JPWO2023100659A5 - - Google Patents
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- Publication number
- JPWO2023100659A5 JPWO2023100659A5 JP2023564862A JP2023564862A JPWO2023100659A5 JP WO2023100659 A5 JPWO2023100659 A5 JP WO2023100659A5 JP 2023564862 A JP2023564862 A JP 2023564862A JP 2023564862 A JP2023564862 A JP 2023564862A JP WO2023100659 A5 JPWO2023100659 A5 JP WO2023100659A5
- Authority
- JP
- Japan
- Prior art keywords
- thickness direction
- semiconductor device
- lead
- resin surface
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 23
- 229920005989 resin Polymers 0.000 claims 23
- 239000004065 semiconductor Substances 0.000 claims 20
- 238000007789 sealing Methods 0.000 claims 7
- 230000035515 penetration Effects 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021195177 | 2021-12-01 | ||
| PCT/JP2022/042573 WO2023100659A1 (ja) | 2021-12-01 | 2022-11-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100659A1 JPWO2023100659A1 (https=) | 2023-06-08 |
| JPWO2023100659A5 true JPWO2023100659A5 (https=) | 2024-08-15 |
Family
ID=86612047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564862A Pending JPWO2023100659A1 (https=) | 2021-12-01 | 2022-11-16 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240258219A1 (https=) |
| JP (1) | JPWO2023100659A1 (https=) |
| CN (1) | CN118382925A (https=) |
| DE (1) | DE112022005176T5 (https=) |
| WO (1) | WO2023100659A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12417954B2 (en) * | 2020-04-27 | 2025-09-16 | Rohm Co., Ltd. | Semiconductor device |
| US20240021487A1 (en) * | 2022-07-12 | 2024-01-18 | Semiconductor Components Industries, Llc | Semiconductor device package |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09312367A (ja) * | 1996-05-23 | 1997-12-02 | Mitsubishi Electric Corp | 高周波半導体装置 |
| JP5232848B2 (ja) * | 2010-11-15 | 2013-07-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6653199B2 (ja) | 2016-03-23 | 2020-02-26 | ローム株式会社 | 半導体装置 |
| DE102017202770B4 (de) * | 2016-08-31 | 2023-06-07 | Infineon Technologies Austria Ag | Halbleiterchipgehäuse mit einem sich wiederholenden Grundflächenmuster |
| JP7150461B2 (ja) * | 2018-04-24 | 2022-10-11 | ローム株式会社 | 半導体装置 |
| WO2020059751A1 (ja) * | 2018-09-19 | 2020-03-26 | ローム株式会社 | 半導体装置 |
| JP2020107637A (ja) * | 2018-12-26 | 2020-07-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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2022
- 2022-11-16 JP JP2023564862A patent/JPWO2023100659A1/ja active Pending
- 2022-11-16 WO PCT/JP2022/042573 patent/WO2023100659A1/ja not_active Ceased
- 2022-11-16 CN CN202280077729.1A patent/CN118382925A/zh active Pending
- 2022-11-16 DE DE112022005176.0T patent/DE112022005176T5/de active Pending
-
2024
- 2024-04-09 US US18/630,588 patent/US20240258219A1/en active Pending