JPWO2023100681A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023100681A5 JPWO2023100681A5 JP2023564880A JP2023564880A JPWO2023100681A5 JP WO2023100681 A5 JPWO2023100681 A5 JP WO2023100681A5 JP 2023564880 A JP2023564880 A JP 2023564880A JP 2023564880 A JP2023564880 A JP 2023564880A JP WO2023100681 A5 JPWO2023100681 A5 JP WO2023100681A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- thickness direction
- lead
- resin
- resin surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 21
- 239000011347 resin Substances 0.000 claims 18
- 229920005989 resin Polymers 0.000 claims 18
- 238000007789 sealing Methods 0.000 claims 5
- 230000000149 penetrating effect Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021195178 | 2021-12-01 | ||
| PCT/JP2022/042795 WO2023100681A1 (ja) | 2021-12-01 | 2022-11-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100681A1 JPWO2023100681A1 (https=) | 2023-06-08 |
| JPWO2023100681A5 true JPWO2023100681A5 (https=) | 2024-08-15 |
Family
ID=86612165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564880A Pending JPWO2023100681A1 (https=) | 2021-12-01 | 2022-11-18 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240282676A1 (https=) |
| JP (1) | JPWO2023100681A1 (https=) |
| CN (1) | CN118318301A (https=) |
| DE (1) | DE112022005222T5 (https=) |
| WO (1) | WO2023100681A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4055700B2 (ja) * | 2003-11-19 | 2008-03-05 | 株式会社デンソー | 半導体装置 |
| JP2007073743A (ja) * | 2005-09-07 | 2007-03-22 | Denso Corp | 半導体装置 |
| JP2016072376A (ja) * | 2014-09-29 | 2016-05-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6817777B2 (ja) * | 2015-12-16 | 2021-01-20 | ローム株式会社 | 半導体装置 |
| JP6653199B2 (ja) | 2016-03-23 | 2020-02-26 | ローム株式会社 | 半導体装置 |
| US10840164B2 (en) * | 2018-05-18 | 2020-11-17 | Infineon Technologies Ag | Wire bonded package with single piece exposed heat slug and leads |
| WO2020255663A1 (ja) * | 2019-06-20 | 2020-12-24 | ローム株式会社 | 半導体装置及び半導体装置の製造方法 |
-
2022
- 2022-11-18 WO PCT/JP2022/042795 patent/WO2023100681A1/ja not_active Ceased
- 2022-11-18 DE DE112022005222.8T patent/DE112022005222T5/de active Pending
- 2022-11-18 JP JP2023564880A patent/JPWO2023100681A1/ja active Pending
- 2022-11-18 CN CN202280079006.5A patent/CN118318301A/zh active Pending
-
2024
- 2024-04-29 US US18/649,331 patent/US20240282676A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7546034B2 (ja) | 半導体装置 | |
| US9343394B2 (en) | Semiconductor device | |
| JP2022168128A5 (https=) | ||
| KR101647863B1 (ko) | 반도체 장치 | |
| JPWO2023100659A5 (https=) | ||
| JPWO2023021938A5 (https=) | ||
| JPWO2023100681A5 (https=) | ||
| JPWO2023189650A5 (https=) | ||
| JPWO2023100759A5 (https=) | ||
| JPWO2023100663A5 (https=) | ||
| JPWO2023100731A5 (https=) | ||
| JPWO2024166846A5 (https=) | ||
| JPWO2023112735A5 (https=) | ||
| JPWO2023153188A5 (https=) | ||
| JPWO2024181293A5 (https=) | ||
| JPWO2024057838A5 (https=) | ||
| US9293399B2 (en) | Semiconductor device and electronic unit provided with the same | |
| JPWO2022259809A5 (https=) | ||
| JPWO2023181957A5 (https=) | ||
| JPWO2022239696A5 (https=) | ||
| JPWO2024176851A5 (https=) | ||
| JPS629735Y2 (https=) | ||
| JPWO2023149257A5 (https=) | ||
| WO2023100759A1 (ja) | 半導体装置 | |
| JPWO2023063025A5 (https=) |