DE69501632D1 - Harzformmaschine mit Trennfolie - Google Patents

Harzformmaschine mit Trennfolie

Info

Publication number
DE69501632D1
DE69501632D1 DE69501632T DE69501632T DE69501632D1 DE 69501632 D1 DE69501632 D1 DE 69501632D1 DE 69501632 T DE69501632 T DE 69501632T DE 69501632 T DE69501632 T DE 69501632T DE 69501632 D1 DE69501632 D1 DE 69501632D1
Authority
DE
Germany
Prior art keywords
molding machine
release film
resin molding
resin
release
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69501632T
Other languages
English (en)
Other versions
DE69501632T2 (de
Inventor
Fumio Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28694494A external-priority patent/JP3278309B2/ja
Priority claimed from JP28693794A external-priority patent/JP3214788B2/ja
Priority claimed from JP28693494A external-priority patent/JP3241553B2/ja
Priority claimed from JP29476294A external-priority patent/JP3214790B2/ja
Priority claimed from JP3035395A external-priority patent/JP3246847B2/ja
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of DE69501632D1 publication Critical patent/DE69501632D1/de
Application granted granted Critical
Publication of DE69501632T2 publication Critical patent/DE69501632T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE69501632T 1994-11-21 1995-11-17 Harzformmaschine mit Trennfolie Expired - Fee Related DE69501632T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP28694494A JP3278309B2 (ja) 1994-11-21 1994-11-21 樹脂モールド装置及び樹脂モールド方法並びに樹脂モールド用リリースフィルム
JP28693794A JP3214788B2 (ja) 1994-11-21 1994-11-21 樹脂モールド装置および樹脂モールド方法
JP28693494A JP3241553B2 (ja) 1994-11-21 1994-11-21 リリースフィルムを用いる樹脂モールド装置
JP29476294A JP3214790B2 (ja) 1994-11-29 1994-11-29 樹脂モールド装置及び樹脂モールド方法
JP3035395A JP3246847B2 (ja) 1995-02-20 1995-02-20 ラッピング樹脂を用いる樹脂モールド装置

Publications (2)

Publication Number Publication Date
DE69501632D1 true DE69501632D1 (de) 1998-03-26
DE69501632T2 DE69501632T2 (de) 1998-07-23

Family

ID=27521215

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69501632T Expired - Fee Related DE69501632T2 (de) 1994-11-21 1995-11-17 Harzformmaschine mit Trennfolie

Country Status (7)

