JPWO2023063064A5 - - Google Patents
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- Publication number
- JPWO2023063064A5 JPWO2023063064A5 JP2023555075A JP2023555075A JPWO2023063064A5 JP WO2023063064 A5 JPWO2023063064 A5 JP WO2023063064A5 JP 2023555075 A JP2023555075 A JP 2023555075A JP 2023555075 A JP2023555075 A JP 2023555075A JP WO2023063064 A5 JPWO2023063064 A5 JP WO2023063064A5
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- sealing resin
- semiconductor device
- bonding layer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021168410 | 2021-10-13 | ||
| PCT/JP2022/035719 WO2023063064A1 (ja) | 2021-10-13 | 2022-09-26 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023063064A1 JPWO2023063064A1 (https=) | 2023-04-20 |
| JPWO2023063064A5 true JPWO2023063064A5 (https=) | 2024-07-04 |
Family
ID=85988495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023555075A Pending JPWO2023063064A1 (https=) | 2021-10-13 | 2022-09-26 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240153836A1 (https=) |
| JP (1) | JPWO2023063064A1 (https=) |
| CN (1) | CN117897807A (https=) |
| DE (1) | DE112022004390T5 (https=) |
| WO (1) | WO2023063064A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002009218A (ja) * | 2000-06-20 | 2002-01-11 | Hitachi Ltd | 半導体パッケージ及びそのリード端子部材 |
| JP2015137344A (ja) * | 2014-01-24 | 2015-07-30 | 住友ベークライト株式会社 | 封止用エポキシ樹脂組成物、及び半導体装置 |
| JP2016004877A (ja) * | 2014-06-16 | 2016-01-12 | ルネサスエレクトロニクス株式会社 | 半導体装置および電子装置 |
| JP2016216606A (ja) * | 2015-05-20 | 2016-12-22 | 株式会社ダイセル | 硬化性樹脂組成物及びその硬化物、並びに半導体装置 |
| US10410857B2 (en) | 2015-08-24 | 2019-09-10 | Asm Ip Holding B.V. | Formation of SiN thin films |
| JP2017050441A (ja) | 2015-09-03 | 2017-03-09 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-09-26 JP JP2023555075A patent/JPWO2023063064A1/ja active Pending
- 2022-09-26 CN CN202280058306.5A patent/CN117897807A/zh active Pending
- 2022-09-26 WO PCT/JP2022/035719 patent/WO2023063064A1/ja not_active Ceased
- 2022-09-26 DE DE112022004390.3T patent/DE112022004390T5/de active Pending
-
2024
- 2024-01-17 US US18/414,969 patent/US20240153836A1/en active Pending
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