JPWO2024009722A5 - - Google Patents

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Publication number
JPWO2024009722A5
JPWO2024009722A5 JP2024531987A JP2024531987A JPWO2024009722A5 JP WO2024009722 A5 JPWO2024009722 A5 JP WO2024009722A5 JP 2024531987 A JP2024531987 A JP 2024531987A JP 2024531987 A JP2024531987 A JP 2024531987A JP WO2024009722 A5 JPWO2024009722 A5 JP WO2024009722A5
Authority
JP
Japan
Prior art keywords
wires
semiconductor device
thickness direction
surface electrode
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024531987A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024009722A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/022234 external-priority patent/WO2024009722A1/ja
Publication of JPWO2024009722A1 publication Critical patent/JPWO2024009722A1/ja
Publication of JPWO2024009722A5 publication Critical patent/JPWO2024009722A5/ja
Pending legal-status Critical Current

Links

JP2024531987A 2022-07-05 2023-06-15 Pending JPWO2024009722A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022108302 2022-07-05
PCT/JP2023/022234 WO2024009722A1 (ja) 2022-07-05 2023-06-15 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024009722A1 JPWO2024009722A1 (https=) 2024-01-11
JPWO2024009722A5 true JPWO2024009722A5 (https=) 2025-03-14

Family

ID=89453188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024531987A Pending JPWO2024009722A1 (https=) 2022-07-05 2023-06-15

Country Status (2)

Country Link
JP (1) JPWO2024009722A1 (https=)
WO (1) WO2024009722A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4471823B2 (ja) * 2004-12-06 2010-06-02 三菱電機株式会社 電力半導体装置
WO2016143557A1 (ja) * 2015-03-10 2016-09-15 三菱電機株式会社 パワー半導体装置
CN113841232A (zh) * 2019-05-20 2021-12-24 罗姆股份有限公司 半导体装置
DE112021002909T5 (de) * 2020-06-23 2023-03-09 Rohm Co., Ltd. Halbleiterbauteil

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