JPWO2023167000A5 - - Google Patents
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- Publication number
- JPWO2023167000A5 JPWO2023167000A5 JP2024504606A JP2024504606A JPWO2023167000A5 JP WO2023167000 A5 JPWO2023167000 A5 JP WO2023167000A5 JP 2024504606 A JP2024504606 A JP 2024504606A JP 2024504606 A JP2024504606 A JP 2024504606A JP WO2023167000 A5 JPWO2023167000 A5 JP WO2023167000A5
- Authority
- JP
- Japan
- Prior art keywords
- wire
- terminal portion
- pad portion
- lead
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022032071 | 2022-03-02 | ||
| JP2022049004 | 2022-03-24 | ||
| PCT/JP2023/005441 WO2023167000A1 (ja) | 2022-03-02 | 2023-02-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023167000A1 JPWO2023167000A1 (https=) | 2023-09-07 |
| JPWO2023167000A5 true JPWO2023167000A5 (https=) | 2024-11-06 |
Family
ID=87883449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024504606A Pending JPWO2023167000A1 (https=) | 2022-03-02 | 2023-02-16 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240421022A1 (https=) |
| JP (1) | JPWO2023167000A1 (https=) |
| DE (1) | DE112023000851T5 (https=) |
| WO (1) | WO2023167000A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115428143A (zh) * | 2020-04-27 | 2022-12-02 | 罗姆股份有限公司 | 半导体装置 |
| WO2025263387A1 (ja) * | 2024-06-18 | 2025-12-26 | ローム株式会社 | 半導体装置、および半導体モジュール |
| WO2026014325A1 (ja) * | 2024-07-11 | 2026-01-15 | ローム株式会社 | 半導体装置 |
| CN120261410B (zh) * | 2025-06-03 | 2025-08-12 | 江苏捷捷微电子股份有限公司 | Stoll封装的MOS管温度测试结构及其制造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02302634A (ja) * | 1989-05-17 | 1990-12-14 | Fujitsu Ltd | 半導体集積回路の温度センサ |
| JP2009293986A (ja) * | 2008-06-03 | 2009-12-17 | Denso Corp | 半導体装置 |
| US10964688B2 (en) | 2015-10-01 | 2021-03-30 | Rohm Co., Ltd. | Semiconductor device |
| JP6817777B2 (ja) * | 2015-12-16 | 2021-01-20 | ローム株式会社 | 半導体装置 |
| JP7018319B2 (ja) | 2018-01-11 | 2022-02-10 | ローム株式会社 | 半導体装置 |
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2023
- 2023-02-16 DE DE112023000851.5T patent/DE112023000851T5/de active Pending
- 2023-02-16 JP JP2024504606A patent/JPWO2023167000A1/ja active Pending
- 2023-02-16 WO PCT/JP2023/005441 patent/WO2023167000A1/ja not_active Ceased
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2024
- 2024-08-27 US US18/816,494 patent/US20240421022A1/en active Pending