000-01-10 Fico Bv Mal, omhulinrichting en werkwijze voor het omhullen.
SG85653A1 (en) * 1998-07-10 2002-01-15 Apic Yamada Corp Method of manufacturing semiconductor devices and resin molding machine
JP3486557B2 (ja) * 1998-07-30 2004-01-13 宮崎沖電気株式会社 トランスファ成形装置及び半導体装置の製造方法
JP3450223B2 (ja) * 1999-05-27 2003-09-22 Ｎｅｃエレクトロニクス株式会社 半導体装置封入用金型、及び、半導体装置封入方法
JP4077118B2 (ja) * 1999-06-25 2008-04-16 富士通株式会社 半導体装置の製造方法および半導体装置製造用金型
US6312976B1 (en) 1999-11-22 2001-11-06 Advanced Semiconductor Engineering, Inc. Method for manufacturing leadless semiconductor chip package
JP3971541B2 (ja) * 1999-12-24 2007-09-05 富士通株式会社 半導体装置の製造方法及びこの方法に用いる分割金型
JP3510554B2 (ja) * 2000-02-10 2004-03-29 山形日本電気株式会社 樹脂モールド方法、モールド成形用金型及び配線基材
JP4239352B2 (ja) * 2000-03-28 2009-03-18 株式会社日立製作所 電子装置の製造方法
US6916683B2 (en) * 2000-05-11 2005-07-12 Micron Technology, Inc. Methods of fabricating a molded ball grid array
JP2002009096A (ja) * 2000-06-20 2002-01-11 Apic Yamada Corp 樹脂封止方法及び樹脂封止装置
US6439869B1 (en) 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
US6770236B2 (en) * 2000-08-22 2004-08-03 Apic Yamada Corp. Method of resin molding
US6838760B1 (en) * 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units
US20020043389A1 (en) * 2000-09-29 2002-04-18 Selvarajan Murugan Virtual gate design for thin packages
US6486066B2 (en) * 2001-02-02 2002-11-26 Matrix Semiconductor, Inc. Method of generating integrated circuit feature layout for improved chemical mechanical polishing
US7595017B2 (en) * 2002-01-31 2009-09-29 Stmicroelectronics, Inc. Method for using a pre-formed film in a transfer molding process for an integrated circuit
JP2004134591A (ja) * 2002-10-10 2004-04-30 Renesas Technology Corp 半導体集積回路装置の製造方法
US6989122B1 (en) * 2002-10-17 2006-01-24 National Semiconductor Corporation Techniques for manufacturing flash-free contacts on a semiconductor package
WO2004053973A1 (en) * 2002-12-10 2004-06-24 Infineon Technolgies Ag Method of packaging integrated circuits, and integrated circuit packages produced by the method
KR100546372B1 (ko) * 2003-08-28 2006-01-26 삼성전자주식회사 웨이퍼 레벨 칩 사이즈 패키지의 제조방법
US20050058837A1 (en) * 2003-09-16 2005-03-17 Farnworth Warren M. Processes for facilitating removal of stereolithographically fabricated objects from platens of stereolithographic fabrication equipment, object release elements for effecting such processes, systems and fabrication processes employing the object release elements, and objects which have been fabricated using the object release elements
KR100957703B1 (ko) * 2007-04-13 2010-05-12 주식회사 엘지화학 미세패턴 형성 방법
JP5172590B2 (ja) * 2008-10-14 2013-03-27 新光電気工業株式会社 積層配線基板の樹脂封止方法及び樹脂封止装置
TWI515842B (zh) * 2008-11-17 2016-01-01 先進封裝技術私人有限公司 半導體晶片封裝系統
CN102011952A (zh) * 2009-09-04 2011-04-13 佛山市国星光电股份有限公司 Led光源模块的制造方法及该方法的产品
CN102371646A (zh) * 2010-08-11 2012-03-14 联想(北京)有限公司 一种工件的制备方法
FR2975038B1 (fr) * 2011-05-10 2014-03-07 Airbus Operations Sas Procede de fabrication d'une piece en materiau composite et piece ainsi obtenue.
DE102011082157A1 (de) * 2011-09-06 2013-03-07 Osram Opto Semiconductors Gmbh Presswerkzeug und Verfahrenzum Herstellen eines Silikonelements
CN102303387A (zh) * 2011-09-08 2012-01-04 扬州杰特沈飞车辆装饰件有限公司 一种餐桌封边工艺
JP2013093504A (ja) * 2011-10-27 2013-05-16 Toshiba Corp 半導体装置の製造方法および冶具
US20140275915A1 (en) * 2013-03-13 2014-09-18 Medtronic, Inc. Implantable medical device including a molded planar transformer
US20160141187A1 (en) * 2014-11-14 2016-05-19 Infineon Technologies Ag Method of manufacturing an integrated circuit with imprint, integrated circuit with imprint, device for forming an integrated circuit with imprint and verification system for an integrated circuit with imprint
