JPWO2023100663A5 - - Google Patents
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- Publication number
- JPWO2023100663A5 JPWO2023100663A5 JP2023564865A JP2023564865A JPWO2023100663A5 JP WO2023100663 A5 JPWO2023100663 A5 JP WO2023100663A5 JP 2023564865 A JP2023564865 A JP 2023564865A JP 2023564865 A JP2023564865 A JP 2023564865A JP WO2023100663 A5 JPWO2023100663 A5 JP WO2023100663A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin surface
- thickness direction
- resin
- recessed region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021195176 | 2021-12-01 | ||
| PCT/JP2022/042650 WO2023100663A1 (ja) | 2021-12-01 | 2022-11-17 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100663A1 JPWO2023100663A1 (https=) | 2023-06-08 |
| JPWO2023100663A5 true JPWO2023100663A5 (https=) | 2024-08-15 |
Family
ID=86612147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564865A Pending JPWO2023100663A1 (https=) | 2021-12-01 | 2022-11-17 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240258186A1 (https=) |
| JP (1) | JPWO2023100663A1 (https=) |
| CN (1) | CN118318300A (https=) |
| DE (1) | DE112022005210T5 (https=) |
| WO (1) | WO2023100663A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20260068693A1 (en) * | 2024-08-27 | 2026-03-05 | Wolfspeed, Inc. | Power semiconductor device package |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01174956U (https=) * | 1988-05-30 | 1989-12-13 | ||
| JPH0312954A (ja) * | 1989-06-12 | 1991-01-21 | Nec Corp | 樹脂封止型半導体装置 |
| JP5362658B2 (ja) * | 1999-10-28 | 2013-12-11 | ローム株式会社 | 半導体装置 |
| JP7337733B2 (ja) * | 2020-03-05 | 2023-09-04 | 株式会社東芝 | 半導体パッケージ |
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2022
- 2022-11-17 CN CN202280078681.6A patent/CN118318300A/zh active Pending
- 2022-11-17 JP JP2023564865A patent/JPWO2023100663A1/ja active Pending
- 2022-11-17 WO PCT/JP2022/042650 patent/WO2023100663A1/ja not_active Ceased
- 2022-11-17 DE DE112022005210.4T patent/DE112022005210T5/de active Pending
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2024
- 2024-04-09 US US18/630,486 patent/US20240258186A1/en active Pending