JPWO2023189650A5 - - Google Patents
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- Publication number
- JPWO2023189650A5 JPWO2023189650A5 JP2024511785A JP2024511785A JPWO2023189650A5 JP WO2023189650 A5 JPWO2023189650 A5 JP WO2023189650A5 JP 2024511785 A JP2024511785 A JP 2024511785A JP 2024511785 A JP2024511785 A JP 2024511785A JP WO2023189650 A5 JPWO2023189650 A5 JP WO2023189650A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- connection member
- die pad
- lead
- thickness direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 24
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 238000007789 sealing Methods 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022060621 | 2022-03-31 | ||
| PCT/JP2023/010293 WO2023189650A1 (ja) | 2022-03-31 | 2023-03-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023189650A1 JPWO2023189650A1 (https=) | 2023-10-05 |
| JPWO2023189650A5 true JPWO2023189650A5 (https=) | 2024-12-12 |
Family
ID=88201751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024511785A Pending JPWO2023189650A1 (https=) | 2022-03-31 | 2023-03-16 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250022777A1 (https=) |
| JP (1) | JPWO2023189650A1 (https=) |
| WO (1) | WO2023189650A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115428143A (zh) * | 2020-04-27 | 2022-12-02 | 罗姆股份有限公司 | 半导体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0382066A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | 半導体装置 |
| JPH06224357A (ja) * | 1993-01-26 | 1994-08-12 | Toshiba Corp | 樹脂封止型半導体装置 |
| JPH0745778A (ja) * | 1993-07-29 | 1995-02-14 | Sumitomo Electric Ind Ltd | リードフレーム及び半導体装置 |
| JP3356680B2 (ja) * | 1998-04-10 | 2002-12-16 | 日本電気株式会社 | リードフレーム及び半導体装置及び半導体装置の製造方法 |
| JP4469654B2 (ja) * | 2004-05-13 | 2010-05-26 | パナソニック株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2006147602A (ja) * | 2004-11-16 | 2006-06-08 | Matsushita Electric Ind Co Ltd | 高周波半導体装置 |
| JP5001872B2 (ja) * | 2008-02-13 | 2012-08-15 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2023
- 2023-03-16 WO PCT/JP2023/010293 patent/WO2023189650A1/ja not_active Ceased
- 2023-03-16 JP JP2024511785A patent/JPWO2023189650A1/ja active Pending
-
2024
- 2024-09-27 US US18/900,109 patent/US20250022777A1/en active Pending
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