JPWO2023153188A5 - - Google Patents
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- Publication number
- JPWO2023153188A5 JPWO2023153188A5 JP2023580152A JP2023580152A JPWO2023153188A5 JP WO2023153188 A5 JPWO2023153188 A5 JP WO2023153188A5 JP 2023580152 A JP2023580152 A JP 2023580152A JP 2023580152 A JP2023580152 A JP 2023580152A JP WO2023153188 A5 JPWO2023153188 A5 JP WO2023153188A5
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- semiconductor device
- semiconductor element
- die pad
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 31
- 239000011347 resin Substances 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 238000007789 sealing Methods 0.000 claims 8
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022017651 | 2022-02-08 | ||
| PCT/JP2023/001892 WO2023153188A1 (ja) | 2022-02-08 | 2023-01-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023153188A1 JPWO2023153188A1 (https=) | 2023-08-17 |
| JPWO2023153188A5 true JPWO2023153188A5 (https=) | 2024-10-18 |
Family
ID=87564114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023580152A Pending JPWO2023153188A1 (https=) | 2022-02-08 | 2023-01-23 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240395681A1 (https=) |
| JP (1) | JPWO2023153188A1 (https=) |
| CN (1) | CN118648104A (https=) |
| DE (1) | DE112023000869T5 (https=) |
| WO (1) | WO2023153188A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5510746B2 (ja) | 2010-10-26 | 2014-06-04 | 株式会社デンソー | 電子装置 |
| US9082759B2 (en) * | 2012-11-27 | 2015-07-14 | Infineon Technologies Ag | Semiconductor packages and methods of formation thereof |
| JP6541223B2 (ja) * | 2015-01-16 | 2019-07-10 | 新日本無線株式会社 | 半導体装置 |
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2023
- 2023-01-23 JP JP2023580152A patent/JPWO2023153188A1/ja active Pending
- 2023-01-23 WO PCT/JP2023/001892 patent/WO2023153188A1/ja not_active Ceased
- 2023-01-23 DE DE112023000869.8T patent/DE112023000869T5/de active Pending
- 2023-01-23 CN CN202380020374.7A patent/CN118648104A/zh active Pending
-
2024
- 2024-07-30 US US18/789,087 patent/US20240395681A1/en active Pending