JPWO2023136056A5 - - Google Patents

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Publication number
JPWO2023136056A5
JPWO2023136056A5 JP2023573935A JP2023573935A JPWO2023136056A5 JP WO2023136056 A5 JPWO2023136056 A5 JP WO2023136056A5 JP 2023573935 A JP2023573935 A JP 2023573935A JP 2023573935 A JP2023573935 A JP 2023573935A JP WO2023136056 A5 JPWO2023136056 A5 JP WO2023136056A5
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
terminal
discharge
die pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023573935A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023136056A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/046905 external-priority patent/WO2023136056A1/ja
Publication of JPWO2023136056A1 publication Critical patent/JPWO2023136056A1/ja
Publication of JPWO2023136056A5 publication Critical patent/JPWO2023136056A5/ja
Pending legal-status Critical Current

Links

JP2023573935A 2022-01-11 2022-12-20 Pending JPWO2023136056A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022002413 2022-01-11
PCT/JP2022/046905 WO2023136056A1 (ja) 2022-01-11 2022-12-20 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023136056A1 JPWO2023136056A1 (https=) 2023-07-20
JPWO2023136056A5 true JPWO2023136056A5 (https=) 2024-09-20

Family

ID=87278907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023573935A Pending JPWO2023136056A1 (https=) 2022-01-11 2022-12-20

Country Status (5)

Country Link
US (1) US20240363606A1 (https=)
JP (1) JPWO2023136056A1 (https=)
CN (1) CN118525372A (https=)
DE (1) DE112022005922T5 (https=)
WO (1) WO2023136056A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2798593B2 (ja) * 1993-12-01 1998-09-17 山形日本電気株式会社 半導体装置
JP2002198466A (ja) * 2000-12-26 2002-07-12 Nec Microsystems Ltd 半導体装置
JP4244318B2 (ja) * 2003-12-03 2009-03-25 株式会社ルネサステクノロジ 半導体装置
JP6522402B2 (ja) 2015-04-16 2019-05-29 ローム株式会社 半導体装置
JP6718540B2 (ja) * 2019-04-24 2020-07-08 ローム株式会社 半導体装置

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