JPWO2024247579A5 - - Google Patents

Info

Publication number
JPWO2024247579A5
JPWO2024247579A5 JP2025523363A JP2025523363A JPWO2024247579A5 JP WO2024247579 A5 JPWO2024247579 A5 JP WO2024247579A5 JP 2025523363 A JP2025523363 A JP 2025523363A JP 2025523363 A JP2025523363 A JP 2025523363A JP WO2024247579 A5 JPWO2024247579 A5 JP WO2024247579A5
Authority
JP
Japan
Prior art keywords
electrode
semiconductor device
lead
conductive member
bonding layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025523363A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024247579A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/016404 external-priority patent/WO2024247579A1/ja
Publication of JPWO2024247579A1 publication Critical patent/JPWO2024247579A1/ja
Publication of JPWO2024247579A5 publication Critical patent/JPWO2024247579A5/ja
Pending legal-status Critical Current

Links

JP2025523363A 2023-05-26 2024-04-26 Pending JPWO2024247579A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023087106 2023-05-26
PCT/JP2024/016404 WO2024247579A1 (ja) 2023-05-26 2024-04-26 半導体装置および車両

Publications (2)

Publication Number Publication Date
JPWO2024247579A1 JPWO2024247579A1 (https=) 2024-12-05
JPWO2024247579A5 true JPWO2024247579A5 (https=) 2026-02-25

Family

ID=93657815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025523363A Pending JPWO2024247579A1 (https=) 2023-05-26 2024-04-26

Country Status (5)

Country Link
US (1) US20260082945A1 (https=)
JP (1) JPWO2024247579A1 (https=)
CN (1) CN121241424A (https=)
DE (1) DE112024001988T5 (https=)
WO (1) WO2024247579A1 (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112021002694T5 (de) * 2020-07-13 2023-03-16 Rohm Co., Ltd. Halbleiterbauteil und verfahren zur herstellung des halbleiterbauteils
JPWO2023021938A1 (https=) * 2021-08-18 2023-02-23

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