JPWO2023243418A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023243418A5
JPWO2023243418A5 JP2024528691A JP2024528691A JPWO2023243418A5 JP WO2023243418 A5 JPWO2023243418 A5 JP WO2023243418A5 JP 2024528691 A JP2024528691 A JP 2024528691A JP 2024528691 A JP2024528691 A JP 2024528691A JP WO2023243418 A5 JPWO2023243418 A5 JP WO2023243418A5
Authority
JP
Japan
Prior art keywords
power
wiring portion
electrode
semiconductor device
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528691A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023243418A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/020496 external-priority patent/WO2023243418A1/ja
Publication of JPWO2023243418A1 publication Critical patent/JPWO2023243418A1/ja
Publication of JPWO2023243418A5 publication Critical patent/JPWO2023243418A5/ja
Pending legal-status Critical Current

Links

JP2024528691A 2022-06-15 2023-06-01 Pending JPWO2023243418A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022096515 2022-06-15
PCT/JP2023/020496 WO2023243418A1 (ja) 2022-06-15 2023-06-01 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023243418A1 JPWO2023243418A1 (https=) 2023-12-21
JPWO2023243418A5 true JPWO2023243418A5 (https=) 2025-02-26

Family

ID=89190922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528691A Pending JPWO2023243418A1 (https=) 2022-06-15 2023-06-01

Country Status (2)

Country Link
JP (1) JPWO2023243418A1 (https=)
WO (1) WO2023243418A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024190547A1 (ja) * 2023-03-14 2024-09-19 住友電気工業株式会社 半導体装置
JP2026010601A (ja) * 2024-07-09 2026-01-22 株式会社デンソー 半導体装置
JP2026010602A (ja) * 2024-07-09 2026-01-22 株式会社デンソー 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001339008A (ja) * 2000-03-24 2001-12-07 Ngk Spark Plug Co Ltd 配線基板
JP4613416B2 (ja) * 2000-11-28 2011-01-19 日本電気株式会社 半導体装置およびその実装方法
JP6497286B2 (ja) * 2015-09-18 2019-04-10 株式会社デンソー 半導体モジュール
WO2017183385A1 (ja) * 2016-04-21 2017-10-26 株式会社村田製作所 電源モジュール
JP2022025587A (ja) * 2020-07-29 2022-02-10 ローム株式会社 半導体装置

Similar Documents

Publication Publication Date Title
JP2018088531A5 (https=)
JP4264392B2 (ja) 曲げ強化ベースプレートを備えたパワー半導体モジュール
JPH08288456A (ja) パワー半導体モジュール
CN109511279B (zh) 电子模块
WO2016125543A1 (ja) 回路構成体
JPWO2023243418A5 (https=)
JPWO2022264834A5 (https=)
US8502484B2 (en) Power stage for driving an electric machine
JP4266814B2 (ja) 接続端子構造
JP2009081180A (ja) 回路装置
JPH08181405A (ja) プリント配線基板
JPWO2023008344A5 (https=)
JP7743905B2 (ja) 半導体装置
JPWO2023017707A5 (https=)
JPWO2021161526A5 (https=)
JPWO2024018810A5 (https=)
JPH09180891A (ja) 電子回路装置
JPWO2023017708A5 (https=)
JPWO2023140046A5 (https=)
JPWO2024029274A5 (https=)
JP7060426B2 (ja) 基板の伝熱構造
JP6732583B2 (ja) 端子取付基板
JPWO2024161996A5 (https=)
JPWO2023199808A5 (https=)
JPWO2024181110A5 (https=)