Country Link
US (1) US5891384A (de)
EP (1) EP0730937B1 (de)
KR (1) KR100193592B1 (de)
CN (1) CN1061929C (de)
DE (1) DE69501632T2 (de)
MY (1) MY114403A (de)
TW (1) TW291569B (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4432333A1 (de) * 1994-09-10 1996-03-14 Iloma Automatisierungstechnik Verfahren und Vorrichtung zur Herstellung von Formkörpern aus Polymerbeton
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JP3447518B2 (ja) * 1996-08-09 2003-09-16 リンテック株式会社 接着シート貼付装置および方法
JP3017470B2 (ja) * 1997-07-11 2000-03-06 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
DE19731780A1 (de) * 1997-07-24 1999-01-28 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung empfindlicher Formteile unter Einsatz einer Folie
JP3017485B2 (ja) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
NL1008488C2 (nl) * 1998-03-05 1999-09-07 Fico Bv Maldeel, mal en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten.
DE69904812T2 (de) * 1998-04-17 2003-10-30 "3P" Licensing B.V., Zevenaar Verpackung für einkapselungsmaterial
NL1008924C2 (nl) * 1998-04-17 1999-10-19 3P Licensing Bv Eenheidsdosering voor omhullingsmateriaal, een daarvoor bestemde verpakking en een werkwijze voor het vervaardigen daarvan.
NL1009563C2 (nl) 1998-07-06 2000-01-10 Fico Bv Mal, omhulinrichting en werkwijze voor het omhullen.
US6344162B1 (en) * 1998-07-10 2002-02-05 Apic Yamada Corporation Method of manufacturing semiconductor devices and resin molding machine
JP3486557B2 (ja) * 1998-07-30 2004-01-13 宮崎沖電気株式会社 トランスファ成形装置及び半導体装置の製造方法
JP3450223B2 (ja) * 1999-05-27 2003-09-22 Ｎｅｃエレクトロニクス株式会社 半導体装置封入用金型、及び、半導体装置封入方法
JP4077118B2 (ja) * 1999-06-25 2008-04-16 富士通株式会社 半導体装置の製造方法および半導体装置製造用金型
US6312976B1 (en) 1999-11-22 2001-11-06 Advanced Semiconductor Engineering, Inc. Method for manufacturing leadless semiconductor chip package
JP3971541B2 (ja) * 1999-12-24 2007-09-05 富士通株式会社 半導体装置の製造方法及びこの方法に用いる分割金型
JP3510554B2 (ja) * 2000-02-10 2004-03-29 山形日本電気株式会社 樹脂モールド方法、モールド成形用金型及び配線基材
JP4239352B2 (ja) * 2000-03-28 2009-03-18 株式会社日立製作所 電子装置の製造方法
US6916683B2 (en) * 2000-05-11 2005-07-12 Micron Technology, Inc. Methods of fabricating a molded ball grid array
JP2002009096A (ja) * 2000-06-20 2002-01-11 Apic Yamada Corp 樹脂封止方法及び樹脂封止装置
US6439869B1 (en) 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
US6770236B2 (en) * 2000-08-22 2004-08-03 Apic Yamada Corp. Method of resin molding
US6838760B1 (en) * 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units
US20020043389A1 (en) * 2000-09-29 2002-04-18 Selvarajan Murugan Virtual gate design for thin packages
US6486066B2 (en) * 2001-02-02 2002-11-26 Matrix Semiconductor, Inc. Method of generating integrated circuit feature layout for improved chemical mechanical polishing
US7595017B2 (en) * 2002-01-31 2009-09-29 Stmicroelectronics, Inc. Method for using a pre-formed film in a transfer molding process for an integrated circuit
JP2004134591A (ja) * 2002-10-10 2004-04-30 Renesas Technology Corp 半導体集積回路装置の製造方法
US6989122B1 (en) * 2002-10-17 2006-01-24 National Semiconductor Corporation Techniques for manufacturing flash-free contacts on a semiconductor package
DE10297823T5 (de) * 2002-12-10 2005-10-20 Infineon Technologies Ag Verfahren zum Kapseln intergrierter Schaltungen und über das Verfahren hergestellte integrierte Schaltungsbausteine
KR100546372B1 (ko) * 2003-08-28 2006-01-26 삼성전자주식회사 웨이퍼 레벨 칩 사이즈 패키지의 제조방법
US20050058837A1 (en) * 2003-09-16 2005-03-17 Farnworth Warren M. Processes for facilitating removal of stereolithographically fabricated objects from platens of stereolithographic fabrication equipment, object release elements for effecting such processes, systems and fabrication processes employing the object release elements, and objects which have been fabricated using the object release elements
KR100957703B1 (ko) * 2007-04-13 2010-05-12 주식회사 엘지화학 미세패턴 형성 방법
JP5172590B2 (ja) * 2008-10-14 2013-03-27 新光電気工業株式会社 積層配線基板の樹脂封止方法及び樹脂封止装置
CN102246261B (zh) * 2008-11-17 2015-08-12 先进封装技术私人有限公司 用于密封半导体裸片的系统
CN102011952A (zh) * 2009-09-04 2011-04-13 佛山市国星光电股份有限公司 Led光源模块的制造方法及该方法的产品
CN102371646A (zh) * 2010-08-11 2012-03-14 联想(北京)有限公司 一种工件的制备方法
FR2975038B1 (fr) * 2011-05-10 2014-03-07 Airbus Operations Sas Procede de fabrication d'une piece en materiau composite et piece ainsi obtenue.
DE102011082157A1 (de) * 2011-09-06 2013-03-07 Osram Opto Semiconductors Gmbh Presswerkzeug und Verfahrenzum Herstellen eines Silikonelements
CN102303387A (zh) * 2011-09-08 2012-01-04 扬州杰特沈飞车辆装饰件有限公司 一种餐桌封边工艺
JP2013093504A (ja) * 2011-10-27 2013-05-16 Toshiba Corp 半導体装置の製造方法および冶具
JP5877083B2 (ja) 2012-02-14 2016-03-02 住友重機械工業株式会社 樹脂封止装置及び樹脂封止方法
US20140275915A1 (en) * 2013-03-13 2014-09-18 Medtronic, Inc. Implantable medical device including a molded planar transformer
US20160141187A1 (en) * 2014-11-14 2016-05-19 Infineon Technologies Ag Method of manufacturing an integrated circuit with imprint, integrated circuit with imprint, device for forming an integrated circuit with imprint and verification system for an integrated circuit with imprint
CN111867797B (zh) 2017-12-15 2022-05-17 西部制药服务有限公司 光滑膜层压弹性体制品
US11014140B2 (en) * 2019-04-15 2021-05-25 Raytheon Technologies Corporation Ceramic core setter
JP7360368B2 (ja) * 2020-08-18 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
KR20220088963A (ko) * 2020-12-21 2022-06-28 현태섭 연질 성형물의 성형 캐비티

