JPWO2023017708A5 - - Google Patents
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- Publication number
- JPWO2023017708A5 JPWO2023017708A5 JP2023541381A JP2023541381A JPWO2023017708A5 JP WO2023017708 A5 JPWO2023017708 A5 JP WO2023017708A5 JP 2023541381 A JP2023541381 A JP 2023541381A JP 2023541381 A JP2023541381 A JP 2023541381A JP WO2023017708 A5 JPWO2023017708 A5 JP WO2023017708A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring portion
- semiconductor device
- conductive
- semiconductor elements
- thickness direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021130765 | 2021-08-10 | ||
| PCT/JP2022/027807 WO2023017708A1 (ja) | 2021-08-10 | 2022-07-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023017708A1 JPWO2023017708A1 (https=) | 2023-02-16 |
| JPWO2023017708A5 true JPWO2023017708A5 (https=) | 2024-05-08 |
Family
ID=85200477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023541381A Pending JPWO2023017708A1 (https=) | 2021-08-10 | 2022-07-15 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240105578A1 (https=) |
| JP (1) | JPWO2023017708A1 (https=) |
| CN (1) | CN117652023A (https=) |
| DE (1) | DE112022003485T5 (https=) |
| WO (1) | WO2023017708A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024224995A1 (ja) * | 2023-04-25 | 2024-10-31 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6228490B2 (ja) * | 2014-03-04 | 2017-11-08 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JPWO2019187700A1 (ja) * | 2018-03-26 | 2021-02-12 | パナソニックＩｐマネジメント株式会社 | 半導体モジュール |
| JP7284566B2 (ja) * | 2018-10-29 | 2023-05-31 | ローム株式会社 | 半導体装置 |
| DE112021002615T5 (de) * | 2020-08-05 | 2023-03-23 | Rohm Co., Ltd. | Halbleiterbauteil |
-
2022
- 2022-07-15 JP JP2023541381A patent/JPWO2023017708A1/ja active Pending
- 2022-07-15 WO PCT/JP2022/027807 patent/WO2023017708A1/ja not_active Ceased
- 2022-07-15 DE DE112022003485.8T patent/DE112022003485T5/de active Pending
- 2022-07-15 CN CN202280048269.XA patent/CN117652023A/zh active Pending
-
2023
- 2023-12-07 US US18/532,652 patent/US20240105578A1/en active Pending
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