JPWO2023017708A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023017708A5 JPWO2023017708A5 JP2023541381A JP2023541381A JPWO2023017708A5 JP WO2023017708 A5 JPWO2023017708 A5 JP WO2023017708A5 JP 2023541381 A JP2023541381 A JP 2023541381A JP 2023541381 A JP2023541381 A JP 2023541381A JP WO2023017708 A5 JPWO2023017708 A5 JP WO2023017708A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring portion
- semiconductor device
- conductive
- semiconductor elements
- thickness direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021130765 | 2021-08-10 | ||
| PCT/JP2022/027807 WO2023017708A1 (ja) | 2021-08-10 | 2022-07-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023017708A1 JPWO2023017708A1 (https=) | 2023-02-16 |
| JPWO2023017708A5 true JPWO2023017708A5 (https=) | 2024-05-08 |
Family
ID=85200477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023541381A Pending JPWO2023017708A1 (https=) | 2021-08-10 | 2022-07-15 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240105578A1 (https=) |
| JP (1) | JPWO2023017708A1 (https=) |
| CN (1) | CN117652023A (https=) |
| DE (1) | DE112022003485T5 (https=) |
| WO (1) | WO2023017708A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112024000591T5 (de) * | 2023-04-25 | 2025-11-27 | Rohm Co., Ltd. | Halbleiterbauteil und verfahren zur herstellung des halbleiterbauteils |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6228490B2 (ja) * | 2014-03-04 | 2017-11-08 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| US20210013183A1 (en) * | 2018-03-26 | 2021-01-14 | Pansonic Intellectual Property Management Co., Ltd. | Semiconductor module |
| JP7284566B2 (ja) * | 2018-10-29 | 2023-05-31 | ローム株式会社 | 半導体装置 |
| JP7673069B2 (ja) * | 2020-08-05 | 2025-05-08 | ローム株式会社 | 半導体装置 |
-
2022
- 2022-07-15 CN CN202280048269.XA patent/CN117652023A/zh active Pending
- 2022-07-15 JP JP2023541381A patent/JPWO2023017708A1/ja active Pending
- 2022-07-15 DE DE112022003485.8T patent/DE112022003485T5/de active Pending
- 2022-07-15 WO PCT/JP2022/027807 patent/WO2023017708A1/ja not_active Ceased
-
2023
- 2023-12-07 US US18/532,652 patent/US20240105578A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7520177B2 (ja) | 半導体装置 | |
| JPWO2023243418A5 (https=) | ||
| JP3164658B2 (ja) | 電子回路装置 | |
| JP2023181544A5 (https=) | ||
| JPWO2023162722A5 (https=) | ||
| JPWO2022264834A5 (https=) | ||
| JPWO2023017708A5 (https=) | ||
| JP6517442B1 (ja) | 電子モジュール | |
| JPWO2024018810A5 (https=) | ||
| JPWO2023190334A5 (https=) | ||
| JPWO2024029274A5 (https=) | ||
| JPWO2023149257A5 (https=) | ||
| JPWO2023017707A5 (https=) | ||
| JPWO2023140001A5 (https=) | ||
| JPWO2021161526A5 (https=) | ||
| JP7743905B2 (ja) | 半導体装置 | |
| JPWO2023140046A5 (https=) | ||
| JPWO2023157604A5 (https=) | ||
| US11776937B2 (en) | Electronic module | |
| JPWO2024057847A5 (https=) | ||
| JP7264630B2 (ja) | 電子モジュール | |
| JP7018965B2 (ja) | 電子モジュール | |
| JPWO2024034359A5 (https=) | ||
| WO2024161996A1 (ja) | 半導体装置 | |
| WO2023189480A1 (ja) | 半導体素子および半導体装置 |