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754070A (en) * 1970-08-03 1973-08-21 Motorola Inc Flash free molding
US4003544A (en) * 1973-06-11 1977-01-18 Motorola, Inc. Gateless injection mold for encapsulating semiconductor devices
JPS5243366A (en) * 1975-10-01 1977-04-05 Hitachi Ltd Mold for resin molding
US4052241A (en) * 1975-11-13 1977-10-04 Detroit Gasket And Manufacturing Company Method of forming a contoured laminate
JPS60131213A (ja) * 1983-12-21 1985-07-12 Japan Steel Works Ltd:The 転写成形装置
JPS614234A (ja) * 1984-06-19 1986-01-10 Michio Osada 半導体素子の樹脂モ−ルド成形方法及び半導体リ−ドフレ−ム
JPS61167515A (ja) * 1985-01-21 1986-07-29 Hitachi Ltd モ−ルド装置
JPS6251416A (ja) * 1985-08-30 1987-03-06 Sony Corp 樹脂封止金型
JPS62207615A (ja) * 1986-03-07 1987-09-12 Fujitsu Ltd 樹脂封止用金型
JPS6444026A (en) * 1987-08-11 1989-02-16 Michio Osada Resin-seal formation of component to be sealed and heat resistant sheet member used therefor
JPH01202415A (ja) * 1988-02-08 1989-08-15 Matsuda Seisakusho:Kk 射出成形同時絵付け方法において、フイルムの離型方法
DE3811814C2 (de) * 1988-04-08 1994-08-25 Siemens Ag Spritz-Form-Vorrichtung für quarzgefülltes Kunststoff-Material
JPH01293523A (ja) * 1988-05-20 1989-11-27 Mitsubishi Electric Corp 樹脂封止型半導体装置用封止金型
JPH01299008A (ja) * 1988-05-27 1989-12-01 Mitsubishi Electric Corp モールド装置
EP0350179B1 (de) * 1988-06-21 1994-01-19 Gec Avery Limited Herstellung von tragbaren elektronischen Karten
JPH0245117A (ja) * 1988-08-05 1990-02-15 Mitsubishi Electric Corp 樹脂封止型半導体装置用の金型
US4944908A (en) * 1988-10-28 1990-07-31 Eaton Corporation Method for forming a molded plastic article
US5043199A (en) * 1988-10-31 1991-08-27 Fujitsu Limited Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet
NL8802879A (nl) * 1988-11-22 1990-06-18 Ireneus Johannes Theodorus Mar Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze.
US4956141A (en) * 1989-04-07 1990-09-11 Libbey-Owens-Ford Co. Molding process utilizing a mold release membrane
US5417905A (en) * 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces
US4965037A (en) * 1989-07-17 1990-10-23 Libbey-Owens-Ford Co. Method of molding a composite
US5226997A (en) * 1989-08-28 1993-07-13 United Technologies Corporation Mold liners for resin transfer molding
JPH03234605A (ja) * 1990-02-13 1991-10-18 Toshiba Corp レジン成形装置
JPH0437507A (ja) * 1990-06-02 1992-02-07 Yamada Seisakusho Co Ltd 成形機のエジェクタピン取付構造
US5270262A (en) * 1991-02-28 1993-12-14 National Semiconductor Corporation O-ring package
US5185653A (en) * 1990-11-08 1993-02-09 National Semiconductor Corporation O-ring package
NL9200127A (nl) * 1992-01-23 1993-08-16 Ireneus Johannes Theodorus Mar Werkwijze voor het in een vormholte persen van een door een reactie uithardende kunststof, een daarbij te gebruiken pilvormig pershulpmateriaal alsmede een houder uit dergelijk materiaal.
CA2101300C (en) * 1992-08-04 1998-07-28 Emery I. Valyi Process and apparatus for forming a color coated article
JPH06151490A (ja) * 1992-11-05 1994-05-31 Toshiba Corp 半導体装置製造用金型
NL9400119A (nl) * 1994-01-27 1995-09-01 3P Licensing Bv Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.
USH1654H (en) * 1995-01-10 1997-06-03 Rounds; Nicholas A. Transfer molding process for encapsulating semiconductor devices

