JPWO2023021938A1 - - Google Patents
Info
- Publication number
- JPWO2023021938A1 JPWO2023021938A1 JP2023542289A JP2023542289A JPWO2023021938A1 JP WO2023021938 A1 JPWO2023021938 A1 JP WO2023021938A1 JP 2023542289 A JP2023542289 A JP 2023542289A JP 2023542289 A JP2023542289 A JP 2023542289A JP WO2023021938 A1 JPWO2023021938 A1 JP WO2023021938A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
- H10W70/427—Bent parts
- H10W70/429—Bent parts being the outer leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021133495 | 2021-08-18 | ||
| PCT/JP2022/028605 WO2023021938A1 (ja) | 2021-08-18 | 2022-07-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023021938A1 true JPWO2023021938A1 (https=) | 2023-02-23 |
| JPWO2023021938A5 JPWO2023021938A5 (https=) | 2024-05-16 |
Family
ID=85240505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023542289A Pending JPWO2023021938A1 (https=) | 2021-08-18 | 2022-07-25 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240203808A1 (https=) |
| JP (1) | JPWO2023021938A1 (https=) |
| CN (1) | CN117795668A (https=) |
| DE (1) | DE112022003555T5 (https=) |
| WO (1) | WO2023021938A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024219218A1 (ja) * | 2023-04-18 | 2024-10-24 | ローム株式会社 | 半導体装置および車両 |
| WO2024247579A1 (ja) * | 2023-05-26 | 2024-12-05 | ローム株式会社 | 半導体装置および車両 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5435168U (https=) * | 1977-08-12 | 1979-03-07 | ||
| JPS59117160U (ja) * | 1983-01-28 | 1984-08-07 | サンケン電気株式会社 | 絶縁物封止半導体装置 |
| JPH01135032A (ja) * | 1987-11-20 | 1989-05-26 | Hitachi Ltd | 樹脂封止半導体装置の製造方法 |
| JPH04162654A (ja) * | 1990-10-26 | 1992-06-08 | Hitachi Ltd | 樹脂封止半導体装置 |
| US10263612B2 (en) * | 2013-11-20 | 2019-04-16 | Rohm Co., Ltd. | Switching device and electronic circuit |
-
2022
- 2022-07-25 WO PCT/JP2022/028605 patent/WO2023021938A1/ja not_active Ceased
- 2022-07-25 DE DE112022003555.2T patent/DE112022003555T5/de active Pending
- 2022-07-25 JP JP2023542289A patent/JPWO2023021938A1/ja active Pending
- 2022-07-25 CN CN202280054877.1A patent/CN117795668A/zh active Pending
-
2024
- 2024-01-23 US US18/420,385 patent/US20240203808A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN117795668A (zh) | 2024-03-29 |
| WO2023021938A1 (ja) | 2023-02-23 |
| US20240203808A1 (en) | 2024-06-20 |
| DE112022003555T5 (de) | 2024-05-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231215 |