JPWO2023286720A5 - - Google Patents

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Publication number
JPWO2023286720A5
JPWO2023286720A5 JP2023534783A JP2023534783A JPWO2023286720A5 JP WO2023286720 A5 JPWO2023286720 A5 JP WO2023286720A5 JP 2023534783 A JP2023534783 A JP 2023534783A JP 2023534783 A JP2023534783 A JP 2023534783A JP WO2023286720 A5 JPWO2023286720 A5 JP WO2023286720A5
Authority
JP
Japan
Prior art keywords
semiconductor device
back surface
thickness direction
recesses
dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023534783A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023286720A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/027186 external-priority patent/WO2023286720A1/ja
Publication of JPWO2023286720A1 publication Critical patent/JPWO2023286720A1/ja
Publication of JPWO2023286720A5 publication Critical patent/JPWO2023286720A5/ja
Pending legal-status Critical Current

Links

JP2023534783A 2021-07-13 2022-07-11 Pending JPWO2023286720A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021115672 2021-07-13
JP2021119864 2021-07-20
PCT/JP2022/027186 WO2023286720A1 (ja) 2021-07-13 2022-07-11 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023286720A1 JPWO2023286720A1 (https=) 2023-01-19
JPWO2023286720A5 true JPWO2023286720A5 (https=) 2024-04-10

Family

ID=84919405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023534783A Pending JPWO2023286720A1 (https=) 2021-07-13 2022-07-11

Country Status (4)

Country Link
US (1) US20240120261A1 (https=)
JP (1) JPWO2023286720A1 (https=)
DE (1) DE112022002409T5 (https=)
WO (1) WO2023286720A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012014382A1 (ja) * 2010-07-27 2013-09-09 パナソニック株式会社 半導体装置
JP5376540B2 (ja) * 2011-11-08 2013-12-25 Shプレシジョン株式会社 リードフレーム及び半導体装置
JP2016201447A (ja) * 2015-04-09 2016-12-01 株式会社デンソー モールドパッケージ
JP2021027116A (ja) 2019-08-02 2021-02-22 ローム株式会社 半導体装置

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