JPWO2023149257A5 - - Google Patents

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Publication number
JPWO2023149257A5
JPWO2023149257A5 JP2023578482A JP2023578482A JPWO2023149257A5 JP WO2023149257 A5 JPWO2023149257 A5 JP WO2023149257A5 JP 2023578482 A JP2023578482 A JP 2023578482A JP 2023578482 A JP2023578482 A JP 2023578482A JP WO2023149257 A5 JPWO2023149257 A5 JP WO2023149257A5
Authority
JP
Japan
Prior art keywords
conductive member
semiconductor device
main surface
thickness direction
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023578482A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023149257A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/001891 external-priority patent/WO2023149257A1/ja
Publication of JPWO2023149257A1 publication Critical patent/JPWO2023149257A1/ja
Publication of JPWO2023149257A5 publication Critical patent/JPWO2023149257A5/ja
Pending legal-status Critical Current

Links

JP2023578482A 2022-02-04 2023-01-23 Pending JPWO2023149257A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022016239 2022-02-04
PCT/JP2023/001891 WO2023149257A1 (ja) 2022-02-04 2023-01-23 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023149257A1 JPWO2023149257A1 (https=) 2023-08-10
JPWO2023149257A5 true JPWO2023149257A5 (https=) 2024-10-15

Family

ID=87552137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023578482A Pending JPWO2023149257A1 (https=) 2022-02-04 2023-01-23

Country Status (5)

Country Link
US (1) US20240379510A1 (https=)
JP (1) JPWO2023149257A1 (https=)
CN (1) CN118633159A (https=)
DE (1) DE112023000813T5 (https=)
WO (1) WO2023149257A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024204916A1 (de) * 2024-05-28 2025-12-04 Robert Bosch Gesellschaft mit beschränkter Haftung Einzelschalter Leistungsmodul

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10212838B2 (en) * 2017-01-13 2019-02-19 Cree Fayetteville, Inc. High power multilayer module having low inductance and fast switching for paralleling power devices
DE212018000087U1 (de) 2017-11-20 2019-05-10 Rohm Co., Ltd. Halbleitervorrichtung
WO2021176996A1 (ja) * 2020-03-04 2021-09-10 ローム株式会社 半導体装置および半導体装置の製造方法

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