JPWO2023140046A5 - - Google Patents
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- Publication number
- JPWO2023140046A5 JPWO2023140046A5 JP2023575158A JP2023575158A JPWO2023140046A5 JP WO2023140046 A5 JPWO2023140046 A5 JP WO2023140046A5 JP 2023575158 A JP2023575158 A JP 2023575158A JP 2023575158 A JP2023575158 A JP 2023575158A JP WO2023140046 A5 JPWO2023140046 A5 JP WO2023140046A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- facing
- sealing resin
- thickness direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 31
- 229920005989 resin Polymers 0.000 claims 31
- 239000004065 semiconductor Substances 0.000 claims 18
- 238000007789 sealing Methods 0.000 claims 15
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022007110 | 2022-01-20 | ||
| PCT/JP2022/047567 WO2023140046A1 (ja) | 2022-01-20 | 2022-12-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023140046A1 JPWO2023140046A1 (https=) | 2023-07-27 |
| JPWO2023140046A5 true JPWO2023140046A5 (https=) | 2024-10-01 |
Family
ID=87348609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023575158A Pending JPWO2023140046A1 (https=) | 2022-01-20 | 2022-12-23 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240379507A1 (https=) |
| JP (1) | JPWO2023140046A1 (https=) |
| CN (1) | CN118556287A (https=) |
| DE (1) | DE112022006058T5 (https=) |
| WO (1) | WO2023140046A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347710A (ja) * | 2004-06-07 | 2005-12-15 | Sony Corp | 表面実装型電子部品、プリント配線板及び実装基板 |
| JP2010087395A (ja) * | 2008-10-02 | 2010-04-15 | Panasonic Corp | 半導体装置 |
| JP2017079215A (ja) * | 2014-02-27 | 2017-04-27 | パナソニックＩｐマネジメント株式会社 | 樹脂封止型半導体装置、およびその製造方法、ならびにその実装体 |
| JP2016197636A (ja) * | 2015-04-02 | 2016-11-24 | 株式会社デンソー | モールドパッケージ |
| JP2021158317A (ja) * | 2020-03-30 | 2021-10-07 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-12-23 WO PCT/JP2022/047567 patent/WO2023140046A1/ja not_active Ceased
- 2022-12-23 DE DE112022006058.1T patent/DE112022006058T5/de active Pending
- 2022-12-23 JP JP2023575158A patent/JPWO2023140046A1/ja active Pending
- 2022-12-23 CN CN202280089019.0A patent/CN118556287A/zh active Pending
-
2024
- 2024-07-18 US US18/777,108 patent/US20240379507A1/en active Pending
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