JPWO2024190426A5 - - Google Patents

Info

Publication number
JPWO2024190426A5
JPWO2024190426A5 JP2025506691A JP2025506691A JPWO2024190426A5 JP WO2024190426 A5 JPWO2024190426 A5 JP WO2024190426A5 JP 2025506691 A JP2025506691 A JP 2025506691A JP 2025506691 A JP2025506691 A JP 2025506691A JP WO2024190426 A5 JPWO2024190426 A5 JP WO2024190426A5
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
electrode
thickness direction
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025506691A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024190426A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/007410 external-priority patent/WO2024190426A1/ja
Publication of JPWO2024190426A1 publication Critical patent/JPWO2024190426A1/ja
Publication of JPWO2024190426A5 publication Critical patent/JPWO2024190426A5/ja
Pending legal-status Critical Current

Links

JP2025506691A 2023-03-15 2024-02-28 Pending JPWO2024190426A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023040790 2023-03-15
PCT/JP2024/007410 WO2024190426A1 (ja) 2023-03-15 2024-02-28 半導体装置および車両

Publications (2)

Publication Number Publication Date
JPWO2024190426A1 JPWO2024190426A1 (https=) 2024-09-19
JPWO2024190426A5 true JPWO2024190426A5 (https=) 2025-12-04

Family

ID=92754945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025506691A Pending JPWO2024190426A1 (https=) 2023-03-15 2024-02-28

Country Status (2)

Country Link
JP (1) JPWO2024190426A1 (https=)
WO (1) WO2024190426A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005051038A (ja) * 2003-07-29 2005-02-24 Nec Kansai Ltd 半導体装置及びその製造方法
JP2008294384A (ja) * 2007-04-27 2008-12-04 Renesas Technology Corp 半導体装置
JP6338937B2 (ja) * 2014-06-13 2018-06-06 ローム株式会社 パワーモジュールおよびその製造方法
US11482479B2 (en) * 2017-04-24 2022-10-25 Rohm Co., Ltd. Semiconductor device
JP2019075522A (ja) * 2017-10-19 2019-05-16 株式会社デンソー 半導体モジュール
DE212020000562U1 (de) * 2019-07-12 2021-11-16 Rohm Co., Ltd. Halbleiterbauteil
US12412814B2 (en) * 2020-12-15 2025-09-09 Rohm Co., Ltd. Semiconductor apparatus

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