Also Published As

Publication number Publication date
KR960017105A (ko) 1996-06-17
CN1131610A (zh) 1996-09-25
MY114403A (en) 2002-10-31
DE69501632T2 (de) 1998-07-23
TW291569B (de) 1996-11-21
EP0730937A1 (de) 1996-09-11
US5891384A (en) 1999-04-06
CN1061929C (zh) 2001-02-14
KR100193592B1 (ko) 1999-06-15
EP0730937B1 (de) 1998-02-18

Similar Documents

Publication Publication Date Title
DE69501632D1 (de) Harzformmaschine mit Trennfolie
DE59506540D1 (de) Thermoplastische formmasse
DE69510637D1 (de) Thermoplastische harzzusammensetzung
DE69629971D1 (de) Hammhemmende thermoplastische Harzzusammensetzung
DE69528601D1 (de) Thermoplastische harzzusammensetzung
DE69018635D1 (de) Thermoplastische harzzusammensetzung.
DE69415065D1 (de) Thermoplastische Harzzusammensetzung
DE59602492D1 (de) Thermoplastische formmassen mit geringem streulichtanteil
DE69609115D1 (de) Thermoplastische Harzzusammensetzung
DE69418751D1 (de) Thermoplastische Harzzusammensetzung
DE69408912D1 (de) Thermoplastische Harzzusammensetzung
DE69609655D1 (de) Thermoplastische Harzzusammensetzung
DE69214599D1 (de) Thermoplastische Harzzusammensetzung
DE69615314D1 (de) Thermoplastische Harzzusammensetzung
DE69622230D1 (de) Thermoplastische Harzzusammensetzung
DE69412229D1 (de) Thermoplastischer Harzfilm mit ausgezeichneter Druckfähigkeit
DE59501363D1 (de) Thermoplastische Formmassen
DE69121646D1 (de) Thermoplastische Harzzusammensetzung
DE69516623D1 (de) Thermoplastische Harzzusammensetzung
DE59108450D1 (de) Thermoplastische Formmassen
DE69123799D1 (de) Thermoplastische Harzzusammensetzung
DE69215147D1 (de) Thermoplastische Harzzusammensetzung
DE69211745D1 (de) Thermoplastische Harzzusammensetzung
DE69600135D1 (de) Thermoplastische Harzzusammensetzung
DE69421863D1 (de) Thermoplastische Kunstharzzusammensetzung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee