JPWO2024057838A5 - - Google Patents

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Publication number
JPWO2024057838A5
JPWO2024057838A5 JP2024546803A JP2024546803A JPWO2024057838A5 JP WO2024057838 A5 JPWO2024057838 A5 JP WO2024057838A5 JP 2024546803 A JP2024546803 A JP 2024546803A JP 2024546803 A JP2024546803 A JP 2024546803A JP WO2024057838 A5 JPWO2024057838 A5 JP WO2024057838A5
Authority
JP
Japan
Prior art keywords
lead
thickness direction
semiconductor device
resin
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024546803A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024057838A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/030130 external-priority patent/WO2024057838A1/ja
Publication of JPWO2024057838A1 publication Critical patent/JPWO2024057838A1/ja
Publication of JPWO2024057838A5 publication Critical patent/JPWO2024057838A5/ja
Pending legal-status Critical Current

Links

JP2024546803A 2022-09-14 2023-08-22 Pending JPWO2024057838A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022146346 2022-09-14
PCT/JP2023/030130 WO2024057838A1 (ja) 2022-09-14 2023-08-22 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024057838A1 JPWO2024057838A1 (https=) 2024-03-21
JPWO2024057838A5 true JPWO2024057838A5 (https=) 2025-05-22

Family

ID=90274851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024546803A Pending JPWO2024057838A1 (https=) 2022-09-14 2023-08-22

Country Status (3)

Country Link
US (1) US20250210475A1 (https=)
JP (1) JPWO2024057838A1 (https=)
WO (1) WO2024057838A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0437050A (ja) * 1990-05-31 1992-02-07 Hitachi Ltd 樹脂封止型半導体装置
US5585667A (en) * 1994-12-23 1996-12-17 National Semiconductor Corporation Lead frame for handling crossing bonding wires
JP2011054626A (ja) * 2009-08-31 2011-03-17 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP6721346B2 (ja) * 2016-01-27 2020-07-15 ローム株式会社 半導体装置

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