EP3723958A1 (en) 2017-12-15 2020-10-21 West Pharmaceutical Services, Inc. Smooth film laminated elastomer articles
US11014140B2 (en) * 2019-04-15 2021-05-25 Raytheon Technologies Corporation Ceramic core setter
JP7360368B2 (ja) * 2020-08-18 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754070A (en) * 1970-08-03 1973-08-21 Motorola Inc Flash free molding
US4003544A (en) * 1973-06-11 1977-01-18 Motorola, Inc. Gateless injection mold for encapsulating semiconductor devices
JPS5243366A (en) * 1975-10-01 1977-04-05 Hitachi Ltd Mold for resin molding
US4052241A (en) * 1975-11-13 1977-10-04 Detroit Gasket And Manufacturing Company Method of forming a contoured laminate
JPS60131213A (ja) * 1983-12-21 1985-07-12 Japan Steel Works Ltd:The 転写成形装置
JPS614234A (ja) * 1984-06-19 1986-01-10 Michio Osada 半導体素子の樹脂モ−ルド成形方法及び半導体リ−ドフレ−ム
JPS61167515A (ja) * 1985-01-21 1986-07-29 Hitachi Ltd モ−ルド装置
JPS6251416A (ja) * 1985-08-30 1987-03-06 Sony Corp 樹脂封止金型
JPS62207615A (ja) * 1986-03-07 1987-09-12 Fujitsu Ltd 樹脂封止用金型
JPS6444026A (en) * 1987-08-11 1989-02-16 Michio Osada Resin-seal formation of component to be sealed and heat resistant sheet member used therefor
JPH01202415A (ja) * 1988-02-08 1989-08-15 Matsuda Seisakusho:Kk 射出成形同時絵付け方法において、フイルムの離型方法
DE3811814C2 (de) * 1988-04-08 1994-08-25 Siemens Ag Spritz-Form-Vorrichtung für quarzgefülltes Kunststoff-Material
JPH01293523A (ja) * 1988-05-20 1989-11-27 Mitsubishi Electric Corp 樹脂封止型半導体装置用封止金型
JPH01299008A (ja) * 1988-05-27 1989-12-01 Mitsubishi Electric Corp モールド装置
JPH03500033A (ja) * 1988-06-21 1991-01-10 ダブリュー　アンド　ティー　エイヴァリー　リミテッド ポータブル電子トークンの製造法
JPH0245117A (ja) * 1988-08-05 1990-02-15 Mitsubishi Electric Corp 樹脂封止型半導体装置用の金型
US4944908A (en) * 1988-10-28 1990-07-31 Eaton Corporation Method for forming a molded plastic article
US5043199A (en) * 1988-10-31 1991-08-27 Fujitsu Limited Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet
NL8802879A (nl) * 1988-11-22 1990-06-18 Ireneus Johannes Theodorus Mar Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze.
US4956141A (en) * 1989-04-07 1990-09-11 Libbey-Owens-Ford Co. Molding process utilizing a mold release membrane
US5417905A (en) * 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces
US4965037A (en) * 1989-07-17 1990-10-23 Libbey-Owens-Ford Co. Method of molding a composite
US5226997A (en) * 1989-08-28 1993-07-13 United Technologies Corporation Mold liners for resin transfer molding
JPH03234605A (ja) * 1990-02-13 1991-10-18 Toshiba Corp レジン成形装置
JPH0437507A (ja) * 1990-06-02 1992-02-07 Yamada Seisakusho Co Ltd 成形機のエジェクタピン取付構造
US5270262A (en) * 1991-02-28 1993-12-14 National Semiconductor Corporation O-ring package
US5185653A (en) * 1990-11-08 1993-02-09 National Semiconductor Corporation O-ring package
NL9200127A (nl) * 1992-01-23 1993-08-16 Ireneus Johannes Theodorus Mar Werkwijze voor het in een vormholte persen van een door een reactie uithardende kunststof, een daarbij te gebruiken pilvormig pershulpmateriaal alsmede een houder uit dergelijk materiaal.
CA2101300C (en) * 1992-08-04 1998-07-28 Emery I. Valyi Process and apparatus for forming a color coated article
JPH06151490A (ja) * 1992-11-05 1994-05-31 Toshiba Corp 半導体装置製造用金型
NL9400119A (nl) * 1994-01-27 1995-09-01 3P Licensing Bv Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.
USH1654H (en) * 1995-01-10 1997-06-03 Rounds; Nicholas A. Transfer molding process for encapsulating semiconductor devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100457932B1 (ko) * 1996-08-09 2005-01-17 린텍 가부시키가이샤 접착제시트접착장치
KR101417577B1 (ko) 2012-02-14 2014-07-08 스미도모쥬기가이고교 가부시키가이샤 수지밀봉장치 및 수지밀봉방법
KR20220104125A (ko) * 2020-12-21 2022-07-26 현태섭 연질 성형물의 성형 캐비티
KR102526646B1 (ko) 2020-12-21 2023-04-27 현태섭 연질 성형물의 성형 몰드

