JPWO2024209899A5 - - Google Patents

Info

Publication number
JPWO2024209899A5
JPWO2024209899A5 JP2025512465A JP2025512465A JPWO2024209899A5 JP WO2024209899 A5 JPWO2024209899 A5 JP WO2024209899A5 JP 2025512465 A JP2025512465 A JP 2025512465A JP 2025512465 A JP2025512465 A JP 2025512465A JP WO2024209899 A5 JPWO2024209899 A5 JP WO2024209899A5
Authority
JP
Japan
Prior art keywords
lead
conductive member
semiconductor device
electrode
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025512465A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024209899A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/009763 external-priority patent/WO2024209899A1/ja
Publication of JPWO2024209899A1 publication Critical patent/JPWO2024209899A1/ja
Publication of JPWO2024209899A5 publication Critical patent/JPWO2024209899A5/ja
Pending legal-status Critical Current

Links

JP2025512465A 2023-04-05 2024-03-13 Pending JPWO2024209899A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023061579 2023-04-05
PCT/JP2024/009763 WO2024209899A1 (ja) 2023-04-05 2024-03-13 半導体装置および車両

Publications (2)

Publication Number Publication Date
JPWO2024209899A1 JPWO2024209899A1 (https=) 2024-10-10
JPWO2024209899A5 true JPWO2024209899A5 (https=) 2026-01-14

Family

ID=92972030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025512465A Pending JPWO2024209899A1 (https=) 2023-04-05 2024-03-13

Country Status (2)

Country Link
JP (1) JPWO2024209899A1 (https=)
WO (1) WO2024209899A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017050441A (ja) * 2015-09-03 2017-03-09 ローム株式会社 半導体装置
JP2020136331A (ja) * 2019-02-14 2020-08-31 株式会社日産アーク 半導体装置及びその製造方法
DE112021002615T5 (de) * 2020-08-05 2023-03-23 Rohm Co., Ltd. Halbleiterbauteil

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