DE112022003555T5 - Halbleiterbauteil - Google Patents

Halbleiterbauteil Download PDF

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Publication number
DE112022003555T5
DE112022003555T5 DE112022003555.2T DE112022003555T DE112022003555T5 DE 112022003555 T5 DE112022003555 T5 DE 112022003555T5 DE 112022003555 T DE112022003555 T DE 112022003555T DE 112022003555 T5 DE112022003555 T5 DE 112022003555T5
Authority
DE
Germany
Prior art keywords
terminal
resin
semiconductor device
face
mounting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022003555.2T
Other languages
German (de)
English (en)
Inventor
Koichi Kitaguro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112022003555T5 publication Critical patent/DE112022003555T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE112022003555.2T 2021-08-18 2022-07-25 Halbleiterbauteil Pending DE112022003555T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-133495 2021-08-18
JP2021133495 2021-08-18
PCT/JP2022/028605 WO2023021938A1 (ja) 2021-08-18 2022-07-25 半導体装置

Publications (1)

Publication Number Publication Date
DE112022003555T5 true DE112022003555T5 (de) 2024-05-16

Family

ID=85240505

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022003555.2T Pending DE112022003555T5 (de) 2021-08-18 2022-07-25 Halbleiterbauteil

Country Status (5)

Country Link
US (1) US20240203808A1 (https=)
JP (1) JPWO2023021938A1 (https=)
CN (1) CN117795668A (https=)
DE (1) DE112022003555T5 (https=)
WO (1) WO2023021938A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024219218A1 (ja) * 2023-04-18 2024-10-24 ローム株式会社 半導体装置および車両
JPWO2024247579A1 (https=) * 2023-05-26 2024-12-05

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435168U (https=) * 1977-08-12 1979-03-07
JPS59117160U (ja) * 1983-01-28 1984-08-07 サンケン電気株式会社 絶縁物封止半導体装置
JPH01135032A (ja) * 1987-11-20 1989-05-26 Hitachi Ltd 樹脂封止半導体装置の製造方法
JPH04162654A (ja) * 1990-10-26 1992-06-08 Hitachi Ltd 樹脂封止半導体装置
EP4579736A3 (en) * 2013-11-20 2025-12-31 Rohm Co., Ltd. SWITCHING DEVICE AND ELECTRONIC CIRCUIT

Also Published As

Publication number Publication date
CN117795668A (zh) 2024-03-29
JPWO2023021938A1 (https=) 2023-02-23
WO2023021938A1 (ja) 2023-02-23
US20240203808A1 (en) 2024-06-20

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023310000

Ipc: H10W0074100000