JPWO2023090059A5 - - Google Patents

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Publication number
JPWO2023090059A5
JPWO2023090059A5 JP2023561481A JP2023561481A JPWO2023090059A5 JP WO2023090059 A5 JPWO2023090059 A5 JP WO2023090059A5 JP 2023561481 A JP2023561481 A JP 2023561481A JP 2023561481 A JP2023561481 A JP 2023561481A JP WO2023090059 A5 JPWO2023090059 A5 JP WO2023090059A5
Authority
JP
Japan
Prior art keywords
lead
recess
semiconductor device
semiconductor element
dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023561481A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023090059A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/039455 external-priority patent/WO2023090059A1/ja
Publication of JPWO2023090059A1 publication Critical patent/JPWO2023090059A1/ja
Publication of JPWO2023090059A5 publication Critical patent/JPWO2023090059A5/ja
Pending legal-status Critical Current

Links

JP2023561481A 2021-11-18 2022-10-24 Pending JPWO2023090059A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021187872 2021-11-18
PCT/JP2022/039455 WO2023090059A1 (ja) 2021-11-18 2022-10-24 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023090059A1 JPWO2023090059A1 (https=) 2023-05-25
JPWO2023090059A5 true JPWO2023090059A5 (https=) 2024-08-02

Family

ID=86396664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023561481A Pending JPWO2023090059A1 (https=) 2021-11-18 2022-10-24

Country Status (5)

Country Link
US (1) US20240243100A1 (https=)
JP (1) JPWO2023090059A1 (https=)
CN (1) CN118302851A (https=)
DE (1) DE112022004993T5 (https=)
WO (1) WO2023090059A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112275U (https=) * 1977-02-10 1978-09-07
JP2007073743A (ja) * 2005-09-07 2007-03-22 Denso Corp 半導体装置
JP5510746B2 (ja) 2010-10-26 2014-06-04 株式会社デンソー 電子装置
JP6541223B2 (ja) * 2015-01-16 2019-07-10 新日本無線株式会社 半導体装置

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