JPWO2023157604A5 - - Google Patents

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Publication number
JPWO2023157604A5
JPWO2023157604A5 JP2024501060A JP2024501060A JPWO2023157604A5 JP WO2023157604 A5 JPWO2023157604 A5 JP WO2023157604A5 JP 2024501060 A JP2024501060 A JP 2024501060A JP 2024501060 A JP2024501060 A JP 2024501060A JP WO2023157604 A5 JPWO2023157604 A5 JP WO2023157604A5
Authority
JP
Japan
Prior art keywords
electrode
lead
mounting surface
thickness direction
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024501060A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023157604A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/002555 external-priority patent/WO2023157604A1/ja
Publication of JPWO2023157604A1 publication Critical patent/JPWO2023157604A1/ja
Publication of JPWO2023157604A5 publication Critical patent/JPWO2023157604A5/ja
Pending legal-status Critical Current

Links

JP2024501060A 2022-02-15 2023-01-27 Pending JPWO2023157604A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022021567 2022-02-15
PCT/JP2023/002555 WO2023157604A1 (ja) 2022-02-15 2023-01-27 半導体装置および半導体装置の実装構造体

Publications (2)

Publication Number Publication Date
JPWO2023157604A1 JPWO2023157604A1 (https=) 2023-08-24
JPWO2023157604A5 true JPWO2023157604A5 (https=) 2024-10-22

Family

ID=87578390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024501060A Pending JPWO2023157604A1 (https=) 2022-02-15 2023-01-27

Country Status (3)

Country Link
US (1) US20240404941A1 (https=)
JP (1) JPWO2023157604A1 (https=)
WO (1) WO2023157604A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0148077B1 (ko) * 1994-08-16 1998-08-01 김광호 분리된 다이 패드를 갖는 반도체 패키지
JP2836602B2 (ja) * 1996-09-25 1998-12-14 日本電気株式会社 モールド型半導体装置
JP4412817B2 (ja) * 2000-06-19 2010-02-10 Ｏｋｉセミコンダクタ株式会社 樹脂封止型半導体装置
JP3450803B2 (ja) * 2000-06-22 2003-09-29 株式会社東芝 樹脂封止型半導体装置
JP2007157862A (ja) * 2005-12-02 2007-06-21 Fuji Electric Device Technology Co Ltd 半導体装置
JP2015097237A (ja) * 2013-11-15 2015-05-21 住友電気工業株式会社 半導体装置

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