JPWO2023063025A5 - - Google Patents
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- Publication number
- JPWO2023063025A5 JPWO2023063025A5 JP2023555051A JP2023555051A JPWO2023063025A5 JP WO2023063025 A5 JPWO2023063025 A5 JP WO2023063025A5 JP 2023555051 A JP2023555051 A JP 2023555051A JP 2023555051 A JP2023555051 A JP 2023555051A JP WO2023063025 A5 JPWO2023063025 A5 JP WO2023063025A5
- Authority
- JP
- Japan
- Prior art keywords
- thickness direction
- semiconductor device
- viewed
- mounting
- recessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 19
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021168361 | 2021-10-13 | ||
| PCT/JP2022/034711 WO2023063025A1 (ja) | 2021-10-13 | 2022-09-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023063025A1 JPWO2023063025A1 (https=) | 2023-04-20 |
| JPWO2023063025A5 true JPWO2023063025A5 (https=) | 2024-07-04 |
Family
ID=85987668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023555051A Pending JPWO2023063025A1 (https=) | 2021-10-13 | 2022-09-16 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240250014A1 (https=) |
| JP (1) | JPWO2023063025A1 (https=) |
| CN (1) | CN118103973A (https=) |
| DE (1) | DE112022004904T5 (https=) |
| WO (1) | WO2023063025A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014207430A (ja) | 2013-03-21 | 2014-10-30 | ローム株式会社 | 半導体装置 |
| JP6695166B2 (ja) * | 2016-02-23 | 2020-05-20 | 株式会社三井ハイテック | リードフレーム、及び半導体パッケージの製造方法 |
| JP6115671B2 (ja) * | 2016-04-12 | 2017-04-19 | 日亜化学工業株式会社 | リードフレーム、樹脂付きリードフレーム、光半導体装置 |
| JP2019102467A (ja) * | 2017-11-28 | 2019-06-24 | トヨタ自動車株式会社 | 半導体装置 |
| CN111868919B (zh) * | 2018-03-12 | 2024-02-27 | 罗姆股份有限公司 | 半导体装置、及半导体装置的安装结构 |
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2022
- 2022-09-16 WO PCT/JP2022/034711 patent/WO2023063025A1/ja not_active Ceased
- 2022-09-16 JP JP2023555051A patent/JPWO2023063025A1/ja active Pending
- 2022-09-16 CN CN202280069095.5A patent/CN118103973A/zh active Pending
- 2022-09-16 DE DE112022004904.9T patent/DE112022004904T5/de active Pending
-
2024
- 2024-04-04 US US18/626,980 patent/US20240250014A1/en active Pending