JPWO2024214425A5 - - Google Patents

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Publication number
JPWO2024214425A5
JPWO2024214425A5 JP2025513823A JP2025513823A JPWO2024214425A5 JP WO2024214425 A5 JPWO2024214425 A5 JP WO2024214425A5 JP 2025513823 A JP2025513823 A JP 2025513823A JP 2025513823 A JP2025513823 A JP 2025513823A JP WO2024214425 A5 JPWO2024214425 A5 JP WO2024214425A5
Authority
JP
Japan
Prior art keywords
bonding layer
semiconductor device
outer edge
sintered bonding
conductive plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025513823A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024214425A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/008106 external-priority patent/WO2024214425A1/ja
Publication of JPWO2024214425A1 publication Critical patent/JPWO2024214425A1/ja
Publication of JPWO2024214425A5 publication Critical patent/JPWO2024214425A5/ja
Pending legal-status Critical Current

Links

JP2025513823A 2023-04-13 2024-03-04 Pending JPWO2024214425A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023065562 2023-04-13
PCT/JP2024/008106 WO2024214425A1 (ja) 2023-04-13 2024-03-04 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024214425A1 JPWO2024214425A1 (https=) 2024-10-17
JPWO2024214425A5 true JPWO2024214425A5 (https=) 2025-06-18

Family

ID=93059480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025513823A Pending JPWO2024214425A1 (https=) 2023-04-13 2024-03-04

Country Status (4)

Country Link
US (1) US20250226276A1 (https=)
JP (1) JPWO2024214425A1 (https=)
DE (1) DE112024000132T5 (https=)
WO (1) WO2024214425A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4319591B2 (ja) * 2004-07-15 2009-08-26 株式会社日立製作所 半導体パワーモジュール
JP2013062439A (ja) * 2011-09-14 2013-04-04 Toyota Motor Corp パワーモジュールおよびその製造方法
JP6349903B2 (ja) * 2014-01-30 2018-07-04 日立化成株式会社 半導体装置
JP7454129B2 (ja) * 2020-03-18 2024-03-22 富士電機株式会社 半導体装置
JP7647253B2 (ja) * 2021-04-01 2025-03-18 富士電機株式会社 半導体モジュールおよび半導体モジュールの製造方法
CN116802777A (zh) * 2021-07-16 2023-09-22 富士电机株式会社 半导体装置

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