Also Published As

Publication number Publication date
EP0730937B1 (en) 1998-02-18
CN1061929C (zh) 2001-02-14
DE69501632D1 (de) 1998-03-26
DE69501632T2 (de) 1998-07-23
KR960017105A (ko) 1996-06-17
TW291569B (enExample) 1996-11-21
CN1131610A (zh) 1996-09-25
MY114403A (en) 2002-10-31
US5891384A (en) 1999-04-06
EP0730937A1 (en) 1996-09-11

Similar Documents

Publication Publication Date Title
KR100193592B1 (ko) 릴리스필름을 이용한 수지몰드장치와 수지몰드방법 및 거기에 이용되는 릴리스필름
EP0890425B1 (en) Method of resin molding and resin molding machine
EP0933808B1 (en) Resin sealing method and apparatus for a semiconductor device
KR100577592B1 (ko) 반도체 장치의 제조 방법
US20020017738A1 (en) Resin sealing method and resin sealing apparatus
EP0688650B1 (en) Method of resin-sealing semiconductor devices
US6676885B2 (en) Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding dies
JP2001079878A (ja) 樹脂封止方法及び樹脂封止装置
KR100419356B1 (ko) 전자 부품, 전자 부품의 수지 밀봉 방법 및 장치
JP2013123063A (ja) トランスファモールド金型およびこれを用いたトランスファモールド装置
JP2004230707A (ja) 電子部品の樹脂封止成形方法及び装置
KR102393495B1 (ko) 수지 성형품의 제조 방법 및 수지 성형 장치
JP4020533B2 (ja) 樹脂封止装置及び樹脂封止方法
JP3581816B2 (ja) フリップチップの樹脂注入方法
JP3139981B2 (ja) チップサイズパッケージの樹脂封止方法及び樹脂封止装置
JP3241553B2 (ja) リリースフィルムを用いる樹脂モールド装置
JPH08142107A (ja) 樹脂モールド装置及び樹脂モールド用リリースフィルム
JPH0510361Y2 (enExample)
JP2003133351A (ja) 樹脂封止装置及び樹脂封止方法
JP3590133B2 (ja) 樹脂モールド方法及び樹脂モールド装置
JP2004253412A (ja) 電子部品の樹脂封止成形方法及び装置
JP3575592B2 (ja) リードフレーム組立体の樹脂モールド用成形型及び樹脂モールド成形法
JP2004153046A (ja) 電子部品の樹脂成形方法及び金型と基板
JP2006134923A (ja) 封止済基板の離型方法及び離型機構
JP2000061976A (ja) 樹脂モールド装置

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19951121

A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19960320

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19951121

Comment text: Patent Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19980829

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19981121

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 19990204

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 19990205

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20020124

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20030117

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20040204

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20050112

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20060119

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20070119

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20080115

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20090112

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20100122

Start annual number: 12

End annual number: 12

PR1001 Payment of annual fee

Payment date: 20110120

Start annual number: 13

End annual number: 13

PR1001 Payment of annual fee

Payment date: 20120127

Start annual number: 14

End annual number: 14

FPAY Annual fee payment

Payment date: 20130125

Year of fee payment: 15

PR1001 Payment of annual fee

Payment date: 20130125

Start annual number: 15

End annual number: 15

FPAY Annual fee payment

Payment date: 20140124

Year of fee payment: 16

PR1001 Payment of annual fee

Payment date: 20140124

Start annual number: 16

End annual number: 16

FPAY Annual fee payment

Payment date: 20141231

Year of fee payment: 17

PR1001 Payment of annual fee

Payment date: 20141231

Start annual number: 17

End annual number: 17

EXPY Expiration of term
PC1801 Expiration of term