JPWO2023140042A5 - - Google Patents
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- Publication number
- JPWO2023140042A5 JPWO2023140042A5 JP2023575156A JP2023575156A JPWO2023140042A5 JP WO2023140042 A5 JPWO2023140042 A5 JP WO2023140042A5 JP 2023575156 A JP2023575156 A JP 2023575156A JP 2023575156 A JP2023575156 A JP 2023575156A JP WO2023140042 A5 JPWO2023140042 A5 JP WO2023140042A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- semiconductor device
- disposed
- die pad
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022007105 | 2022-01-20 | ||
| PCT/JP2022/047430 WO2023140042A1 (ja) | 2022-01-20 | 2022-12-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023140042A1 JPWO2023140042A1 (https=) | 2023-07-27 |
| JPWO2023140042A5 true JPWO2023140042A5 (https=) | 2024-10-01 |
Family
ID=87348606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023575156A Pending JPWO2023140042A1 (https=) | 2022-01-20 | 2022-12-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240379574A1 (https=) |
| JP (1) | JPWO2023140042A1 (https=) |
| CN (1) | CN118633155A (https=) |
| DE (1) | DE112022006100T5 (https=) |
| WO (1) | WO2023140042A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12417954B2 (en) * | 2020-04-27 | 2025-09-16 | Rohm Co., Ltd. | Semiconductor device |
| JPWO2025115059A1 (https=) * | 2023-11-27 | 2025-06-05 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5554569A (en) * | 1994-06-06 | 1996-09-10 | Motorola, Inc. | Method and apparatus for improving interfacial adhesion between a polymer and a metal |
| JPH0992778A (ja) * | 1995-09-27 | 1997-04-04 | Mitsui High Tec Inc | 半導体装置 |
| US7049683B1 (en) * | 2003-07-19 | 2006-05-23 | Ns Electronics Bangkok (1993) Ltd. | Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound |
| JP2005159137A (ja) * | 2003-11-27 | 2005-06-16 | Sharp Corp | 光半導体素子およびこの光半導体素子を用いた電子機器 |
| JP4472773B1 (ja) * | 2009-01-06 | 2010-06-02 | 日電精密工業株式会社 | リードフレームの製造方法及びリードフレーム、ヒートシンクの製造方法及びヒートシンク |
| JP7001826B2 (ja) * | 2018-07-12 | 2022-01-20 | ローム株式会社 | 半導体装置 |
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2022
- 2022-12-22 JP JP2023575156A patent/JPWO2023140042A1/ja active Pending
- 2022-12-22 DE DE112022006100.6T patent/DE112022006100T5/de active Pending
- 2022-12-22 CN CN202280089355.5A patent/CN118633155A/zh active Pending
- 2022-12-22 WO PCT/JP2022/047430 patent/WO2023140042A1/ja not_active Ceased
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2024
- 2024-07-18 US US18/777,194 patent/US20240379574A1/en active Pending