JPWO2022264833A5 - - Google Patents
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- Publication number
- JPWO2022264833A5 JPWO2022264833A5 JP2023529778A JP2023529778A JPWO2022264833A5 JP WO2022264833 A5 JPWO2022264833 A5 JP WO2022264833A5 JP 2023529778 A JP2023529778 A JP 2023529778A JP 2023529778 A JP2023529778 A JP 2023529778A JP WO2022264833 A5 JPWO2022264833 A5 JP WO2022264833A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive plate
- back surface
- thickness direction
- semiconductor device
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021098928 | 2021-06-14 | ||
| PCT/JP2022/022583 WO2022264833A1 (ja) | 2021-06-14 | 2022-06-03 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022264833A1 JPWO2022264833A1 (https=) | 2022-12-22 |
| JPWO2022264833A5 true JPWO2022264833A5 (https=) | 2025-06-03 |
Family
ID=84526433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529778A Pending JPWO2022264833A1 (https=) | 2021-06-14 | 2022-06-03 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240055332A1 (https=) |
| JP (1) | JPWO2022264833A1 (https=) |
| CN (1) | CN117480605A (https=) |
| DE (1) | DE112022002614T5 (https=) |
| WO (1) | WO2022264833A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5126278B2 (ja) * | 2010-02-04 | 2013-01-23 | 株式会社デンソー | 半導体装置およびその製造方法 |
| JP5434986B2 (ja) * | 2011-08-10 | 2014-03-05 | 株式会社デンソー | 半導体モジュールおよびそれを備えた半導体装置 |
| JP2016039206A (ja) * | 2014-08-06 | 2016-03-22 | トヨタ自動車株式会社 | 半導体装置の製造方法及び同半導体装置 |
| JP6269417B2 (ja) * | 2014-09-26 | 2018-01-31 | 三菱電機株式会社 | 半導体装置 |
| JP6439750B2 (ja) * | 2016-05-20 | 2018-12-19 | 株式会社デンソー | 半導体装置 |
| JP6922450B2 (ja) * | 2017-06-08 | 2021-08-18 | 株式会社デンソー | 半導体モジュール |
| JP2019021864A (ja) * | 2017-07-21 | 2019-02-07 | 国立研究開発法人産業技術総合研究所 | パワーモジュール |
| JP7144112B2 (ja) | 2018-09-19 | 2022-09-29 | ローム株式会社 | 半導体装置 |
| JP7147668B2 (ja) * | 2019-04-05 | 2022-10-05 | 株式会社デンソー | 半導体装置 |
| JP7443359B2 (ja) * | 2019-05-24 | 2024-03-05 | ローム株式会社 | 半導体装置 |
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2022
- 2022-06-03 DE DE112022002614.6T patent/DE112022002614T5/de not_active Withdrawn
- 2022-06-03 JP JP2023529778A patent/JPWO2022264833A1/ja active Pending
- 2022-06-03 WO PCT/JP2022/022583 patent/WO2022264833A1/ja not_active Ceased
- 2022-06-03 CN CN202280042536.2A patent/CN117480605A/zh active Pending
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2023
- 2023-10-24 US US18/493,353 patent/US20240055332A1/en active Pending