JPWO2023100659A1 - - Google Patents
Info
- Publication number
- JPWO2023100659A1 JPWO2023100659A1 JP2023564862A JP2023564862A JPWO2023100659A1 JP WO2023100659 A1 JPWO2023100659 A1 JP WO2023100659A1 JP 2023564862 A JP2023564862 A JP 2023564862A JP 2023564862 A JP2023564862 A JP 2023564862A JP WO2023100659 A1 JPWO2023100659 A1 JP WO2023100659A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021195177 | 2021-12-01 | ||
| PCT/JP2022/042573 WO2023100659A1 (ja) | 2021-12-01 | 2022-11-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100659A1 true JPWO2023100659A1 (https=) | 2023-06-08 |
| JPWO2023100659A5 JPWO2023100659A5 (https=) | 2024-08-15 |
Family
ID=86612047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564862A Pending JPWO2023100659A1 (https=) | 2021-12-01 | 2022-11-16 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240258219A1 (https=) |
| JP (1) | JPWO2023100659A1 (https=) |
| CN (1) | CN118382925A (https=) |
| DE (1) | DE112022005176T5 (https=) |
| WO (1) | WO2023100659A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12417954B2 (en) * | 2020-04-27 | 2025-09-16 | Rohm Co., Ltd. | Semiconductor device |
| US20240021487A1 (en) * | 2022-07-12 | 2024-01-18 | Semiconductor Components Industries, Llc | Semiconductor device package |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09312367A (ja) * | 1996-05-23 | 1997-12-02 | Mitsubishi Electric Corp | 高周波半導体装置 |
| JP5232848B2 (ja) * | 2010-11-15 | 2013-07-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6653199B2 (ja) | 2016-03-23 | 2020-02-26 | ローム株式会社 | 半導体装置 |
| DE102017202770B4 (de) * | 2016-08-31 | 2023-06-07 | Infineon Technologies Austria Ag | Halbleiterchipgehäuse mit einem sich wiederholenden Grundflächenmuster |
| JP7150461B2 (ja) * | 2018-04-24 | 2022-10-11 | ローム株式会社 | 半導体装置 |
| WO2020059751A1 (ja) * | 2018-09-19 | 2020-03-26 | ローム株式会社 | 半導体装置 |
| JP2020107637A (ja) * | 2018-12-26 | 2020-07-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2022
- 2022-11-16 JP JP2023564862A patent/JPWO2023100659A1/ja active Pending
- 2022-11-16 WO PCT/JP2022/042573 patent/WO2023100659A1/ja not_active Ceased
- 2022-11-16 CN CN202280077729.1A patent/CN118382925A/zh active Pending
- 2022-11-16 DE DE112022005176.0T patent/DE112022005176T5/de active Pending
-
2024
- 2024-04-09 US US18/630,588 patent/US20240258219A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN118382925A (zh) | 2024-07-23 |
| DE112022005176T5 (de) | 2024-08-08 |
| US20240258219A1 (en) | 2024-08-01 |
| WO2023100659A1 (ja) | 2023-06-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240329 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251107 |