JPWO2024018810A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2024018810A5
JPWO2024018810A5 JP2024534981A JP2024534981A JPWO2024018810A5 JP WO2024018810 A5 JPWO2024018810 A5 JP WO2024018810A5 JP 2024534981 A JP2024534981 A JP 2024534981A JP 2024534981 A JP2024534981 A JP 2024534981A JP WO2024018810 A5 JPWO2024018810 A5 JP WO2024018810A5
Authority
JP
Japan
Prior art keywords
wiring portion
semiconductor device
electrode
electrically connected
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024534981A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024018810A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/023001 external-priority patent/WO2024018810A1/ja
Publication of JPWO2024018810A1 publication Critical patent/JPWO2024018810A1/ja
Publication of JPWO2024018810A5 publication Critical patent/JPWO2024018810A5/ja
Pending legal-status Critical Current

Links

JP2024534981A 2022-07-21 2023-06-21 Pending JPWO2024018810A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022116093 2022-07-21
PCT/JP2023/023001 WO2024018810A1 (ja) 2022-07-21 2023-06-21 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024018810A1 JPWO2024018810A1 (https=) 2024-01-25
JPWO2024018810A5 true JPWO2024018810A5 (https=) 2025-03-31

Family

ID=89617593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024534981A Pending JPWO2024018810A1 (https=) 2022-07-21 2023-06-21

Country Status (2)

Country Link
JP (1) JPWO2024018810A1 (https=)
WO (1) WO2024018810A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12417954B2 (en) * 2020-04-27 2025-09-16 Rohm Co., Ltd. Semiconductor device
WO2026023121A1 (ja) * 2024-07-22 2026-01-29 株式会社 東芝 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011086896A1 (ja) * 2010-01-15 2011-07-21 三菱電機株式会社 電力用半導体モジュール
JP5391162B2 (ja) * 2010-08-17 2014-01-15 三菱電機株式会社 電力用半導体装置
WO2013008424A1 (ja) * 2011-07-11 2013-01-17 三菱電機株式会社 電力用半導体モジュール
WO2015136603A1 (ja) * 2014-03-10 2015-09-17 株式会社日立製作所 パワー半導体モジュール及びその製造検査方法

Similar Documents

Publication Publication Date Title
EP0154998B1 (en) Improved structure of power supply wirings in semiconductor integrated circuit
JPWO2021070366A5 (https=)
JP3677346B2 (ja) 電界効果により制御可能の半導体デバイス
JPWO2024018810A5 (https=)
JPWO2022264834A5 (https=)
JPH07297188A (ja) 半導体集積回路装置
JPS61278160A (ja) 半導体集積回路用接続装置
JP2724193B2 (ja) 半導体装置
JPWO2023112735A5 (https=)
JPWO2023243418A5 (https=)
JPWO2021161526A5 (https=)
CN111463201B (zh) 显示面板
JPWO2024029274A5 (https=)
JPWO2023162722A5 (https=)
TWI914265B (zh) 功率模組
JPWO2022264851A5 (https=)
JPH07335673A (ja) 半導体装置
JPWO2022264844A5 (https=)
JPWO2023140046A5 (https=)
KR200492943Y1 (ko) 이중 브리지 접속부를 구비하는 단일층 투영형 정전용량식 터치 센서
JP2758322B2 (ja) 電子部品搭載用回路基板
TW202607924A (zh) 功率模組
JPWO2024214533A5 (https=)
TW202607921A (zh) 功率模組
JPWO2023008228A5 (https=)