JPWO2023120185A5 - - Google Patents
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- Publication number
- JPWO2023120185A5 JPWO2023120185A5 JP2023569281A JP2023569281A JPWO2023120185A5 JP WO2023120185 A5 JPWO2023120185 A5 JP WO2023120185A5 JP 2023569281 A JP2023569281 A JP 2023569281A JP 2023569281 A JP2023569281 A JP 2023569281A JP WO2023120185 A5 JPWO2023120185 A5 JP WO2023120185A5
- Authority
- JP
- Japan
- Prior art keywords
- thickness direction
- semiconductor device
- layer
- end surface
- dimension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 230000002093 peripheral effect Effects 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- 230000017525 heat dissipation Effects 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021210252 | 2021-12-24 | ||
| PCT/JP2022/045063 WO2023120185A1 (ja) | 2021-12-24 | 2022-12-07 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023120185A1 JPWO2023120185A1 (https=) | 2023-06-29 |
| JPWO2023120185A5 true JPWO2023120185A5 (https=) | 2024-09-05 |
Family
ID=86902301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023569281A Pending JPWO2023120185A1 (https=) | 2021-12-24 | 2022-12-07 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240282692A1 (https=) |
| JP (1) | JPWO2023120185A1 (https=) |
| CN (1) | CN118435350A (https=) |
| DE (1) | DE112022005570T5 (https=) |
| WO (1) | WO2023120185A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013258387A (ja) | 2012-05-15 | 2013-12-26 | Rohm Co Ltd | パワーモジュール半導体装置 |
| JP5975911B2 (ja) * | 2013-03-15 | 2016-08-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| EP3255666B1 (en) * | 2015-02-02 | 2021-10-13 | Kabushiki Kaisha Toshiba | Silicon nitride circuit substrate and electronic component module using same |
| JP2017108002A (ja) * | 2015-12-10 | 2017-06-15 | トヨタ自動車株式会社 | 半導体モジュール |
| JP6694059B2 (ja) * | 2016-04-26 | 2020-05-13 | 京セラ株式会社 | パワーモジュール用基板およびパワーモジュール |
| EP3460838B1 (en) * | 2016-05-19 | 2021-02-24 | Mitsubishi Materials Corporation | Substrate for power modules |
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2022
- 2022-12-07 CN CN202280084117.5A patent/CN118435350A/zh active Pending
- 2022-12-07 JP JP2023569281A patent/JPWO2023120185A1/ja active Pending
- 2022-12-07 DE DE112022005570.7T patent/DE112022005570T5/de active Pending
- 2022-12-07 WO PCT/JP2022/045063 patent/WO2023120185A1/ja not_active Ceased
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2024
- 2024-05-01 US US18/652,365 patent/US20240282692A1/en active Pending