JPWO2023167000A5 - - Google Patents

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Publication number
JPWO2023167000A5
JPWO2023167000A5 JP2024504606A JP2024504606A JPWO2023167000A5 JP WO2023167000 A5 JPWO2023167000 A5 JP WO2023167000A5 JP 2024504606 A JP2024504606 A JP 2024504606A JP 2024504606 A JP2024504606 A JP 2024504606A JP WO2023167000 A5 JPWO2023167000 A5 JP WO2023167000A5
Authority
JP
Japan
Prior art keywords
wire
terminal portion
pad portion
lead
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024504606A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023167000A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/005441 external-priority patent/WO2023167000A1/ja
Publication of JPWO2023167000A1 publication Critical patent/JPWO2023167000A1/ja
Publication of JPWO2023167000A5 publication Critical patent/JPWO2023167000A5/ja
Pending legal-status Critical Current

Links

JP2024504606A 2022-03-02 2023-02-16 Pending JPWO2023167000A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022032071 2022-03-02
JP2022049004 2022-03-24
PCT/JP2023/005441 WO2023167000A1 (ja) 2022-03-02 2023-02-16 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023167000A1 JPWO2023167000A1 (https=) 2023-09-07
JPWO2023167000A5 true JPWO2023167000A5 (https=) 2024-11-06

Family

ID=87883449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024504606A Pending JPWO2023167000A1 (https=) 2022-03-02 2023-02-16

Country Status (4)

Country Link
US (1) US20240421022A1 (https=)
JP (1) JPWO2023167000A1 (https=)
DE (1) DE112023000851T5 (https=)
WO (1) WO2023167000A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12417954B2 (en) * 2020-04-27 2025-09-16 Rohm Co., Ltd. Semiconductor device
WO2025263387A1 (ja) * 2024-06-18 2025-12-26 ローム株式会社 半導体装置、および半導体モジュール
WO2026014325A1 (ja) * 2024-07-11 2026-01-15 ローム株式会社 半導体装置
CN120261410B (zh) * 2025-06-03 2025-08-12 江苏捷捷微电子股份有限公司 Stoll封装的MOS管温度测试结构及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02302634A (ja) * 1989-05-17 1990-12-14 Fujitsu Ltd 半導体集積回路の温度センサ
JP2009293986A (ja) * 2008-06-03 2009-12-17 Denso Corp 半導体装置
US10964688B2 (en) 2015-10-01 2021-03-30 Rohm Co., Ltd. Semiconductor device
JP6817777B2 (ja) * 2015-12-16 2021-01-20 ローム株式会社 半導体装置
JP7018319B2 (ja) 2018-01-11 2022-02-10 ローム株式会社 半導体装置

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