JPWO2024181293A5 - - Google Patents

Info

Publication number
JPWO2024181293A5
JPWO2024181293A5 JP2025503835A JP2025503835A JPWO2024181293A5 JP WO2024181293 A5 JPWO2024181293 A5 JP WO2024181293A5 JP 2025503835 A JP2025503835 A JP 2025503835A JP 2025503835 A JP2025503835 A JP 2025503835A JP WO2024181293 A5 JPWO2024181293 A5 JP WO2024181293A5
Authority
JP
Japan
Prior art keywords
lead
thickness direction
semiconductor element
electrode
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025503835A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024181293A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/006498 external-priority patent/WO2024181293A1/ja
Publication of JPWO2024181293A1 publication Critical patent/JPWO2024181293A1/ja
Publication of JPWO2024181293A5 publication Critical patent/JPWO2024181293A5/ja
Pending legal-status Critical Current

Links

JP2025503835A 2023-03-01 2024-02-22 Pending JPWO2024181293A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023031042 2023-03-01
JP2023032974 2023-03-03
PCT/JP2024/006498 WO2024181293A1 (ja) 2023-03-01 2024-02-22 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024181293A1 JPWO2024181293A1 (https=) 2024-09-06
JPWO2024181293A5 true JPWO2024181293A5 (https=) 2025-11-13

Family

ID=92590483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025503835A Pending JPWO2024181293A1 (https=) 2023-03-01 2024-02-22

Country Status (3)

Country Link
US (1) US20250391805A1 (https=)
JP (1) JPWO2024181293A1 (https=)
WO (1) WO2024181293A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258179A (ja) * 2002-02-28 2003-09-12 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP2006294729A (ja) * 2005-04-07 2006-10-26 Toshiba Corp 半導体装置
JP6653199B2 (ja) * 2016-03-23 2020-02-26 ローム株式会社 半導体装置
JP6827776B2 (ja) * 2016-11-15 2021-02-10 ローム株式会社 半導体デバイス
JP7260224B2 (ja) * 2019-01-18 2023-04-18 ローム株式会社 半導体装置
US12165957B2 (en) * 2019-07-01 2024-12-10 Rohm Co., Ltd. Semiconductor device

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