CN118382925A - 半导体装置 - Google Patents

半导体装置 Download PDF

Info

Publication number
CN118382925A
CN118382925A CN202280077729.1A CN202280077729A CN118382925A CN 118382925 A CN118382925 A CN 118382925A CN 202280077729 A CN202280077729 A CN 202280077729A CN 118382925 A CN118382925 A CN 118382925A
Authority
CN
China
Prior art keywords
lead
semiconductor device
thickness direction
resin
resin surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280077729.1A
Other languages
English (en)
Chinese (zh)
Inventor
柿崎僚太郎
糟谷泰正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN118382925A publication Critical patent/CN118382925A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN202280077729.1A 2021-12-01 2022-11-16 半导体装置 Pending CN118382925A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-195177 2021-12-01
JP2021195177 2021-12-01
PCT/JP2022/042573 WO2023100659A1 (ja) 2021-12-01 2022-11-16 半導体装置

Publications (1)

Publication Number Publication Date
CN118382925A true CN118382925A (zh) 2024-07-23

Family

ID=86612047

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280077729.1A Pending CN118382925A (zh) 2021-12-01 2022-11-16 半导体装置

Country Status (5)

Country Link
US (1) US20240258219A1 (https=)
JP (1) JPWO2023100659A1 (https=)
CN (1) CN118382925A (https=)
DE (1) DE112022005176T5 (https=)
WO (1) WO2023100659A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12417954B2 (en) * 2020-04-27 2025-09-16 Rohm Co., Ltd. Semiconductor device
US20240021487A1 (en) * 2022-07-12 2024-01-18 Semiconductor Components Industries, Llc Semiconductor device package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312367A (ja) * 1996-05-23 1997-12-02 Mitsubishi Electric Corp 高周波半導体装置
JP5232848B2 (ja) * 2010-11-15 2013-07-10 ルネサスエレクトロニクス株式会社 半導体装置
JP6653199B2 (ja) 2016-03-23 2020-02-26 ローム株式会社 半導体装置
DE102017202770B4 (de) * 2016-08-31 2023-06-07 Infineon Technologies Austria Ag Halbleiterchipgehäuse mit einem sich wiederholenden Grundflächenmuster
JP7150461B2 (ja) * 2018-04-24 2022-10-11 ローム株式会社 半導体装置
WO2020059751A1 (ja) * 2018-09-19 2020-03-26 ローム株式会社 半導体装置
JP2020107637A (ja) * 2018-12-26 2020-07-09 ルネサスエレクトロニクス株式会社 半導体装置

Also Published As

Publication number Publication date
DE112022005176T5 (de) 2024-08-08
US20240258219A1 (en) 2024-08-01
WO2023100659A1 (ja) 2023-06-08
JPWO2023100659A1 (https=) 2023-06-08

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